Patent application number | Description | Published |
20080249259 | Addition curable silicone resin composition and silicone lens using same - An addition curable silicone resin composition is provided. The composition includes two types of alkenyl group-containing organopolysiloxanes, and two types of organohydrogenpolysiloxanes, and a platinum group catalyst. The composition is cured to form a hard cured product with excellent flexibility and minimal surface tack, suited to a silicone lens. | 10-09-2008 |
20080308828 | Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet - An addition curable adhesive silicone composition containing a phosphor dispersed uniformly therein is provided. The dispersive state of the phosphor remains stable over time. The composition, in an uncured state at room temperature, is either a solid or a semisolid, and is therefore easy to handle, and is suited to an adhesive silicone composition sheet which is able to be formed easily on an LED chip using a conventional assembly apparatus. | 12-18-2008 |
20090121180 | SILOXANE-GRAFTED SILICA, TRANSPARENT SILICONE COMPOSITION, AND OPTOELECTRONIC DEVICE ENCAPSULATED THEREWITH - Silica particles having 4-30% of an organopolysiloxane grafted to surfaces thereof are provided. A silicone composition loaded with such silica particles has high transparency, minimized permeability to corrosive gases, and improved encapsulation ability. | 05-14-2009 |
20090203822 | DIGLYCIDYLISOCYANURYL-MODIFIED ORGANOPOLYSILOXANE AND COMPOSITION CONTAINING THE SAME - An organopolysiloxane represented by formula (1) shown below and having (3,5-diglycidylisocyanuryl)alkyl groups represented by formula (2) at least at both terminals of the main chain: | 08-13-2009 |
20090236759 | CURABLE SILICONE RUBBER COMPOSITION AND SEMICONDUCTOR DEVICE - A curable silicone rubber composition, comprising: (A) an organopolysiloxane containing two or more alkenyl groups within each molecule, (B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms within each molecule, (C) a metal-based condensation reaction catalyst, (D) a platinum group metal-based addition reaction catalyst, and (E) an adhesion-imparting agent, wherein among the refractive indices of component (A), a mixture of component (A) and component (B), and component (E), the difference between the maximum refractive index and the minimum refractive index is not more than 0.03. | 09-24-2009 |
20090259002 | ADDITION-CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF - An addition-curable silicone composition is provided. The composition includes (A) a resin structure organopolysiloxane and (B) a platinum group metal-based catalyst. The component (A) has silicon-bonded alkenyl groups and hydrosilyl groups, and includes a structure in which R | 10-15-2009 |
20100029887 | RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT - A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below:
| 02-04-2010 |
20100059177 | CURABLE SILICONE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPAQUE SILICONE ADHESIVE SHEET FORMED FROM THE COMPOSITION - Disclosed is a curable silicone resin composition that is solid at room temperature, the composition including: (A) an organopolysiloxane having a resin structure consisting of specific siloxane units, (B) an organohydrogenpolysiloxane having a resin structure consisting of specific siloxane units, (C) a platinum group metal-based catalyst, (D) either one or both of an opaque pigment and an opaque dye, and (E) a reaction retarder, in which a layer of thickness 100 μm formed from a cured product of the composition exhibits a light transmittance of not more than 5% across the entire visible light range. The composition is solid at room temperature and therefore easy to handle. Further, the composition is useful for producing an opaque silicone adhesive sheet. A cured product obtained by curing the composition can be used to protect a liquid crystal electrode and shield the electrode from light, thereby preventing malfunction of the driver IC, and also exhibits excellent mechanical properties and flexibility, and displays minimal surface tack. | 03-11-2010 |
20100065880 | SILICONE LAMINATED SUBSTRATE, METHOD OF PRODUCING SAME, SILICONE RESIN COMPOSITION FOR PRODUCING SILICONE LAMINATED SUBSTRATE, AND LED DEVICE - A silicone laminated substrate, including a glass cloth, and a cured product of a silicone resin composition with which the glass cloth is filled and a surface of the glass cloth is coated, in which the silicone resin composition includes: (A) an organopolysiloxane having a resin structure consisting of specific siloxane units, (B) an organohydrogenpolysiloxane having a resin structure consisting of specific siloxane units, (C) a platinum group metal-based catalyst, and (D) a filler. The silicone laminated substrate exhibits excellent mechanical properties, flexibility and workability, has minimal surface tack, and is easy to handle. The silicone laminated substrate is produced by impregnating a glass cloth with the silicone resin composition that is dissolved or dispersed in a solvent, subsequently removing the solvent from the glass cloth by evaporation, and subjecting the composition impregnated into the glass cloth to heat curing under compression molding conditions. From the silicone laminated substrate that is used for an LED device, an LED device can be obtained that includes the substrate and an LED chip mounted on top of the substrate. | 03-18-2010 |
