Patent application number | Description | Published |
20080297181 | Measuring Bridge Arrangement, Method of Testing a Measuring Bridge, Test Arrangement for Testing a Measuring Bridge, Method of Producing a Tested Measuring Bridge Arrangement, and Computer Program - A measuring bridge arrangement has a measuring bridge with a first supply terminal and first and second measuring signal terminals. The measuring bridge arrangement has a working point adjustment circuit formed to feed the measuring bridge via at least the first supply terminal in a measuring state of operation, and to apply a signal to one of the measuring signal terminals in the test state of operation in order to bring the measuring bridge to a test working point different from a measuring working point in the measuring state of operation. The measuring bridge has a test tap, wherein a test signal dependent on resistive properties of at least one element of the measuring bridge can be tapped at the test tap of the measuring bridge. | 12-04-2008 |
20080297955 | SENSOR TEMPERATURE COMPENSATION - A device includes a pair of individual sensors spaced apart from each other. A current source provides current to both of the individual sensors. A differential temperature sensor is coupled thermally proximate the individual sensors and provides a temperature difference signal that is combined with current from the current source to provide a correction factor for a temperature gradient across the individual sensors. Alternatively, temperature responsive excitation sources may be positioned thermally proximate the sensors to provide temperature compensation. | 12-04-2008 |
20080308886 | Semiconductor Sensor - This application relates to a semiconductor sensor comprising a carrier that comprises a first surface and a second surface; a sensor chip attached to the first surface; attachment means on the second surface; and mould material applied over the sensor chip and the attachment means. | 12-18-2008 |
20090001965 | Magnetic-Field Sensor and Method of Calibrating a Magnetic-Field Sensor - An embodiment of a magnetic-field sensor has a plurality of sensor elements connected to form measurement arrangements, each measurement arrangement having a measurement tap, and a control circuit formed to perform an embodiment of a method of calibrating the magnetic-field sensor. | 01-01-2009 |
20090001982 | Method and Apparatus for Defined Magnetizing of Permanently Magnetizable Elements and Magnetoresistive Sensor Structures - A method of magnetizing a permanently magnetizable element associated with a magnetic field sensor structure includes generating a test magnetic field penetrating the magnetic field sensor structure and the permanently magnetizable element, detecting the magnetic field and providing a test signal based on a magnetic field through the magnetic field sensor structure, aligning the test magnetic field and the magnetic field sensor structure with the permanently magnetizable element to each other, until the test signal reaches a set value corresponding to a predetermined magnetized field distribution with respect to the magnetic field sensor structure, and generating a magnetizing field for permanently magnetizing the element to be permanently magnetized, wherein the magnetizing field corresponds to the predetermined magnetic field distribution within a tolerance range. | 01-01-2009 |
20090066465 | MAGNETIC CORE FOR TESTING MAGNETIC SENSORS - A magnetic core for testing a magnetic sensor includes a base portion, and first, second, and third legs extending from the base portion. At least one coil generates magnetic flux through the magnetic core and into the magnetic sensor. The base portion and the first, second, and third legs are formed as a single piece without bonding joints therebetween. | 03-12-2009 |
20090073773 | MEMORY CIRCUIT, DRIVE CIRCUIT FOR A MEMORY AND METHOD FOR WRITING WRITE DATA INTO A MEMORY - A first and second non-volatile memory transistor each have a floating gate electrode and a gate terminal. A first switch is connected between a first drain terminal and a bit line for reading out information, and a second switch is connected between a second drain terminal and the bit line. The first and second switch are designed to selectively couple the first or second drain terminal to the bit line during readout. A drive circuit is designed to write data into one of the transistors and to apply equal signals to the gate terminals of the first and second transistors based on the data, to apply a programming signal at a source terminal of the transistor to be written to and to drive a source terminal of a transistor not to be written to such that a state stored in the transistor not to be written to is not changed. | 03-19-2009 |
20090091344 | MAGNETIC SENSOR INTEGRATED CIRCUIT WITH TEST CONDUCTOR - A magnetic sensor integrated circuit includes a plurality of magnetically sensitive elements, and at least one test conductor positioned adjacent to at least one of the magnetically sensitive elements and configured to generate a differential magnetic field that is adapted to be applied to the plurality of magnetically sensitive elements during a test mode. | 04-09-2009 |
20090108839 | INTEGRATED CIRCUIT WITH STRESS SENSING ELEMENT - An integrated circuit includes a semiconductor die, and a stress sensing element. The stress sensing element comprises a first lateral resistor and a first vertical resistor. The stress sensing element is formed in the semiconductor die and is configured to indicate a level of at least one stress component within the semiconductor die. | 04-30-2009 |
20090140725 | INTEGRATED CIRCUIT INCLUDING SENSOR HAVING INJECTION MOLDED MAGNETIC MATERIAL - An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor. | 06-04-2009 |
20090146647 | SYSTEM INCLUDING SENSING ELEMENTS AT DIFFERENT DISTANCES FROM VERTICAL MAGNETIC FIELD LINES - A system including a magnet, a first magneto-resistive sensing element, and a second magneto-resistive sensing element. The magnet is configured to provide a magnetic field. The first magneto-resistive sensing element is situated in the magnetic field and the second magneto-resistive sensing element is situated in the magnetic field. The second magneto-resistive sensing element is laterally a greater distance from vertical magnetic field lines of the magnetic field than the first magneto-resistive sensing element. | 06-11-2009 |
20090167301 | INTEGRATED CIRCUIT INCLUDING A MAGNETIC FIELD SENSITIVE ELEMENT AND A COIL - An integrated circuit includes a die and a first magnetic field sensitive element formed on the die. The integrated circuit includes a first coil formed on the die and around the first magnetic field sensitive element. | 07-02-2009 |
20090256559 | HALL EFFECT DEVICE AND METHOD - A semiconductor device including a Hall effect sensor and related method. The Hall effect device includes a substrate having a first conductivity type and an epitaxial layer having a second conductivity type defining a Hall effect portion. A conductive buried layer having the second conductivity type is situated between the epitaxial layer and the substrate. First and second output terminals and first and second voltage terminals are provided, with the second voltage terminal being coupled to the conductive buried layer. | 10-15-2009 |
20090322325 | Magnetic-Field Sensor - An embodiment of a magnetic-field sensor includes a magnetic-field sensor arrangement and a magnetic body which has, for example, a non-convex cross-sectional area with regard to a cross-sectional plane running through the magnetic body, the magnetic body having an inhomogeneous magnetization. | 12-31-2009 |
20100007339 | INTEGRATED SENSOR AND MAGNETIC FIELD CONCENTRATOR DEVICES - Embodiments of the invention are related to integrated sensor and magnetic concentrator devices and methods. In one embodiment, an integrated circuit comprises a sensor device and a magnetic field concentrator. The sensor device comprises a first sensor element, a second sensor element, and a third sensor element, the first sensor element spaced apart from the third sensor element by a first gap, and the second sensor element spaced apart from the third sensor element by a second gap. The magnetic field concentrator comprises a first magnetic element disposed in the first gap and a second magnetic element disposed in the second gap. | 01-14-2010 |
20100060263 | OFF-CENTER ANGLE MEASUREMENT SYSTEM - An angle measurement system including a magnet coupled to a rotating member and adapted to provide a magnetic field which rotates with the rotating member about a rotational axis of the rotating member, and an integrated circuit angle sensor disposed within the magnetic field at a radially off-center position from the rotational axis. The integrated circuit angle sensor includes first and second bridges of magneto resistive elements configured to respectively provide first and second signals representative of substantially orthogonal first and second directional components of the magnetic field and together representative of an angular position of the rotating member, and a set of adjustment parameters for adjusting attributes of the first and second signals having values selected to minimize errors in the first and second signals. | 03-11-2010 |
