Patent application number | Description | Published |
20090144972 | CIRCUIT BOARD AND PROCESS FOR FABRICATING THE SAME - A process for fabricating a circuit board is provided. In the process, first, a circuit substrate including an insulation layer and at least a pad contacting the insulation layer is provided. Next, a barrier material layer is formed on the circuit substrate. The barrier material layer completely covers the insulation layer and the pad. Then, at least one conductive bump is formed on the barrier material layer. The conductive bump is opposite to the pad, and the material of the barrier material layer is different from the material of the conductive bump. Next, a portion of the barrier material layer is removed by using the conductive bump as a mask, so as to expose the surface of the insulation layer and to form a barrier connected between the conductive bump and the pad. | 06-11-2009 |
20090166059 | CIRCUIT BOARD AND PROCESS THEREOF - A circuit board and process thereof are provided. The circuit board includes a dielectric layer, a main circuit, and two shielding circuits. The dielectric layer has an active surface. The main circuit is embedded in the dielectric layer and the shielding circuits are disposed at the dielectric layer. The shielding circuits are respectively located at two sides of the main circuit. The thickness of the shielding circuits is larger than the thickness of the main circuit. | 07-02-2009 |
20090197364 | METHOD OF FABRICATING SUBSTRATE - A method of fabricating a substrate includes following steps. First, a metallic panel having a first surface and a second surface is provided. A first half-etching process is carried out to etch the first surface of the metallic panel to a first depth so that a first patterned metallic layer is formed on the first surface. Next, a first insulating material is deposited into gaps in the first patterned metallic layer to form a first insulator. Thereafter, a second half-etching process is carried out to etch the second surface of the metallic panel to a second depth and expose at least a portion of the first insulator so that a second patterned metallic layer is formed on the second surface. The first depth and the second depth together equal the thickness of the metallic panel. | 08-06-2009 |
20090273907 | CIRCUIT BOARD AND PROCESS THEREOF - A circuit board and process thereof are provided. The circuit board includes a dielectric layer, an active circuit, and two shielding circuits. The dielectric layer has an active surface. The active circuit is disposed on the active surface, and the shielding circuits are respectively disposed on two sides of the active circuit. The height of the shielding circuits is larger than the height of the active circuit. | 11-05-2009 |
20090314650 | PROCESS OF PACKAGE SUBSTRATE - A process of a package substrate is provided. A plurality of metal layers stacked in sequence is used as a foundation structure. A thick heat conductive core is fabricated from one of the metal layers for providing high heat dissipation capability, and a plurality of pads is fabricated from another one of the metal layers for electrically connecting an electronic package at the next level. | 12-24-2009 |
20120007252 | SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATING METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE - A semiconductor package structure includes a dielectric layer, a patterned metal layer, a carrier, a metal layer and a semiconductor die. The dielectric layer has a first surface, a second surface and an opening. The patterned metal layer is disposed on the first surface. The carrier is disposed at the second surface and has a third surface, a fourth surface and at least a through hole. A portion of the third surface and the through hole are exposed by the opening. The metal layer is disposed on the fourth surface and has a containing cavity and at least a heat conductive post extending from the fourth surface and disposed in the through hole. An end of the heat conductive post protrudes away from the third surface, and the containing cavity is located on the end of the heat conductive post. The semiconductor die is located in the containing cavity. | 01-12-2012 |
20120124830 | PROCESS FOR FABRICATING CIRCUIT BOARD - A process for fabricating a circuit board is provided. In the process, first, a circuit substrate including an insulation layer and at least a pad contacting the insulation layer is provided. Next, a barrier material layer is formed on the circuit substrate. The barrier material layer completely covers the insulation layer and the pad. Then, at least one conductive bump is formed on the barrier material layer. The conductive bump is opposite to the pad, and the material of the barrier material layer is different from the material of the conductive bump. Next, a portion of the barrier material layer is removed by using the conductive bump as a mask, so as to expose the surface of the insulation layer and to form a barrier connected between the conductive bump and the pad. | 05-24-2012 |
20130011971 | FABRICATING METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE - A fabricating method of a semiconductor package structure is provided. A dielectric layer having a first surface and a second surface is provided. A patterned metal layer has been formed on the first surface of the dielectric layer. An opening going through the first and the second surfaces is formed. A carrier having a third surface and a fourth surface is formed at the second surface. A portion of the third surface is exposed by the opening of the dielectric layer. A semiconductor die having a joining surface and a side-surface is joined in the opening. At least a through hole going through the third and the fourth surfaces is formed. A metal layer having at least a heat conductive post extending from the fourth surface of the carrier to the through hole and disposed in the through hole and a containing cavity is formed on the fourth surface. | 01-10-2013 |
20140071656 | LIGHT SOURCE MODULE AND BULB LAMP - A light source module includes a base plate, a projection, and a plurality of light-emitting devices. The projection is disposed on the base plate. The light-emitting devices surround the projection and are disposed on the projection. | 03-13-2014 |
20140071671 | T-BAR LAMP - A T-bar lamp includes a T-bar lamp housing, at least one light source, and a pattern. The T-bar lamp housing has an opening. The light source is mounted in the T-bar lamp housing. The pattern covers the opening and has at least one transparent region. The transparent region exposes the corresponding light source. | 03-13-2014 |
20140138559 | LAMPSHADE AND ILLUMINATION MODULE - A lampshade including a plurality of plate structures is provided. The plurality of plate structures are connected to one another to form a hollow casing having an opening. An illumination module including a base plate, a light source, and a lampshade is further provided. The light source is disposed on the base plate. The lampshade is covered on the base plate, and the light source is sited between the base plate and the lampshade. The lampshade includes a plurality of plate structures, wherein the plurality of plate structures are connected to one another to form a hollow casing having an opening. | 05-22-2014 |