20100103507 | VISIBLE LIGHT-SHIELDING SILICONE RUBBER COMPOSITION, CURED PRODUCT, AND OPTOELECTRONIC DEVICE - A visible light-shielding silicone rubber composition is provided comprising (A) an organopolysiloxane, (B) an organohydrogenpolysiloxane, (C) a platinum catalyst, and (D) an azo dye. The azo dye has a light transmittance≦10% in a wavelength range of up to 650 nm and ≧80% in a wavelength range of at least 750 nm when a solution of the azo dye in ethanol is measured by a spectrophotometer. The composition cures into a film which shields visible light, but transmits IR light and is suited for encapsulation of LED. | 04-29-2010 |
20100125116 | HEAT-CURABLE RESIN COMPOSITION - A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B)/carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2, (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C). | 05-20-2010 |
20100197870 | LENS-FORMING SILICONE RESIN COMPOSITION AND SILICONE LENS - Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR | 08-05-2010 |
20100213502 | OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATED WITH SILICONE RESIN - An optical semiconductor device encapsulated with a silicone resin that suffers no discoloration of the lead and exhibits excellent thermal shock resistance. The optical semiconductor device includes an optical semiconductor element and a cured product of a silicone resin composition that encapsulates the optical semiconductor element, wherein the amount of (ΦSiO | 08-26-2010 |
20100224906 | COMPOSITION ENCAPSULATING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR DEVICE USING SAME - A composition for encapsulating optical semiconductors. The composition comprises (A) a mixture of a linear alkenyl group-containing organopolysiloxane and an alkenyl group-containing organopolysiloxane resin containing at least one SiO | 09-09-2010 |
20110105713 | ISOCYANURIC RING-CONTAINING POLYSILOXANE HAVING VINYL GROUPS AT THE TERMINALS - The purpose of the present invention is to provide an isocyanuric ring-containing organopolysiloxane which can provide a cured product which can exploit the properties of a hydrosilylation (addition reaction), and is suitable for use in an encapsulating materials for an optical semiconductor. Thus, the present invention provides an organopolysiloxane having at least one isocyanuric ring in a molecule and vinyl siloxy groups at both terminals, and represented by the following formula (1): | 05-05-2011 |
20110140289 | RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE - A resin composition containing a silica-based filler which differs in refractive index by ±0.03 from the curable base resin and has a thermal conductivity no lower than 0.5 W/m·K, and a light-emitting diode encapsulated with said resin composition. The resin composition is preferably prepared from a curable silicone resin which imparts a cured product having a refractive index of 1.45 to 1.55 and cristobalite powder dispersed therein. | 06-16-2011 |
20110147955 | SILICONE RESIN COMPOSITION AND A CURED PRODUCT THEREOF - The present invention provides a silicone resin composition comprising (A) an organopolysiloxane having at least two alkenyl groups, (B) an organohydrogenpolysiloxane having at least two hydrogen atoms each bonded to a silicon atom, (C) a catalyst comprising a platinum group metal, (D) fine silicone particles, and (E) a (meth)acrylate compound. The present silicone resin composition cures in a short time to form a cured product having excellent adhesion strength with solder resists and copper substrates. | 06-23-2011 |
20110251305 | EPOXY COMPOSITION FOR ENCAPSULATING AN OPTICAL SEMICONDUCTOR ELEMENT - The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof. | 10-13-2011 |