20100072988 | SYSTEM THAT OBTAINS A SWITCHING POINT WITH THE ENCODER IN A STATIC POSITION - A system including an encoder, multiple sensing elements and control logic. The encoder has a pole pitch and is configured to rotate in a direction of rotation. The multiple sensing elements are situated along the direction of rotation and span at least half the length of the pole pitch. The control logic is configured to receive signals from the multiple sensing elements based on the encoder in a static position and obtain a switching point based on the signals. | 03-25-2010 |
20100156394 | MAGNETIC FIELD CURRENT SENSORS - Embodiments related to magnetic current sensors, systems and methods. In an embodiment, a magnetic current sensor integrated in an integrated circuit (IC) and housed in an IC package comprises an IC die formed to present at least three magnetic sense elements on a first surface, a conductor, and at least one slot formed in the conductor, wherein a first end of the at least one slot and at least one of the magnetic sense elements are relatively positioned such that the at least one of the magnetic sense elements is configured to sense an increased magnetic field induced in the conductor proximate the first end of the at least one slot. | 06-24-2010 |
20100176799 | SENSOR INCLUDING TWO CODE RINGS AND A MAGNETIC FIELD SENSOR BETWEEN THE CODE RINGS - An apparatus includes a shaft and a first code ring including a first number of pole pairs. The first code ring is attached to the shaft. The apparatus includes a second code ring including a second number of pole pairs different from the first number. The second code ring is attached to the shaft and spaced apart from the first code ring. The apparatus includes a first magnetic field sensor between the first code ring and the second code ring for sensing a first superposition of magnetic fields provided by the first code ring and the second code ring. | 07-15-2010 |
20100176803 | ANGLE SENSOR WITH FLUX GUIDES, ROTATABLE MAGNET AND MAGNETIC SENSOR - An angle sensor includes first and second flux guides situated in a spaced relationship to define first and second flux guide air gaps therebetween. The first and second flux guides define a central opening, with a magnet situated in the central opening. The magnet is diametrically magnetized and is rotatable relative to the flux guides. A magnetic sensor situated in one of the flux guide air gaps, and is configured to output signals in response to received magnetic flux density. | 07-15-2010 |
20100176804 | ANGLE SENSOR - An angle sensor includes a ring magnet adapted to be attached to a rotatable shaft. The ring magnet has an axis of rotation and an inner radius and an outer radius extending from the axis of rotation to define an annulus. A first magnetic sensor is situated proximate the ring magnet to measure magnetic field lines within the annulus, and a second magnetic sensor is situated proximate the ring magnet to measure magnetic field lines outside the annulus. | 07-15-2010 |
20110101964 | Magnetic Encoder Element for Position Measurement - A magnetic encoder element for use in a position measurement system including a magnetic field sensor for measuring position along a first direction is disclosed. The encoder element includes at least one first track that includes a material providing a magnetic pattern along the first direction, the magnetic pattern being formed by a remanent magnetization vector that has a variable magnitude dependent on a position along the first direction. The gradient of the remanent magnetization vector is such that a resulting magnetic field in a corridor above the first track and at a predefined distance above the plane includes a field component perpendicular to the first direction that does not change its sign along the first direction. | 05-05-2011 |
20110187350 | Magnetic-Field Sensor and Method of Calibrating a Magnetic-Field Sensor - An embodiment of a magnetic-field sensor has a plurality of sensor elements connected to form measurement arrangements, each measurement arrangement having a measurement tap, and a control circuit formed to perform an embodiment of a method of calibrating the magnetic-field sensor. | 08-04-2011 |
20110193557 | CURRENT SENSOR INCLUDING A SINTERED METAL LAYER - An integrated circuit includes a semiconductor die including a first magnetic field sensor. The integrated circuit includes an isolation material layer over the first magnetic field sensor and a sintered metal layer over the isolation material layer. The first magnetic field sensor is configured to sense a magnetic field generated by a current passing through the sintered metal layer. | 08-11-2011 |
20110199132 | SYSTEM PROVIDING A SWITCHED OUTPUT SIGNAL AND A HIGH RESOLUTION OUTPUT SIGNAL - A system including a sensing system, a first chopped circuit, a second chopped circuit, and a clock generator. The sensing system is configured to provide sensed input signals. The first chopped circuit is configured to provide a switched output signal that switches in response to values of the sensed input signals crossing a limit. The second chopped circuit is configured to provide a high resolution output signal that corresponds to the sensed input signals and has a higher resolution than the switched output signal. The clock generator is configured to provide clock signals that synchronize chopping of the first chopped circuit and the second chopped circuit. | 08-18-2011 |
20110204887 | CURRENT SENSORS AND METHODS - Embodiments relate to current sensors and methods. In an embodiment, a current sensor comprises a conductor portion having a first portion and a second portion; at least three slots formed in the conductor portion between the first and second portions, each of the at least three slots having a length and at least one tip portion; at least two bridge portions each having a width separating two of the at least three slots and a length coupling the first and second portions; a first contact region disposed relative to the first portion and a second contact region disposed relative to the second portion; and at least one pair of magnetic sensor elements, a first pair of magnetic sensor elements arranged relative to and spaced apart from a first of the at least two bridge portions. | 08-25-2011 |
20110209556 | STRESS SENSING DEVICES AND METHODS - Embodiments relate to stress sensing devices and methods. In an embodiment, a sensor device includes an active layer; and at least three contacts spaced apart from one another in the active layer, the at least three contacts being coupleable in a first configuration for a first operating mode of the sensor device in which a current in the active layer has a first ratio of horizontal to vertical components with respect to a die surface and in a second configuration different from the first for a second operating mode of the sensor device in which a current in the active layer has a second ratio of horizontal to vertical components, wherein a ratio of a resistance between at least two of the contacts in the first operating mode and a resistance between at least two of the contacts in the second operating mode is related to mechanical stress in the sensor device. | 09-01-2011 |
20110210727 | INTEGRATED SENSOR AND MAGNETIC FIELD CONCENTRATOR DEVICES - Embodiments relate to integrated sensor and magnetic concentrator devices and methods. In one embodiment, an integrated sensor and magnetic field concentrator device comprises a sensor device comprising at least two xMR sensor elements spaced apart from each other on a surface of a die to define a first gap of about 5 millimeters (mm) or less; and a magnetic field concentrator disposed in the first gap and configured to guide magnetic flux from an external source in a direction perpendicular to the at least two xMR sensor elements. | 09-01-2011 |
20110215955 | SYSTEM INCLUDING FEEDBACK CIRCUIT WITH DIGITAL CHOPPING CIRCUIT - A system including a first circuit, a second circuit, and a feedback circuit. The first circuit is configured to provide input signals. The second circuit is configured to receive the input signals and provide digital output signals that correspond to the input signals. The feedback circuit includes a chopping circuit, an integrator circuit, and a digital to analog converter circuit. The chopping circuit is configured to receive the digital output signals and provide error signals that represent ripple error in the digital output signals. The integrator circuit is configured to accumulate the error signals and provide an accumulated error signal. The digital to analog converter circuit is configured to convert the accumulated error signal into an analog signal that is received by the second circuit to reduce the ripple error. | 09-08-2011 |
20110234215 | Sensor Package and Method for Producing a Sensor Package - Some embodiments herein relate to a sensor package. The sensor package includes a printed circuit board with a laminar current conductor arranged on a first main surface of the printed circuit board. The sensor package also includes a sensor chip adapted to measure a current flowing through the laminar current conductor, wherein the sensor chip comprises a magnetic field sensor. The sensor chip is electrically insulated from the current conductor by the printed circuit board, and is arranged on a second main surface of the printed circuit board opposite to the first main surface. The sensor chip is hermetically sealed between the mold material and the printed circuit board, or is arranged in the printed circuit board and hermetically sealed by the printed circuit board. | 09-29-2011 |
