Patent application number | Description | Published |
20150101835 | Percussion Unit - Percussion unit, especially for a rotary hammer and/or percussion hammer, comprising a control unit which is designed for controlling a pneumatic percussion mechanism. According to the disclosure, the control unit comprises at least one load estimation device. | 04-16-2015 |
20150129248 | Percussion Unit - A percussion unit for a rotary hammer and/or percussion hammer includes a control unit that is configured for open-loop and/or closed loop control of a pneumatic percussion mechanism. In at least one operating state in which the control unit changes from an idle mode to a percussion mode, the control unit is configured to adjust at least one operating parameter temporarily to a starting value. | 05-14-2015 |
20150136433 | Percussion Unit - Percussion unit, especially for a rotary hammer and/or percussion hammer, comprising a control unit which is designed for open-loop and/or closed loop control of a pneumatic percussion mechanism, and at least one operating condition sensor unit. According to the disclosure, the control unit is designed to detect at least one percussion mechanism parameter depending on measurement values of the operating condition sensor unit. | 05-21-2015 |
20150158166 | Pneumatic Percussion Mechanism Apparatus - A pneumatic percussion mechanism apparatus, in particular for a rotary and/or percussion hammer, includes a striker mounted so as to be movable in a percussion direction in a guide tube, and at least one venting unit which is configured to influence a movement of the striker. The venting unit has a setting unit configured to set a percussion intensity, and is further configured to influence, during a percussion operation, a venting of a percussion space adjoining the striker in the percussion direction in the guide tube. | 06-11-2015 |
Patent application number | Description | Published |
20130180417 | Crop parameter dependent bale chamber configuration adaptation - A baler having a bale chamber comprising chamber doors pivotably connected to a fixed frame part. Upon obtaining at least one crop parameter, a door angle value between two side sections of a door is selected; and the position of one of the side sections with respect to the other one is adapted in accordance with the selected door angle value. A corresponding baler and a control system for such baler are also provided. | 07-18-2013 |
20140202342 | Agricultural Baler with Bale Chute - An agricultural baler having an hydraulic actuator and accumulator being interconnected such that the upward force of the hydraulic actuator on a bale chute in a first position of the bale chute is smaller than the downward force generated by the combined weight of the bale chute and a completed bale on the bale chute but in a second position of the bale chute is larger than the downward force generated by the weight of the bale chute to cause a completed bale to slide under the action of gravity along the bale chute and to fall onto the field from a trailing end of the bale chute. | 07-24-2014 |
20140237982 | Reversing Mechanism and Conveying Means and Agricultural Baler Provided Therewith - Reversing mechanism for an agricultural baler wherein the reversing mechanism comprises a driving pulley mounted for rotation together with the conveying elements provided to be connected to the axis such that the axis and the conveying elements can be rotated along the working direction by a driving belt engaging the driving pulley. | 08-28-2014 |
20140250855 | Pick-up With Movable Windguard - A pick-up assembly having a pick-up drum, rotatably mounted to a frame; a windguard, attached to a support linkage which is pivotably mounted to the frame; at least one winch drum, rotatably attached with respect to the frame; and at least one flexible elongate element having opposite first and second end regions. The first end region is attached to the support linkage and the second end region is windably attached to the at least one winch drum. | 09-11-2014 |
20140366752 | Combined Packer and Stuffer Means. - An agricultural baler of the rectangular type has a feeder of which the movement is directly derived from and synchronized with the movement of the reciprocating plunger. | 12-18-2014 |
20150135639 | ROUND BALER WITH A BRAKE SYSTEM - A system for controlling a braking mechanism for a supply roll with wrapping material for a round baler that passes through a first phase wherein, after detection of sufficient crop material in the baling chamber, wrapping material is brought up to the baling chamber and introduced into the baling chamber. The braking mechanism provides a higher braking force during the wrapping operation than the first phase. The wrapping operation is started on detection of movement in the wrapping material. This prevents the braking mechanism from being activated prematurely and leaves sufficient time to deactivate the braking mechanism after the wrapping operation. | 05-21-2015 |
Patent application number | Description | Published |
20100264156 | Food Packaging with Lid and Closure System for Packaging - Packaging ( | 10-21-2010 |
20100308065 | PACKAGE FOR FOOD PRODUCT TAKEN OUT WITH A MEASURING DEVICE - A package for a food product sampled using a metering device, including a receptacle ( | 12-09-2010 |
20110006066 | LOCKING DEVICE FOR RECLOSABLE PACKAGE - Package including a receptacle ( | 01-13-2011 |
20110030846 | DISTRIBUTION AND DOSING DEVICE FOR A POWDERY FOOD PRODUCT - Distribution device for a powdery food product comprising a stand ( | 02-10-2011 |