20110269918 | HIGH ADHESIVENESS SILICONE RESIN COMPOSITION AND AN OPTICAL SEMICONDUCTOR DEVICE PROVIDED WITH A CURED PRODUCT THEREOF - The object of the present invention is to provide a silicone resin composition for encapsulating an optical semiconductor element which has strong adhesiveness to a substrate and provide an optical semiconductor element which has high reliability. The present invention provides a silicone resin composition comprising an organopolysiloxane (A) having at least two alkenyl groups per molecule, a liner organohydrogenpolysiloxane (B-1) which has hydrogen atoms each bonded to a silicon atom at the both terminals and a liner organohydrogenpolysiloxane (B-2) which has a hydrogen atom bonded to a silicon atom at one terminal and a hydroxyl or alkoxy group bonded to a silicon atom at the other terminal, a branched organohydrogenpolysiloxane (C) having at least three hydrosilyl groups per molecule, a catalytic (D), and a condensation catalyst (E). The present invention also provides an optical semiconductor device provided with a cured product thereof. | 11-03-2011 |
20110309407 | CYCLOALKYL GROUP-CONTAINING SILICONE RESIN COMPOSITION AND A METHOD OF USING THE SAME - One object of the present invention is to provide a silicone resin composition having remarkably low gas permeability which is useful for a purpose requiring lower gas permeability. Further, another object of the present invention is to provide an optical semiconductor device provided with a cured product obtained by curing the silicone resin composition which has discoloration resistance, durable reflection efficiency and high reliability. The present invention provides a silicone resin composition comprising (A) an organopolysiloxane having at least two alkenyl groups per molecule, and is represented by the average compositional formula (1), (B) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom, and is represented by the average compositional formula (2), (C) a catalytic amount of a curing catalyst, and (D) 0.001 to 3 parts by mass of an antioxidant, relative to a total 100 parts by mass of components (A) and (B). | 12-22-2011 |
20110313123 | SILICONE RESIN LENS AND A METHOD FOR PREPARING THE SAME - The present invention provides a silicone resin lens obtained by molding and curing a silicon resin composition into a lens, wherein the lens has a refractive index at 400 nm of 1.5 or more, a ratio of a refractive index at 400 nm to a refractive index at 596 nm of 1.01 or more, an Abbe's number of 45 or more, and an absolute value of a differential of refractive indexes against temperatures, dn/dT, of 250×10 | 12-22-2011 |
20120007119 | LIGHT-EMITTING SEMICONDUCTOR DEVICE, MOUNTED SUBSTRATE, AND FABRICATION METHOD THEREOF - A light-emitting semiconductor device includes a lead frame having lead electrodes, a reflector arranged with the lead frame, and a light-emitting semiconductor chip accommodated in the reflector and having electrodes connected to the lead electrodes by a flip-chip bonding method, wherein: a gap between the lead frame and the light-emitting semiconductor chip is filled with a cured underfill material, and a cured silicon oxide film of 0.05 to 10 μm thickness is formed covering surfaces of the light-emitting semiconductor chip and reflector. | 01-12-2012 |
20120043577 | CURABLE SILICONE RESIN COMPOSITION AND LIGHT-EMITTING DIODE DEVICE USING THE SAME - This invention discloses a curable silicone resin composition used for sealing a light-emitting diode device, comprising at least a silicone resin having a refractive index of 1.50˜1.55 after curing and a silicon oxide filler having an average particle diameter of 1˜10 μm dispersed uniformly in the said silicone resin at the concentration of 1˜30 mass % and a light-emitting diode device using the same. | 02-23-2012 |
20120056236 | LOW GAS PERMEABLE SILICONE RESIN COMPOSITION AND OPTOELECTRONIC DEVICE - A silicone resin composition comprising (A) an organopolysiloxane containing silicon-bonded aryl and alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane, and (C) an addition reaction catalyst is low gas permeable. An optoelectronic device encapsulated therewith is highly reliable. | 03-08-2012 |
20120184663 | SILICONE RESIN COMPOSITION AND AN OPTICAL SEMICONDUCTOR DEVICE MAKING USE OF THE COMPOSITION | 07-19-2012 |
20120220722 | ADDITION REACTION-CURABLE ORGANOPOLYSILMETHYLENESILOXANE COPOLYMER COMPOSITION - Disclosed is an addition reaction-curable organopolysilmethylenesiloxane copolymer composition including: (A) an organopolysilmethylenesiloxane copolymer represented by formula (a) shown below: | 08-30-2012 |
20120256325 | SILICONE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE USING THE COMPOSITION - A silicone resin composition that exhibits low gas permeability and is suitable for encapsulating optical semiconductors. The composition includes: (A) an organopolysiloxane having a specific structure containing two or more alkenyl groups, (B) an organohydrogenpolysiloxane composed of two organohydrogenpolysiloxanes having specific structures, in which the mass ratio between the two organohydrogenpolysiloxanes is within a range from 10:90 to 90:10, in an amount that provides 0.4 to 4.0 mols of silicon atom-bonded hydrogen atoms within the component (B) per 1 mol of alkenyl groups within the component (A), and (C) an addition reaction catalyst. | 10-11-2012 |