20110248711 | MAGNETIC FIELD CURRENT SENSORS - Current sensors, conductors and methods are disclosed. A magnetic current sensor includes a conductor including a first sheet metal layer having a first thickness and including at least one notch extending inwardly from a first edge of the first sheet metal layer, and a second sheet metal layer having a second thickness less than the first thickness and including at least one notch, the second sheet metal layer being coupled to the first sheet metal layer such that the at least one notch of the first sheet metal layer is generally aligned with the at least one notch of the second sheet metal layer; and an integrated circuit (IC) die including at least one magnetic sensor element and being coupled to the conductor such that the at least one magnetic sensor element is generally aligned with a tip of the at least one notch of the second sheet metal layer. | 10-13-2011 |
20110270553 | Apparatus, Sensor Circuit, and Method for Operating an Apparatus or a Sensor Circuit - An apparatus is described, including: a signal processing circuit adapted to process an input signal to obtain an output signal; a sensor element for sensing a predetermined physical quantity, wherein the sensor element is adapted to generate a sensor signal in response to the predetermined physical quantity; wherein the signal processing unit is adapted to process the input signal to obtain the output signal depending on the sensor signal; and wherein the apparatus further comprises an evaluation circuit adapted to evaluate the sensor signal and to generate an indication signal indicating an abnormal operating condition in case the sensor signal does not fulfill a predetermined normal operation criterion. | 11-03-2011 |
20110298454 | Current Sensor - A current sensor includes a conductive element, at least two magnetic field sensors arranged on the conductive element and adapted to sense a magnetic field generated by a current through the conductor element. The at least two magnetic field sensors are arranged on opposite sides of a line perpendicular to a current flow direction in the conductive element, an insulating layer is arranged between the conductive element and the magnetic field sensors, and a conductor trace is connected to the magnetic field sensors. | 12-08-2011 |
20110304327 | MAGNETIC FIELD CURRENT SENSORS - Magnetic field current sensing devices, systems and methods are disclosed. In an embodiment, a current sensor includes a semiconductor die; an isolation layer disposed on the semiconductor die; at least one anchor pad disposed on the isolation layer; a current input and a current output galvanically isolated from the semiconductor die; at least one bond wire coupled to the current input and the current output, a longitudinal portion of the at least one bond wire disposed between the current input and the current output being stitched to the at least one anchor pad; and at least one sensor element arranged to sense a magnetic field induced by a current flowing in the at least one bond wire. | 12-15-2011 |
20110316533 | GMR SENSORS HAVING REDUCED AMR EFFECTS - Embodiments related to giant magneto resistance (GMR) angle sensor layouts having reduced anisotropic magneto resistance (AMR) effects. Embodiments provide GMR angle sensor layouts that reduce or eliminate distortion related to AMR effects, can be more easily scaled up or down, and are more compact to use available surface area more efficiently. | 12-29-2011 |
20120025808 | OFF-CENTER ANGLE MEASUREMENT SYSTEM - A method for measuring an angular position of a rotating shaft, the method including providing a magnetic field which rotates with the shaft about an axis of rotation, positioning an integrated circuit having first and second magnetic sensing bridges within the magnetic field at a radially off-center position from the axis of rotation, the first and second magnetic sensing bridges respectively providing first and second signals representative of first and second magnetic field directions, the integrated circuit having a set of adjustment parameters for modifying attributes of the first and second signals, modifying values of the set of adjustment parameters until errors in the first and second signals are substantially minimized, and determining an angular position of the shaft based on the first and second signals. | 02-02-2012 |
20120056615 | Method and Apparatus for Defined Magnetizing of Permanently Magnetizable Elements and Magnetoresistive Sensor Structures - An apparatus includes a sensor arrangement with a sensor chip. A magnetic field generator is configured to generate a secondary magnetic field opposing an external primary magnetic field at the sensor chip. The magnetic field generator protects the sensor arrangement against the external primary magnetic field. | 03-08-2012 |
20120112365 | Semiconductor Packages and Methods For Producing The Same - In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The rim portion is thicker than the membrane portion. The package includes a semiconductor chip disposed in the recess and a backplane disposed under the membrane portion of the isolating container. | 05-10-2012 |
20120126805 | Current Sensor - Embodiments of the invention provide a current sensor including a conductive element and at least two magnetic field sensors. The conductive element includes at least three terminal areas and a common conductive area, wherein each of the at least three terminal areas is connected to the common conductive area to guide a current applied to the respective terminal area into the common conductive area. The at least two magnetic field sensors are arranged at different geometric positions adjacent to the common conductive area, wherein each of the at least two magnetic field sensors is configured to sense a magnetic field component of each current flowing into the common conductive area to provide a sensor signal based on the sensed magnetic field component. | 05-24-2012 |
20120146164 | MAGNETIC FIELD CURRENT SENSORS - Embodiments relate to magnetic field current sensors. In an embodiment, a magnetic field current sensor includes a semiconductor die having first and second opposing surfaces and comprising at least one magnetic field sensing element; and a unitary conductor comprising a footprint portion, first and second pillar portions, and first and second contact portions, the first pillar portion having a first height and coupling the first contact portion to the footprint portion, the second pillar portion having the first height and coupling the second contact portion to the footprint portion, the first height being a monotonic vertical dimension separating the footprint portion from the first and second contact portions, and the footprint portion coupling the conductor to the first surface of the die such that the footprint portion is substantially parallel to the first surface of the die and within a perimeter of the first surface and the first and second contacts portions are closer to the first surface than the second surface. | 06-14-2012 |
20120146165 | MAGNETIC FIELD CURRENT SENSORS - Embodiments relate to magnetic field current sensors. In an embodiment, a method of forming a conductor clip for a magnetic field current sensor comprises forming a footprint portion; forming first and second contact portions; and forming first and second pillar portions coupling the first and second contact portions, respectively, to the footprint portion, the first and second pillar portions having a constant height and being at approximate right angles to the first and second contact portions and the footprint portion. | 06-14-2012 |
20120153947 | MAGNETORESISTIVE ANGLE SENSORS - Magnetoresistive angle sensors, sensor systems and methods are disclosed. In an embodiment, a magnetoresistive angle sensor includes a first plurality of conductors arranged in parallel with one another in a first plane to form a first array; a second plurality of conductors arranged in parallel with one another in a second plane to form a second array, the second plane being different from and spaced apart from the first plane, and the second plurality of conductors being orthogonally arranged with respect to the first plurality of conductors; and at least one magnetoresistive element disposed between the first plane and the second plane. | 06-21-2012 |
20120187943 | CURRENT DIFFERENCE SENSORS, SYSTEMS AND METHODS - Embodiments relate to current difference sensors, systems and methods. In an embodiment, a current difference sensor includes first and second conductors arranged relative to one another such that when a first current flows through the first conductor and a second current, equal to the first current, flows through the second conductor, a first magnetic field induced in the first conductor and a second magnetic field induced in the second conductor cancel each other at a first position and a second position; and first and second magnetic field sensing elements arranged at the first and second positions, respectively. | 07-26-2012 |