20110192847 | Food Packing with a Closing Lid - Packaging comprising a container with an upper opening ( | 08-11-2011 |
20120248132 | FOOD PACKAGING WITH A LID AND CLOSURE SYSTEM FOR PACKAGING - The packaging for a food product is provided with a container having an upper opening. An annular frame that is mounted as a close fit on the container has an upper face provided with an annular projection extending in the continuation of the interior face of the frame. A lid mounted articulated with respect to the frame is adapted to close off the opening, the lid having a top wall, a side wall and an interior skirt, a continuous groove being defined between the side wall and the interior skirt. A measuring utensil with a bowl is stored between the opening of the container and the lid in the closed position. The annular projection is inserted into the continuous groove and the interior skirt presses at least partially against said interior face of the frame in the closed position of the lid. | 10-04-2012 |
20120261301 | FOOD PACKAGING WITH A LID AND CLOSURE SYSTEM FOR PACKAGING - The packaging for a food product is provided with a container having an opening delimited by a frame, the frame having a radially inner side wall, and a lid. The lid can move between an open position and a closed position in which it closes off the opening. A measuring utensil with a bowl can be positioned in the plane of the frame. The inner side wall of the frame is provided with a retaining member which has a base extending from the frame towards the central axis of the container and that is extended by a tab extending upwards some distance from the inner side wall. The retaining member delimits, with the inner side wall, a slot-like housing capable with a small amount of clearance of accommodating a wall portion of the bowl. | 10-18-2012 |
Patent application number | Description | Published |
20090242126 | EDGE ETCHING APPARATUS FOR ETCHING THE EDGE OF A SILICON WAFER - The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer. | 10-01-2009 |
20120025353 | Semiconductor And Solar Wafers - A silicon-on-insulator or bonded wafer includes an upper portion having a trapezoid shape in cross-section and a lower portion having an outer peripheral edge having a curved shape. | 02-02-2012 |
20120028555 | Grinding Tool For Trapezoid Grinding Of A Wafer - A grinding tool for trapezoid grinding of a wafer on a profiling machine includes an annular wheel including a central hole adapted for mounting the wheel on a spindle. The wheel includes at least two grooves disposed at an outer edge of the wheel and the grooves are sized for receiving an outer edge of the wafer. At least one of the grooves is adapted for rough grinding of the wafer. At least one other of the grooves is adapted for fine grinding of the wafer. | 02-02-2012 |
20140357161 | CENTER FLEX SINGLE SIDE POLISHING HEAD - A polishing head assembly for single side polishing of silicon wafers includes a polishing head and a cap. The polishing head includes a top surface and a bottom surface and defines a longitudinal axis extending therethrough. The cap is positioned coaxially with the polishing head and includes an upper surface and a lower surface. The upper surface is spaced from the bottom surface of the polishing head to form a chamber that allows the cap to deflect toward the polishing head. | 12-04-2014 |
20160101502 | CENTER FLEX SINGLE SIDE POLISHING HEAD HAVING RECESS AND CAP - A polishing head assembly for single side polishing of silicon wafers is provided. The polishing head assembly includes a polishing head and a cap. The polishing head has a recess along a bottom portion, the recess having a recessed surface. The cap is positioned within the recess, and has an annular wall and a floor extending across the annular wall. The floor is spaced from the recessed surface to form a chamber therebetween. The chamber is configured to be pressurized for deflecting the floor. The annular wall is attached to the polishing head with an adhesive. | 04-14-2016 |
Patent application number | Description | Published |
20090246444 | EDGE ETCHED SILICON WAFERS - The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer. | 10-01-2009 |
20090247055 | METHODS FOR ETCHING THE EDGE OF A SILICON WAFER - The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer. | 10-01-2009 |
20100087123 | Method For Assessing Workpiece Nanotopology Using A Double Side Wafer Grinder - A method of processing a semiconductor wafer using a double side grinder of the type that holds the wafer in a plane with a pair of grinding wheels and a pair of hydrostatic pads. The method includes measuring a distance between the wafer and at least one sensor and determining wafer nanotopology using the measured distance. The determining includes using a processor to perform a finite element structural analysis of the wafer based on the measured distance. | 04-08-2010 |
20110045740 | Methods and Systems For Adjusting Operation Of A Wafer Grinder Using Feedback from Warp Data - Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter. | 02-24-2011 |
20110101504 | Methods of Grinding Semiconductor Wafers Having Improved Nanotopology - Methods for holding a workpiece with a hydrostatic pad are disclosed herein. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels. | 05-05-2011 |
20110237160 | Hydrostatic Pad Pressure Modulation in a Simultaneous Double Side Wafer Grinder - Systems and methods are disclosed for modulating the hydrostatic pressure in a double side wafer grinder having a pair of grinding wheels. The systems and methods use a processor to measure the amount of electrical current drawn by the grinding wheels. Pattern detection software is used to predict a grinding stage based on the measured electrical current. The hydrostatic pressure is changed by flow control valves at each stage to change the clamping pressure applied to the wafer and to thereby improve nanotopology in the processed wafer. | 09-29-2011 |