20120261068 | CURABLE SILICONE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPAQUE SILICONE ADHESIVE SHEET FORMED FROM THE COMPOSITION - Disclosed is a curable silicone resin composition that is solid at room temperature, the composition including: (A) an organopolysiloxane having a resin structure consisting of specific siloxane units, (B) an organohydrogenpolysiloxane having a resin structure consisting of specific siloxane units, (C) a platinum group metal-based catalyst, (D) either one or both of an opaque pigment and an opaque dye, and (E) a reaction retarder, in which a layer of thickness 100 μm formed from a cured product of the composition exhibits a light transmittance of not more than 5% across the entire visible light range. A cured product obtained by curing the composition can be used to protect a liquid crystal electrode and shield the electrode from light, thereby preventing malfunction of the driver IC, and also exhibits excellent mechanical properties and flexibility, and displays minimal surface tack. | 10-18-2012 |
20130026522 | SURFACE-MOUNT LIGHT EMITTING DEVICE - A surface-mount light emitting device is provided comprising a light emitting element ( | 01-31-2013 |
20130072592 | METHOD OF PRODUCING CURED THIN FILM USING PHOTOCURABLE SILICONE RESIN COMPOSITION - A cured thin film may be easily prepared, by curing a photocurable silicone resin composition containing: (A) an organopolysiloxane having two or more alkenyl groups within each molecule, (B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms within each molecule, and (C) a photoactive catalyst, by: (i) applying the composition to a substrate, (ii) obtaining a thin film in a semi-cured state by irradiating the applied coating with light, and (iii) heating the thin film in a semi-cured state to achieve complete curing, wherein the spectrum of the light irradiated in step (ii) has a maximum peak in a wavelength region from 300 nm to 400 nm, and the spectral irradiance of light of any wavelength within the wavelength region shorter than 300 nm is not more than 5% of the spectral irradiance of light of the maximum peak wavelength. | 03-21-2013 |
20130113008 | WAVELENGTH CONVERSION SHEET FILLED WITH LARGE AMOUNT OF PHOSPHOR, METHOD OF PRODUCING LIGHT EMITTING SEMICONDUCTOR DEVICE USING THE SHEET, AND LIGHT EMITTING SEMICONDUCTOR DEVICE - A wavelength conversion sheet filled with a large amount of phosphor, enabling the phosphor to be easily dispersed uniformly and in a large amount near the surface of an LED element. Specifically, the sheet includes: a layer formed from a heat-curable resin composition, which contains 100 parts by mass of a resin component and 100 to 2,000 parts by mass of a particulate phosphor in which the proportion of particles having a sphericity of 0.7 to 1.0 is not less than 60% of all the particles, and which exists in a plastic solid or semisolid state in an uncured state at normal temperature, wherein the average particle diameter of the phosphor is not more than 60% of the thickness of the layer formed from the heat-curable resin composition, and the maximum particle diameter thereof is not more than 90% thereof. | 05-09-2013 |
20130161683 | CURABLE SILICONE RESIN COMPOSITION WITH HIGH RELIABILITY AND OPTICAL SEMICONDUCTOR DEVICE USING SAME - An optical semiconductor device that combines low gas permeability and high reliability. A curable silicone resin composition comprising: (A) an alkenyl group-containing organopolysiloxane comprising an organopolysiloxane represented by an average composition formula (1) and containing at least two alkenyl groups per molecule: | 06-27-2013 |
20130200413 | HEAT-CURABLE SILICONE RESIN SHEET HAVING PHOSPHOR-CONTAINING LAYER AND PHOSPHOR-FREE LAYER, METHOD OF PRODUCING LIGHT EMITTING DEVICE UTILIZING SAME AND LIGHT EMITTING SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD - Provided is a heat-curable silicone resin sheet that is able to easily uniformly disperse phosphors on an LED element surface, a method of producing a light emitting device utilizing the same and an encapsulated light emitting semiconductor device obtained by the method utilizing the same. The heat-curable silicone resin sheet includes at least the two layers of a layer 1 including a heat-curable silicone resin composition containing phosphors that is in a plastic solid state or a semi-solid state at room temperature, and a layer 2 including a transparent or a semi-transparent heat-curable silicone resin composition that is in a plastic solid state or a semi-solid state at room temperature. | 08-08-2013 |