20120194175 | Sensor - The present invention is directed to a sensor with a body and a magnetic field sensor. The body includes a plurality of structures arranged in a first direction to effect a periodically varying magnetic field upon movement of the body in the first direction. The magnetic field sensor is configured to detect components of the magnetic field in a second direction and in a third direction, wherein the magnetic field sensor is arranged adjacent to the body such that the second direction is perpendicular to the first direction and such that the third direction is perpendicular to the first direction and to the second direction. | 08-02-2012 |
20120200290 | Low Offset Spinning Current Hall Plate and Method to Operate it - One embodiment of the present invention relates to a method and apparatus for removing the effect of contact resistances for Hall effect device contacts. In one embodiment, the apparatus comprises a Hall effect device comprising a plurality of force and sense contact pairs. The force and sense contact pairs comprise a force contact and a separate and distinct sense contact. The force contact is configured to act as a supply terminal that receive an input signal while the sense contact is configured act as an output terminal to provide an output signal indicative of a measured magnetic field value. By utilizing separate contacts for inputting a signal (e.g., an applied current) and reading out a signal (e.g., an induced voltage) the non-linearities generated by contact resistances may be removed, thereby minimizing the zero point offset voltage of the measured magnetic field. | 08-09-2012 |
20120217960 | 3-D MAGNETIC SENSOR - One embodiment of the present invention relates to a magnetic field sensor comprising a squat soft-magnetic body disposed on a surface of a substrate comprising a magnetic sensor array having a plurality of spatially diverse magnetic sensor elements disposed in a predetermined configuration. In the presence of an external magnetic field the squat soft-magnetic body becomes magnetized to generate a reactionary magnetic field. The plurality of magnetic sensor elements are respectively configured to measure a magnetic field value of a superposition of the external magnetic field and the reactionary magnetic field along a first axis (e.g., a z-axis), resulting in a plurality of spatially diverse measurements of the magnetic field component along the first axis. The plurality of spatially diverse measurements may be used to compute magnetic field components of the external magnetic field along a plurality of axes (e.g., x-axis, y-axis, and z-axis). | 08-30-2012 |
20120262152 | CURRENT SENSORS, SYSTEMS AND METHODS - Embodiments relate to magnetic current sensors. In various embodiments, a current sensor can include a simple conductor having a constant cross-sectional profile, such as round, square or rectangular, and being generally free of any notches or slots to divert current and thereby having a simpler manufacturing process, lower resistance and improved mechanical robustness. In embodiments, the conductor can be formed of a non-magnetic conductive material, such as aluminum or copper. | 10-18-2012 |
20120262317 | SYSTEM INCLUDING FEEDBACK CIRCUIT WITH DIGITAL CHOPPING CIRCUIT - A system including a first circuit, a second circuit, and a feedback circuit. The first circuit is configured to provide input signals. The second circuit is configured to receive the input signals and provide digital output signals that correspond to the input signals. The feedback circuit includes a chopping circuit, an integrator circuit, and a digital to analog converter circuit. The digital to analog converter circuit is configured to convert an error signal into an analog signal that is received by the second circuit to reduce ripple error. | 10-18-2012 |
20120285255 | STRESS SENSING DEVICES AND METHODS - Embodiments relate to stress sensors and methods of sensing stress. In an embodiment, a stress sensor comprises a vertical resistor. The vertical resistor can comprise, for example, an n-type resistor and can have various operating modes. The various operating modes can depend on a coupling configuration of terminals of the resistor and can provide varying piezo-coefficients with very similar temperature coefficients of resistances. Comparisons of resistances and piezo-coefficients in differing operating modes can provide a measure of mechanical stresses acting on the device. | 11-15-2012 |
20120286776 | Low Offset Vertical Hall Device and Current Spinning Method - One embodiment of the present invention relates to a vertical Hall-effect device. The device includes at least two supply terminals arranged to supply electrical energy to the first Hall-effect region; and at least one Hall signal terminal arranged to provide a first Hall signal from the first Hall-effect region. The first Hall signal is indicative of a magnetic field which is parallel to the surface of the semiconductor substrate and which acts on the first Hall-effect region. One or more of the at least two supply terminals or one or more of the at least one Hall signal terminal comprises a force contact and a sense contact. | 11-15-2012 |
20120313623 | SYSTEM THAT OBTAINS A SWITCHING POINT WITH THE ENCODER IN A STATIC POSITION - A system including an encoder, multiple sensing elements and control logic. The encoder has a pole pitch and is configured to rotate in a direction of rotation. The multiple sensing elements are situated along the direction of rotation and span at least half the length of the pole pitch. The control logic is configured to receive signals from the multiple sensing elements based on the encoder in a static position and obtain a switching point based on the signals. | 12-13-2012 |
20120319682 | INTEGRATED CIRCUIT INCLUDING SENSOR HAVING INJECTION MOLDED MAGNETIC MATERIAL - An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor. | 12-20-2012 |
20130009678 | SYSTEM PROVIDING A SWITCHED OUTPUT SIGNAL AND A HIGH RESOLUTION OUTPUT SIGNAL - A system includes a sensing system, a first chopped circuit, a second chopped circuit, and a multiplexer. The sensing system is configured to provide input signals. The first chopped circuit is configured to switch in response to the input signals crossing a first limit and to provide a first output signal that is valid during some chopping phases. The second chopped circuit is configured to switch in response to the input signals crossing a second limit and to provide a second output signal that is valid during other chopping phases. The multiplexer is configured to switch between the first output signal and the second output signal to provide a valid output signal during all chopping phases. | 01-10-2013 |
20130021026 | ELECTRONIC DEVICE WITH RING-CONNECTED HALL EFFECT REGIONS - An electronic device includes a number of n Hall effect regions with n>1, wherein the n Hall effect regions are isolated from each other. The electronic device also includes at least eight contacts in or on surfaces of the n Hall effect regions, wherein the contacts include: a first and a second contact of each Hall effect region. A first contact of the (k+1)-th Hall effect region is connected to the second contact of the k-th Hall effect region for k=1 to n−1, and the first contact of the first Hall effect region is connected to the second contact of the n-th Hall effect region. The at least eight contacts include at least two supply contacts and at least two sense contacts. Each Hall effect region includes at most one of the at least two supply contacts and at most one of the at least two sense contacts. | 01-24-2013 |
20130021027 | VERTICAL HALL SENSOR WITH HIGH ELECTRICAL SYMMETRY - A vertical Hall sensor includes a Hall effect region and a plurality of contacts formed in or on a surface of the Hall effect region. The plurality of contacts are arranged in a sequence along a path extending between a first end and a second end of the Hall effect region. The plurality of contacts includes at least four spinning current contacts and at least two supply-only contacts. The spinning current contacts are configured to alternatingly function as supply contacts and sense contacts according to a spinning current scheme. The at least four spinning current contacts are arranged along a central portion of the path. The at least two supply-only contacts are arranged on both sides of the central portion in a distributed manner and are configured to supply electrical energy to the Hall effect region according to an extension of the spinning current scheme. | 01-24-2013 |
20130029432 | THIN-WAFER CURRENT SENSORS - Embodiments relate to IC current sensors fabricated using thin-wafer manufacturing technologies. Such technologies can include processing in which dicing before grinding (DBG) is utilized, which can improve reliability and minimize stress effects. While embodiments utilize face-up mounting, face-down mounting is made possible in other embodiments by via through-contacts. IC current sensor embodiments can present many advantages while minimizing drawbacks often associated with conventional IC current sensors. | 01-31-2013 |
