Patent application number | Description | Published |
20090107704 | COMPOSITE SUBSTRATE - A composite substrate is disclosed. In one aspect, the substrate has a stretchable and/or flexible material. The substrate may further have patterned features embedded in the stretchable and/or flexible material. The patterned features have one or more patterned conducting layers. | 04-30-2009 |
20090317639 | METHOD FOR MANUFACTURING A STRETCHABLE ELECTRONIC DEVICE - A method for manufacturing a stretchable electronic device is disclosed. In one aspect, the device comprises at least one electrically conductive channel connecting at least two components of the device. The method comprises forming the channel by laser-cutting a flexible substrate into a predetermined geometric shape. | 12-24-2009 |
20100075056 | METHOD OF FABRICATING A POROUS ELASTOMER - A method is provided for fabricating a porous elastomer, the method comprising the steps of: providing a predetermined amount of a liquid elastomer and a predetermined amount of a porogen; mixing the liquid elastomer and the porogen in vacuum until a homogenous emulsion without phase separation is formed; curing the homogenous emulsion until polymerizations of the emulsion is reached, thereby forming a cured emulsion; and removing the porogen from the cured emulsion. The method can advantageously be used for forming biocompatible porous elastomers and biocompatible porous membranes. | 03-25-2010 |
20110037179 | SEMICONDUCTOR PACKAGE - A semiconductor package is disclosed. In one aspect, the package includes a base frame and a wiring substrate mounted on the base frame. The base frame has two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate has electric wiring tracks providing the electric connection between first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures. | 02-17-2011 |
Patent application number | Description | Published |
20090216164 | ORTHOSIS FOR CORRECTING THE POSITION OF A BODY JOINT - An orthosis including arms held in place on body parts by a respective fastening member and interconnected by a pivot joint adjacent to a body joint. For bending of the body parts required during normal movement, the pivot joint is formed by a central adjusting ring bordered by both arms. One arm includes an axle ring which is coaxial to the adjusting ring. The other arm includes a ring bearing, which is eccentric to the axle ring. The ring bearing is pivotable with respect to a rotational plane of the axle ring by rotating the adjusting ring in such a way and at such an angle that the arm, supported by the ring bearing in conjunction with the body part retained by it, assumes a pivoting position of this body part depending on the rotation angle of the adjusting ring in relation to the arm connected to the axle ring. | 08-27-2009 |
20090260257 | Inlay Sole for Shoes - The invention relates to an inlay sole for shoes, consisting of sole parts of different Shore hardness, wherein, at abutting edges, the width of which abutting edges corresponds to the thickness of the sole parts, said sole parts are interlocked with each other in sinuously conjoining manner by means of projections and matching recesses, such that the projections form extensions that engage undercuts in the recesses, the inlay sole consisting of a plurality of layers of thus assembled sole parts. The respective abutting edges are offset with respect to each other from layer to layer. | 10-22-2009 |