20130200425 | PHOSPHOR-CONTAINING ADHESIVE SILICONE COMPOSITION SHEET, AND METHOD OF PRODUCING LIGHT-EMITTING DEVICE USING SAME - An adhesive silicone composition sheet, in which a phosphor is dispersed uniformly and in which the dispersion state of the phosphor is stable over time, which is a solid or semisolid in an uncured state at room temperature and is therefore easy to handle, and which can easily form a silicone resin layer on the surface of an LED chip using conventional assembly apparatus. The adhesive silicone composition sheet is formed from a heat-curable silicone resin composition, which comprises: (1) an organopolysiloxane in which at least 90% of the organic groups bonded to silicon atoms are methyl groups, (2) a curing agent, and (3) a phosphor, and which exists in a plastic solid or semisolid state at normal temperature. | 08-08-2013 |
20130231452 | ORGANOPOLYSILMETHYLENE-SILOXANE AND A CURED PRODUCT THEREOF - Organopolysilmethylene-siloxane of the formula (1): | 09-05-2013 |
20130312906 | Surface-Mount Light Emitting Device - A surface-mount light emitting device is provided comprising a light emitting element ( | 11-28-2013 |
20130331499 | SILICONE RESIN COMPOSITION AND AN OPTICAL SEMICONDUCTOR DEVICE PROVIDED WITH A CURED PRODUCT OBTAINED BY CURING THE SAME - One object of the present invention is to provide a silicone resin composition which has remarkable discoloration resistance and durability of reflection efficiency, and provide an optical semiconductor device having high reliability. The present invention provides a silicone resin composition comprising (A) an organopolysiloxane resin represented by the formula (1) which has at least two alkenyl groups per molecule, (B) an linear organopolysiloxane represented by the formula (2), which has at least two alkenyl groups per molecule, provided that at least a part of a whole amount of components (A) and (B) has at least one cycloalkyl group per molecule, (C) an organohydrogenpolysiloxane represented by the formula (3) which has at least two SiH groups per molecule, in an effective amount to cure the components (A) and (B), and (D) an addition reaction catalyst in a catalytic amount. | 12-12-2013 |
20140073808 | METHOD FOR PREPARING A POLYORGANOSILOXANE - A method for preparing a polyorganosiloxane, wherein the method includes a step of subjecting at least one organic silicon compound having at least one —OX group bonding to a silicon atom in the molecule, wherein X is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an alkoxyalkyl group having 2 to 10 carbon atoms, to a condensation reaction in the presence of a catalyst, wherein the catalyst is one obtained by surface treating at least one selected from the group consisting of hydroxides of elements in Group II of the periodic table, hydrates of hydroxides of elements in Group II of the periodic table and oxides of elements in Group II of the periodic table with a silane coupling agent. | 03-13-2014 |
20140107309 | METHOD FOR PREPARING A POLYORGANOSILOXANE - One object of the present invention is to provide a method for preparing a polyorganosiloxane without using any catalyst having corrosivity and toxicity such as an alkaline earth metal catalyst in a condensation reaction of at least one organic silicon compound having a silanol group and/or an alkoxy silyl group. The present invention is a method for preparing a polyorganosiloxane, wherein the method includes a step of condensation reacting at least one organic silicon compound having at least one —OX group bonding to a silicon atom in the molecule, wherein X is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an alkoxyalkyl group having 2 to 10 carbon atoms, in the presence of a catalyst, wherein the catalyst is at least one selected from the group having hydroxides or oxides of elements in Groups 3-15 of the periodic table. | 04-17-2014 |
20140175488 | HEAT-CURABLE SILICONE RESIN SHEET HAVING PHOSPHOR-CONTAINING LAYER AND WHITE PIGMENT-CONTAINING LAYER, METHOD OF PRODUCING LIGHT EMITTING DEVICE USING SAME AND ENCAPSULATED LIGHT EMITTING SEMICONDUCTOR DEVICE PRODUCED THEREBY - Provided are a heat-curable silicone resin sheet capable of easily and uniformly dispersing phosphors on an LED element surface and reducing a brightness through a light-diffusing effect, a method of producing a light emitting device using the same and an encapsulated light emitting semiconductor device produced by the corresponding method. The heat-curable silicone resin sheet includes at least two layers that are: a phosphor-containing layer consisting essentially of a phosphor-containing heat-curable silicone resin composition that is in a plastic solid or plastic semi-solid state at room temperature; and a white-pigment-containing layer consisting essentially of a white pigment-containing heat-cured silicone resin composition. | 06-26-2014 |
20140213809 | METHOD FOR PREPARING A POLYORGANOSILOXANE AND A POLYORGANOSILOXANE - A method for preparing a polyorganosiloxane represented by the following general formula (1): (R | 07-31-2014 |