20130043863 | MAGNETIC POSITION SENSORS, SYSTEMS AND METHODS - Magnetic position sensors, systems and methods are disclosed. In an embodiment, a position sensing system includes a magnetic field source with a dipole moment in a direction along a z-axis; and a sensor module spaced apart from a center of the dipole moment a distance y0 along a y-axis and spaced apart a distance z0 from a center of the dipole moment along a z-axis, at least one of the magnetic field source or the sensor module configured to move relative to the other along a path in the y=y0 plane, the sensor module configured to determine a relative position of the magnetic field source to the sensor module with respect to the path from a ratio of a gradient dBz/dx to a gradient dBz/dy, where Bz is a magnetic field component associated with the permanent magnet, and where an x-axis, the y-axis and the z-axis are at right angles. | 02-21-2013 |
20130049746 | Semiconductor Chip Package and Method - A semiconductor chip package and a method to manufacture a semiconductor chip package are disclosed. An embodiment of the present invention comprises a substrate and a semiconductor chip disposed on the substrate and laterally surrounded by a packaging material. The package further comprises a current rail adjacent the semiconductor chip, the current rail isolated from the semiconductor chip by an isolation layer, a first external pad, and a via contact contacting the current rail with the first external pad. | 02-28-2013 |
20130069640 | VERTICAL HALL SENSORS - Embodiments relate to vertical Hall sensors for use with spinning current techniques. In an embodiment, a symmetric arrangement of two vertical Hall devices is used, in which all sense terminals of the Hall devices are used in all clock phases. Such a configuration can achieve better offset error suppression as compared with conventional solutions. | 03-21-2013 |
20130076341 | HIGH CURRENT SENSORS - Embodiments relate to high current sensors having generally flat conductors. In an embodiment, the conductor is formed of a non-magnetic material such as copper or aluminum and has a coarse slot, one that reduces the cross-sectional area for current flow by a factor of about two. The slot also functions as an aperture in which the sensor package can mounted, thereby protected from environmental influences. | 03-28-2013 |
20130113477 | CURRENT SENSORS - Embodiments relate to magnetic field current sensors having sensor elements for sensing at least two magnetic field components, for example Bx and By. The current in a conductor is estimated by Bx and Bx/By, wherein Bx is the primary measurement and Bx/By is a corrective term used to account for position tolerances between the sensor and the conductor. In other embodiments, the corrective term can be dBx/By, where dBx is a difference in between components sensed at different sensor elements. The particular field components can vary in embodiments; for example, the current can be estimated by By and By/Bx, or dBy/Bx or some other arrangement | 05-09-2013 |
20130127453 | ELECTRONIC DEVICE COMPRISING HALL EFFECT REGION WITH THREE CONTACTS - An electronic device is disclosed as a part of a magnetic field sensor or a mechanical stress sensor. The electronic device includes a Hall effect region, a first contact (temporarily functioning as a first supply contact), a second contact (second supply contact), and a third contact (temporarily functioning as a first sense contact) that are arranged in or on a surface of the Hall effect region. The first contact and the third contact are arranged in a substantially symmetrical manner to each other with respect to the second contact. An electrical current distribution within the Hall effect region is influenced by a physical quantity (e.g. magnetic field strength or mechanical stress) to be measured. A sense signal tapped at the third contact is a function of the current distribution, the sense signal thus being indicative of the physical quantity. A corresponding sensing method using the electronic device is also disclosed. | 05-23-2013 |
20130138372 | CURRENT SENSOR PACKAGE, ARRANGEMENT AND SYSTEM - Embodiments of the present invention provide a current sensor package for sensing a current flowing in a primary conductor of a substrate. The current sensor package includes a magnetic field sensor, a calibration current provider and a controller. The calibration current provider is configured to provide a calibration current for a calibration conductor of the substrate, wherein the calibration conductor and the primary conductor are arranged in a defined spatial relation to each other on the substrate. The magnetic field sensor element is configured to sense a magnetic field of the primary current flowing in the primary conductor in order to provide a primary sensor signal and to sense a magnetic field of the calibration current flowing through the calibration conductor to provide a calibration sensor signal. The controller is configured to receive the primary sensor signal and the calibration sensor signal, and to calibrate the primary sensor signal based on the calibration sensor signal and the defined spatial relation between the primary conductor and the calibration conductor. | 05-30-2013 |
20130181703 | Sensor Package and Method for Producing a Sensor Package - Some embodiments herein relate to a sensor package. The sensor package includes a printed circuit board with a laminar current conductor arranged on a first main surface of the printed circuit board. The sensor package also includes a sensor chip adapted to measure a current flowing through the laminar current conductor, wherein the sensor chip comprises a magnetic field sensor. The sensor chip is electrically insulated from the current conductor by the printed circuit board, and is arranged on a second main surface of the printed circuit board opposite to the first main surface. The sensor chip is hermetically sealed between the mold material and the printed circuit board, or is arranged in the printed circuit board and hermetically sealed by the printed circuit board. | 07-18-2013 |
20130214775 | VERTICAL HALL DEVICE WITH ELECTRICAL 180 DEGREE SYMMETRY - A vertical Hall device indicative of a magnetic field parallel to a surface of a substrate comprises first, second, third and fourth terminals. The vertical Hall device further comprises contacts to generate a Hall effect signal indicative of the magnetic field. At least one pair of Hall effect regions is provided which comprises a first Hall effect region and a second Hall effect region formed in the substrate. A first group of the contacts is arranged in or at a surface of the first Hall effect region, the first group comprising a first and second outmost contacts. A second group of contacts is arranged in or at a surface of the second Hall effect region, the second group comprising third and fourth outmost contacts. Each of the first, second, third and fourth terminals is connected to a same number of outmost contacts. | 08-22-2013 |
20130218517 | Rotation Angle Sensor for Absolute Rotation Angle Determination Even Upon Multiple Revolutions - A rotation angle sensor for detecting an absolute rotation angle upon single or multiple revolutions includes a magnetic field sensor and an encoder arrangement. The magnetic field sensor detects at least two orthogonal magnetic field variables. The encoder arrangement is rotatable depending on the absolute rotation angle relative to the magnetic field sensor, such that the magnetic field detected by the magnetic field sensor is dependent on a relative angular position of the encoder arrangement with respect to the magnetic field sensor. The encoder arrangement is furthermore displaceable relative to the magnetic field sensor. The relative angular position and the relative translational position of the encoder arrangement with respect to the magnetic field sensor is determined from the at least two orthogonal magnetic field variables. The absolute rotation angle is determined by means of the relative angular position and the relative translational position. | 08-22-2013 |
20130239702 | Double Die Sensor - One embodiment of the present invention relates to a device, such as a sensor device. The device includes a sensor die and a circuit die. The sensor die includes a sensor and a feedback component. The circuit die includes circuitry. The circuit die is varied from the sensor die, such as comprising a varied substrate material. The circuitry is coupled to the sensor and the feedback component. The circuitry and the feedback component can communicate correlation information. | 09-19-2013 |
20130241540 | Apparatus, Sensor Circuit, and Method for Operating an Apparatus or a Sensor Circuit - A sensor system comprises a sensor element adapted to sense at least one physical quantity, wherein the sensor element is adapted to generate a sensor signal in response to the at least one physical quantity, an evaluation circuit adapted to detect a manipulation of the sensor system based on the sensor signal and stored reference values and to output an indication signal in response to a detected manipulation and a package, the package housing at least the sensor element and the evaluation circuit. | 09-19-2013 |
20130298669 | INTEGRATED SENSORS AND SENSING METHODS - Embodiments relate to integrated sensors and sensing methods. Embodiments relate to integrated sensor layouts. Embodiments are configured to maximize a ratio of sensor spacing over a die area. While being generally applicable to many different types of sensors, particular advantages can be presented for magnetoresistive (xMR) sensors. | 11-14-2013 |