20120028439 | Semiconductor And Solar Wafers And Method For Processing Same - A method for manufacturing a silicon-on-insulator structure including a substrate wafer, an active wafer, and an oxide layer between the substrate wafer and the active wafer. The method includes the steps of heat treating the structure, trapezoid grinding edges of the wafer, and grinding a surface of the wafer. | 02-02-2012 |
20130139800 | Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw - Methods are disclosed for controlling surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 06-06-2013 |
20130139801 | Methods For Controlling Displacement Of Bearings In A Wire Saw - Methods are disclosed for controlling the displacement of bearings in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by controlling displacement of bearings in the wire saw by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 06-06-2013 |
20130144420 | Systems For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw - Systems are disclosed for controlling the surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 06-06-2013 |
20130144421 | Systems For Controlling Temperature Of Bearings In A Wire Saw - Systems and are disclosed for controlling the temperature of bearings in a wire saw machine. The systems described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by controlling the temperature of bearings in the wire saw by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 06-06-2013 |
20130174828 | Systems and Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw - Systems and methods are disclosed for controlling the surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid that comes in contact with the ingot. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology. | 07-11-2013 |
20130174829 | Methods For Mounting An Ingot On A Wire Saw - Methods are disclosed for determining mounting locations of ingots on a wire saw machine. The methods include measuring a test surface of a test wafer previously sliced by the wire saw machine from a test ingot to calibrate the system. A magnitude and a direction of an irregularity of the measured test surface of the test wafer is then determined. The mounting location is then determined for another ingot to be mounted on the ingot holder based on at least one of the magnitude and direction of the irregularity of the measured test surface of the test wafer. | 07-11-2013 |
20130206163 | Methods and Systems For Removing Contaminants From A Wire Of A Saw - A system for ultrasonically cleaning one or more wires of a wire saw for slicing semiconductor or solar material into wafers. The system includes an ultrasonic transducer connected to a sonotrode. The system also includes a sonotrode plate adjacent to one or more of the wires. The sonotrode plate has an opening that exposes the sonotrode to one or more of the wires. The system further includes a tank for delivering a flow of liquid to contact the sonotrode and one or more of the wires. The tank is positioned on the same side of the wires as the sonotrode plate. The ultrasonic transducer is configured to vibrate and form cavitations in the liquid for the removal of contaminants from a surface of one or more of the wires. | 08-15-2013 |
20150371909 | METHODS FOR POST-EPITAXIAL WARP PREDICTION AND CONTROL - In one aspect, a method of predicting warp in a plurality of wafers after an epitaxial layer deposition process is provided. The method includes receiving, by a processor, a measured resistivity of a first wafer of the plurality of wafers, receiving, by the processor, a measured shape of the first wafer after at least one of a grinding process and an etching process, and calculating, using the processor, a change in wafer shape during the epitaxial layer deposition process. The method further includes superposing, using the processor, the calculated shape change onto the measured shape of the first wafer to determine a post-epitaxial wafer shape and calculating, using the processor, a post-epitaxial warp value based on the determined post-epitaxial wafer shape. | 12-24-2015 |
Patent application number | Description | Published |
20120270571 | ANNOTATING ELECTRONIC DATA WITH GEOGRAPHIC LOCATIONS - Embodiments of the present invention provide an approach for annotating electronic data with geographic locations. Specifically, a first geographic location of a device (e.g., a camera, a cellular/smart phone, etc.) can be determined using technology such as GPS technology, a wireless Internet signal, and/or a cellular signal. Then, a motion detector associated with the device (e.g., integrated with the device, carried by a user of the device, etc.) will determine a positional difference of the device from the first geographic location (e.g., by detecting a series of movements of the device from the first geographic location). Based on the first geographic location and the positional difference, a second geographic location will be determined/computed. Thereafter, a set of electronic data available to the device (e.g., on the device's internal memory, on a removable memory card inserted into the device, etc.) can be annotated/tagged with the second geographic location. In one embodiment, the second geographic location may only be annotated to the electronic data that was captured/received at the second geographic location. | 10-25-2012 |