20130300407 | Current Sensor - A current sensor includes a conductive element, and at least two magnetic field sensors arranged on the conductive element and configured to sense a magnetic field generated by a current through the conductive element, wherein the at least two magnetic field sensors are arranged on opposite sides of a line perpendicular to a current flow direction in the conductive element. The current sensor further includes an insulating layer arranged between the conductive element and the magnetic field sensors, and at least two conductor traces provided on the insulating layer, wherein one end of the conductor traces connects to a respective magnetic field sensor, and the other end of the conductor traces providing a terminal for outputting the sensor signals. The conductor traces are arranged such that they do not extend entirely around the conductive element. | 11-14-2013 |
20130304422 | Increased Dynamic Range Sensor - Some aspects of the present disclosure provide for a sensor system having a large range between minimum and maximum allowed input quantities. In some embodiments, the sensor system has a nonlinear sensor and a linear sensor. The nonlinear sensor is generates a first nonlinear signal corresponding to a detected physical input quantity. The linear sensor generates a second linear signal corresponding to the detected physical input quantity. A signal processor receives the first nonlinear signal and the second linear signal and generates a composite output signal that corresponds to the detected physical input quantity. The composite output signal is a combination of the first nonlinear signal and the second linear signal that provides for a signal having a high sensitivity to small physical input quantities while avoiding saturation at large physical input quantities. | 11-14-2013 |
20130307609 | Hall Effect Device - Embodiments of the present invention provide a Hall effect device that includes a Hall effect region of a first semiconductive type, at least three contacts and a lateral conductive structure. The Hall effect region is formed in or on top of a substrate, wherein the substrate includes an isolation arrangement to isolate the Hall effect region in a lateral direction and in a depth direction from the substrate or other electronic devices in the substrate. The at least three contacts are arranged at a top of the Hall effect region to supply the Hall effect device with electric energy and to provide a Hall effect signal indicative of the magnetic field, wherein the Hall effect signal is generated in a portion of the Hall effect region defined by the at least three contacts. The lateral conductive structure is located between the Hall effect region and the isolation arrangement. | 11-21-2013 |
20130314075 | OFFSET ERROR COMPENSATION SYSTEMS AND METHODS IN SENSORS - Embodiments relate to reducing offset error in sensor systems. In embodiments, the sensitivity and offset of a sensor depend differently on some parameter, e.g. voltage, such that operating the sensor at two different values of the parameter can cancel the offset error. Embodiments can have applicability to stress sensors, Hall plates, vertical Hall devices, magnetoresistive sensors and others. | 11-28-2013 |
20130342194 | VERTICAL HALL SENSOR WITH SERIES-CONNECTED HALL EFFECT REGIONS - A vertical Hall sensor includes first and second vertical Hall effect regions in a semiconductor substrate, with first and second pluralities of contacts arranged at one side of the first or second vertical Hall effect regions, respectively. The second vertical Hall effect region is connected in series with the first vertical Hall effect region regarding a power supply. The vertical Hall sensor further includes first and second layers adjacent to the first and second vertical Hall effect regions at a side other than a side of the first or second pluralities of contacts. The first and second layers have different doping properties than the first and second vertical Hall effect regions and insulate the first and second vertical Hall effect regions from a bulk of the semiconductor substrate by at least one reverse-biased p-n junction per vertical Hall effect region during an operation of the vertical Hall sensor. | 12-26-2013 |
20130342195 | VERTICAL HALL DEVICE COMPRISING FIRST AND SECOND CONTACT INTERCONNECTIONS - A vertical Hall device includes a Hall effect region formed in a substrate and a sequence of at least six contacts arranged in or at a surface of the Hall effect region between a first contact and a last contact. The vertical Hall device also includes a first contact interconnection connecting the first contact with a third to the last contact. A vertical Hall device further includes a second contact interconnection connecting a third contact with the last contact. Further embodiments made to a sensing method for sensing a magnetic field parallel to a surface of a substrate. | 12-26-2013 |
20130342196 | Vertical Hall Device Comprising a Slot in the Hall Effect Region - A vertical Hall device includes a Hall effect region, a separator, a first plurality of contacts, and a second plurality of contacts. The Hall effect region includes a first straight section, a second straight section that is offset parallel to the first straight section, and a connecting section that connects the first straight section and the second straight section. The separator separates a portion of the first straight section from a portion of the second straight section. The first and second plurality of contacts are arranged in or at the surface of the first and second straight sections, respectively. With respect to a first clock phase of a spinning current scheme, the first plurality of contacts comprises a first supply contact and a first sense contact. The second plurality of contacts comprises a second supply contact and a second sense contact. | 12-26-2013 |
20140003464 | STRESS COMPENSATION SYSTEMS AND METHODS IN DIFFERENTIAL SENSORS | 01-02-2014 |
20140028304 | HALL SENSORS AND SENSING METHODS - Embodiments relate to multi-contact sensor devices and operating methods thereof that can reduce or eliminate offset error. In embodiments, sensor devices can comprise three or more contacts, and multiple sensor devices can be combined. The sensor devices can comprise Hall sensor devices, such as vertical Hall devices, or other sensor types. Operating modes can be implemented for the multi-contact sensor devices which offer significant modifications of and improvements over conventional spinning current principles. In a first operating mode, the sensor is supplied with the same input current in all operating phases, with the output voltages of all operating cycles sensed and processed. In another operating mode, the sensor device is supplied with the same input voltage in all operating phases, the sense terminals are forced to constant potentials, and the currents flowing into or out of the sense terminals are sensed and processed. | 01-30-2014 |
20140028307 | MAGNETORESISTIVE SENSOR SYSTEMS AND METHODS HAVING A YAW ANGLE BETWEEN PREMAGNETIZATION AND MAGNETIC FIELD DIRECTIONS - Embodiments relate to magnetoresistive (xMR) sensors which provide a yaw angle between a reference premagnetization direction of the sensor layer and the magnetic field to be detected, or between a direction of a bias magnetic field and the magnetic field to be detected. In an embodiment, an xMR sensor is rotated or tilted with respect to a direction of a magnetic field to be sensed such that a premagnetization direction of the reference premagnetization layer of the xMR sensor is also rotated or tilted at some yaw angle with respect to the direction of the magnetic field. In another embodiment, a bias magnet or other source is used with sensors not having premagnetization or reference layers, such as anisotropic magnetoresistive (AMR) sensors, and the direction of the bias magnetic field is also tilted or rotated with respect to the direction of the magnetic field to be detected. | 01-30-2014 |
20140035571 | MAGNETORESISTIVE SENSORS HAVING REDUCED AMR EFFECTS - Embodiments related to magnetoresistive angle sensor layouts having reduced anisotropic magneto resistance (AMR) effects. Embodiments provide magnetoresistive angle sensor layouts that reduce or eliminate distortion related to AMR effects, can be more easily scaled up or down, and are more compact to use available surface area more efficiently. | 02-06-2014 |
20140084403 | INTEGRATED CIRCUIT INCLUDING SENSOR HAVING INJECTION MOLDED MAGNETIC MATERIAL - An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor. | 03-27-2014 |
20140084911 | HALL SENSORS AND SENSING METHODS - Embodiments relate to multi-terminal sensor devices and operating methods thereof that can reduce or eliminate offset error. In embodiments, sensor devices can comprise three or fewer terminals, and multiple such sensor devices can be combined. The sensor devices can comprise Hall sensor devices, such as vertical Hall devices, or other sensor devices in embodiments. Operating modes can be implemented for the multi-terminal sensor devices which offer improvements over conventional spinning current techniques, including reduced residual offset. | 03-27-2014 |
20140151697 | Semiconductor Packages, Systems, and Methods of Formation Thereof - In accordance with an embodiment of the present invention, a semiconductor package includes a current rail comprising a first contact area and a second contact area, a first groove and a second groove, and a magnetic field generating portion. Along a current flow direction, the first groove is disposed between the first contact area and the magnetic field generating portion and the second groove is disposed between the magnetic field generating portion and the second contact area. The thickness of the current rail at the first groove is smaller than the thickness of the current rail at the first contact area. | 06-05-2014 |
20140183534 | THIN-WAFER CURRENT SENSORS - Embodiments relate to IC current sensors fabricated using thin-wafer manufacturing technologies. Such technologies can include processing in which dicing before grinding (DBG) is utilized, which can improve reliability and minimize stress effects. While embodiments utilize face-up mounting, face-down mounting is made possible in other embodiments by via through-contacts. IC current sensor embodiments can present many advantages while minimizing drawbacks often associated with conventional IC current sensors. | 07-03-2014 |
20140210458 | SYSTEMS AND METHODS FOR OFFSET REDUCTION IN SENSOR DEVICES AND SYSTEMS - Embodiments relate to systems and methods for reducing errors in sensor devices and systems. In embodiments, the sensor devices comprise magnetic field sensor devices, such as ordinary or vertical Hall sensor devices, and the error to be reduced is a residual offset error, though in other embodiments other sensor devices can be used and/or other types of errors can be targeted for reduction or elimination. In one embodiment, at least two such sensor devices not electrically coupled with one another are sequentially operated in a spinning current-type mode such that an individual output signal from each of the at least two sensor devices is obtained. A total output signal can then be calculated, such as by averaging or otherwise combining the individual output signals from each sensor device. | 07-31-2014 |
20140210461 | VERTICAL HALL DEVICE WITH HIGHLY CONDUCTIVE OPPOSITE FACE NODE FOR ELECTRICALLY CONNECTING FIRST AND SECOND HALL EFFECT REGIONS - Vertical Hall device with highly conductive node for electrically connecting first and second Hall effect regions. A vertical Hall device comprises a first Hall effect region and a different second Hall effect region, both in a common semiconductor body. The first and second Hall effect regions have a main face and an opposite face, respectively. A highly conductive opposite face node is in ohmic contact to the opposite face of the first Hall effect region and the opposite face of the second Hall effect region in the semiconductor body. The vertical Hall device also comprises a first pair of contacts in or at the main face of the first Hall effect region and a second pair of contacts in or at the main face of the second Hall effect region. A convex circumscribing contour of the second pair of contacts is disjoint from a convex circumscribing contour of the first pair of contacts. Alternative embodiments comprise a pair of contacts and an opposite face node contact. | 07-31-2014 |
20140218013 | MAGNETIC POSITION SENSORS, SYSTEMS AND METHODS - Magnetic position sensors, systems and methods are disclosed. In an embodiment, a position sensing system includes a magnetic field source; and a sensor module spaced apart from the magnetic field source, at least one of the magnetic field source or the sensor module configured to move relative to the other along a path, the sensor module configured to determine a position of the magnetic field source relative to the sensor module from a nonlinear function of a ratio of a first component of a magnetic field of the magnetic field source to a second component of the magnetic field of the magnetic field source. | 08-07-2014 |
20140218019 | SENSOR PACKAGE AND METHOD FOR PRODUCING A SENSOR PACKAGE - Some embodiments herein relate to a sensor package. The sensor package includes a printed circuit board with a laminar current conductor arranged on a first main surface of the printed circuit board. The sensor package also includes a sensor chip adapted to measure a current flowing through the laminar current conductor, wherein the sensor chip comprises a magnetic field sensor. The sensor chip is electrically insulated from the current conductor by the printed circuit board, and is arranged on a second main surface of the printed circuit board opposite to the first main surface. The sensor chip is hermetically sealed between the mold material and the printed circuit board, or is arranged in the printed circuit board and hermetically sealed by the printed circuit board. | 08-07-2014 |
20140239426 | CURRENT SENSORS AND METHODS - Embodiments relate to current sensors and methods. In an embodiment, a current sensor comprises a leadframe; a semiconductor die coupled to the leadframe; a conductor comprising a metal layer on the semiconductor die, the conductor comprising at least one bridge portion and at least two slots, a first slot having a first tip and a second slot having a second tip, a distance between the first and second tips defining a width of one of the at least one bridge portion, wherein the conductor is separated from the leadframe by at least a thickness of the semiconductor die, and the thickness is about 0.2 millimeters (mm) to about 0.7 mm; and at least one magnetic sensor element arranged on the die relative to and spaced apart from the one of the at least one bridge portion and more proximate the conductor than the leadframe. | 08-28-2014 |
20140253106 | OFF-CENTER ANGLE MEASUREMENT SYSTEM - A method for measuring an angular position of a rotating shaft, the method including providing a magnetic field which rotates with the shaft about an axis of rotation, positioning an integrated circuit having first and second magnetic sensing bridges within the magnetic field at a radially off-center position from the axis of rotation, the first and second magnetic sensing bridges respectively providing first and second signals representative of first and second magnetic field directions, the integrated circuit having a set of adjustment parameters for modifying attributes of the first and second signals, modifying values of the set of adjustment parameters until errors in the first and second signals are substantially minimized, and determining an angular position of the shaft based on the first and second signals. | 09-11-2014 |
20140253115 | MAGNETIC FIELD CURRENT SENSORS - Current sensors, conductors and methods are disclosed. In an embodiment, a magnetic current sensor comprises a conductor comprising a first sheet metal layer having a first thickness and comprising at least one hole, and a second sheet metal layer having a second thickness less than the first thickness and comprising at least one notch, the second sheet metal layer being coupled to the first sheet metal layer such that the at least one hole of the first sheet metal layer at least partially overlaps with the at least one notch of the second sheet metal layer; and an integrated circuit (IC) die comprising at least one magnetic sensor element and being coupled to the conductor such that the at least one magnetic sensor element is generally aligned with a tip of the at least one notch of the second sheet metal layer. | 09-11-2014 |
20140264677 | Chip Package with Isolated Pin, Isolated Pad or Isolated Chip Carrier and Method of Making the Same - A chip package with isolated pin, isolated pad or isolated chip carrier and a method of making the same are disclosed. In one embodiment a chip package includes a chip, a package encapsulating the chip, pads or pins disposed on a first side of the package and an isolation pad or an isolation pin disposed on a second side of the package, the isolation pin or the isolation pad electrically isolated from the chip, wherein the chip comprises a magnetic field sensor configured to measure a magnetic field generated outside of the package. | 09-18-2014 |
20140266178 | CURRENT SENSOR - A current sensor includes a conductive element, and at least two magnetic field sensors arranged on the conductive element and configured to sense a magnetic field generated by a current through the conductive element, wherein the at least two magnetic field sensors are arranged on opposite sides of a line perpendicular to a current flow direction in the conductive element. The current sensor further includes an insulating layer arranged between the conductive element and the magnetic field sensors, and at least two conductor traces provided on the insulating layer, wherein one end of the conductor traces connects to a respective magnetic field sensor, and the other end of the conductor traces providing a terminal for outputting the sensor signals. The conductor traces are arranged such that they do not extend entirely around the conductive element. | 09-18-2014 |
20140266179 | Magnetic-Field Sensor - An embodiment of a magnetic-field sensor includes a magnetic-field sensor arrangement and a magnetic body which has, for example, a non-convex cross-sectional area with regard to a cross-sectional plane running through the magnetic body, the magnetic body having an inhomogeneous magnetization. | 09-18-2014 |
20140266180 | SENSORS, SYSTEMS AND METHODS FOR RESIDUAL CURRENT DETECTION - Embodiments relate to sensor systems and methods for detecting residual currents. In embodiments, a sensor comprises a magnetic core and a plurality of conductors passing through an aperture of the core. The magnetic core comprises a gap in the core itself, and a magnetic field sensor is arranged proximate to but not within this gap, in contrast with conventional approaches, in order to detect a net flux in the core. Advantageously, embodiments can be used in applications in which it is desired to detect AC or DC currents. | 09-18-2014 |
20140266269 | MULTIPLE CURRENT SENSOR DEVICE, A MULTIPLE CURRENT SHUNT DEVICE AND A METHOD FOR PROVIDING A SENSOR SIGNAL - A multiple current sensor device or a multiple current shunt device includes at least two resistive sections comprising a first resistive section and a second resistive section, at least two connecting sections comprising a first connecting section and a second connecting section and a common connecting section. The first resistive section is electrically coupled in between the first connecting section and the common connecting section. The second resistive section is electrically coupled in between the second connecting section and the common connecting section. Using an embodiment may improve a trade-off between an efficient integration, a compact integration, a compact implementation and an accurate determination of at least one value indicative of at least one of multiple currents. | 09-18-2014 |
20140306701 | VERTICAL HALL SENSOR CIRCUIT COMPRISING STRESS COMPENSATION CIRCUIT - A vertical Hall sensor circuit comprises an arrangement comprising a vertical Hall effect region of a first doping type, formed within a semiconductor substrate and having a stress dependency with respect to a Hall effect-related electrical characteristic. The vertical Hall sensor circuit further comprises a stress compensation circuit which comprises at least one of a lateral resistor arrangement and a vertical resistor arrangement. The lateral resistor arrangement has a first resistive element and a second resistive element, which are parallel to a surface of the semiconductor substrate and orthogonal to each other, for generating a stress-dependent lateral resistor arrangement signal on the basis of a reference signal inputted to the stress compensation circuit. The vertical resistor arrangement has a third resistive element of the first doping type for vertically conducting an electric current flow, for generating a stress-dependent vertical resistor arrangement signal on the basis of the reference signal. The vertical Hall sensor circuit further comprises a first circuit for providing a first signal to the arrangement, the first signal being based on at least one of the stress-dependent lateral resistor arrangement signal and the stress-dependent vertical resistor arrangement signal. | 10-16-2014 |
20140369380 | SENSORS, SYSTEMS AND METHODS FOR COMPENSATING FOR THERMAL EMF - Embodiments relate to sensor systems and methods that can compensate for thermal EMF effects that can cause residual offset and other errors in sensor systems. In one embodiment, a sensor system comprises at least one temperature sensor arranged proximate a primary sensor element, e.g., a Hall plate in an embodiment in which the sensor system comprises a Hall-effect magnetic field sensing system, though other types of magnetic field and sensors more generally can be used in other embodiments. In another embodiment, a plurality of temperature sensors can be used, with each one arranged proximate a different sensor contact or element. In an example in which the Hall plate is operated according to a spinning operation scheme, the at least one temperature sensor can be configured to sense a temperature in each operating phase, and the individual sensed temperatures can be combined and used to provide a temperature-dependent compensation signal. | 12-18-2014 |
20150015249 | Current Sensor Device - A current sensor device includes a casing having a cavity and a conductor fixedly mounted to the casing. A semiconductor chip configured to sense a magnetic field is arranged in the cavity. An electrically insulating medium is configured to at least partially fill the cavity of the casing. | 01-15-2015 |
20150022186 | ANGLE SENSORS, SYSTEMS AND METHODS - Embodiments relate to magnetic field angle sensors, including off-axis and on-axis sensors. In an embodiment, a magnetic field angle sensor comprises two sensor units, and each sensor unit comprises two sensor elements. The sensor units are spaced apart from one another and arranged proximate a magnet, wherein the two sensor elements of each sensor unit are responsive to the same magnetic field component induced by a magnet coupled to a shaft as the shaft rotates. In each sensor unit, a sum and a difference of the output signals of the two sensor elements can be calculated to determine a coarse estimation of a rotation angle, and a more refined estimation can be obtained by combining the coarse estimations of each sensor unit. In embodiment, the magnetic field angle sensor comprises a control unit or other circuitry to carry out this combining. | 01-22-2015 |
20150022191 | DIFFERENTIAL PERPENDICULAR ON-AXIS ANGLE SENSOR - Embodiments relate to magnetic field angle sensors, such as on-axis magnetic field angle sensors. In an embodiment, a magnetic field angle sensor comprises a magnet having an axis of rotation, and a substrate arranged in-line with the axis of rotation. A plurality, such as at least four, of magnetic field sensor elements are arranged on a surface of the substrate, spaced apart from one another in regular increments on a closed curve in an embodiment, and are sensitive to a component of a magnetic field induced by the magnet that is parallel to the surface of the substrate on which the sensor elements are arranged. Circuitry of or coupled to the sensor elements then can estimate an angular position of the magnet, such as based on the magnetic field components sensed by the sensor elements as well as positions along the closed curve where the magnetic field component vanishes in an embodiment. | 01-22-2015 |
20150022192 | DISCRETE MAGNETIC ANGLE SENSOR DEVICE, A MAGNETIC ANGLE SENSOR ARRANGEMENT, A METHOD FOR GENERATING AN ANGLE SIGNAL AND A METHOD FOR PROVIDING A SENSOR SIGNAL - A discrete magnetic angle sensor device according to an embodiment includes a first magnetic field gradiometer and a second magnetic field gradiometer. The first magnetic field gradiometer and the second magnetic field gradiometer are of different types of a group of gradiometer types. An embodiment may improve an accuracy of a determination of a rotation angle. | 01-22-2015 |
20150061661 | LOW OFFSET VERTICAL HALL DEVICE AND CURRENT SPINNING METHOD - One embodiment of the present invention relates to a vertical Hall-effect device. The device includes at least two supply terminals arranged to supply electrical energy to the first Hall-effect region; and at least one Hall signal terminal arranged to provide a first Hall signal from the first Hall-effect region. The first Hall signal is indicative of a magnetic field which is parallel to the surface of the semiconductor substrate and which acts on the first Hall-effect region. One or more of the at least two supply terminals or one or more of the at least one Hall signal terminal comprises a force contact and a sense contact. | 03-05-2015 |
20150061662 | Current Sensor - Embodiments of the disclosure provide a current sensor including a conductive element and at least two magnetic field sensors. The conductive element includes at least three separate terminal areas, a common conductive area and at least three separate intermediate areas connecting the respective separate terminal areas to the common conductive area. Each of the terminal areas is connected separately via a respective separate intermediate area of the at least three separate intermediate areas to the common conductive area to guide a current applied to the respective terminal area into the common conductive area. The at least two magnetic field sensors are arranged at different geometric positions adjacent to the at least three separate intermediate areas, wherein each of the magnetic field sensors is configured to sense a magnetic field component of each current flowing into the common conductive area to provide a sensor signal based thereon. | 03-05-2015 |
20150070009 | Electronic Device Comprising Hall Effect Region with Three Contacts - An electronic device is disclosed as a part of a magnetic field sensor or a mechanical stress sensor. The electronic device includes a Hall effect region, a first contact (temporarily functioning as a first supply contact), a second contact (second supply contact), and a third contact (temporarily functioning as a first sense contact) that are arranged in or on a surface of the Hall effect region. The first contact and the third contact are arranged in a substantially symmetrical manner to each other with respect to the second contact. An electrical current distribution within the Hall effect region is influenced by a physical quantity (e.g. magnetic field strength or mechanical stress) to be measured. A sense signal tapped at the third contact is a function of the current distribution, the sense signal thus being indicative of the physical quantity. A corresponding sensing method using the electronic device is also disclosed. | 03-12-2015 |