Patent application number | Description | Published |
20120104310 | POLYIMIDE PRECURSOR SOLUTION COMPOSITION CONTAINING FILLER, AND POLYIMIDE FILM USING SAME - There is provided a filler-containing dispersion solution exhibiting very improved filler dispersion stability by dispersing a filler in a solvent using a polyimide precursor solution composition. Furthermore, in the filler-containing dispersion solution, a tetracarboxylic dianhydride and/or its derivative is reacted with a diamine compound to prepare a filler-containing polyimide precursor solution composition, which is then used to provide a polyimide in which a filler is dispersed. | 05-03-2012 |
20120168688 | BINDER RESIN COMPOSITION FOR ELECTRODE, ELECTRODE MIXTURE PASTE, AND ELECTRODE - The present invention relates to a binder resin composition for an electrode, including a polyamic acid and a solvent, wherein the polyamic acid is (i) a polyamic acid which includes a tetracarboxylic acid component including 10 to 100 mol % of 4,4′-oxydiphthalic acid and 90 to 0 mol % of 3,3′,4,4′-biphenyltetracarboxylic acid and/or pyromellitic acid and a diamine component including an aromatic diamine having 1 to 4 aromatic rings, (ii) a polyamic acid which includes a tetracarboxylic acid component including 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride and a diamine component including 10 to 90 mol % of p-phenylene diamine and 90 to 10 mol % of 4,4′-diaminodiphenyl ether, or (iii) a polyamic acid which includes a tetracarboxylic acid component including 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride and a diamine component including 40 mol % or more of a bis[4-(4-aminophenoxy)phenyl] compound. | 07-05-2012 |
Patent application number | Description | Published |
20130115473 | PRODUCTION PROCESS OF POLYIMIDE FILM LAMINATE, AND POLYIMIDE FILM LAMINATE - A process for producing a polyimide film laminate includes a substrate and a polyimide film, which includes forming a coating film including a polyamic acid solution composition on the surface of a substrate to produce a laminate composed of the substrate and the polyamic acid solution composition, heating the laminate composed of the substrate and the polyamic acid solution composition at a temperature ranging from at least 150 to 200° C. for 10 minutes or longer, and then heating the heated laminate at a temperature up to 400 to 550° C. | 05-09-2013 |
20130171520 | AQUEOUS POLYIMIDE PRECURSOR SOLUTION COMPOSITION AND METHOD FOR PRODUCING AQUEOUS POLYIMIDE PRECURSOR SOLUTION COMPOSITION - A method for producing an aqueous polyimide precursor solution composition, including reacting a tetracarboxylic dianhydride and a diamine, which has a solubility in water at 25° C. of 0.1 g/L or more, in the presence of an imidazole, using water as a reaction solvent to provide an aqueous polyimide precursor solution composition. | 07-04-2013 |
20130178597 | POLYIMIDE PRECURSOR, POLYIMIDE, AND MATERIALS TO BE USED IN PRODUCING SAME - Disclosed is a novel co-polyimide precursor for producing a polyimide having high transparency. The co-polyimide precursor comprises a unit structure represented by general Formula (A1) and a unit structure represented by general Formula (A2): | 07-11-2013 |
20130327982 | POLYIMIDE SEAMLESS BELT AND PROCESS FOR PRODUCTION THEREOF, AND POLYIMIDE PRECURSOR SOLUTION COMPOSITION - A seamless belt formed of a polyimide including a repeating unit represented by the formula (1): | 12-12-2013 |
20140127497 | METHOD FOR PRODUCING POLYIMIDE LAMINATE, AND POLYIMIDE LAMINATE - A polyimide laminate obtained by casting a polyamic acid solution composition including a phosphorus compound and a polyamic acid, which is obtained from a tetracarboxylic acid component comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride as the main component and a diamine component comprising p-phenylenediamine as the main component, on a substrate; and then heating the polyamic acid solution composition to form a polyimide layer having a thickness of less than 50 μm on the substrate. | 05-08-2014 |
20140134428 | METHOD FOR PRODUCING POLYIMIDE LAMINATE, AND POLYIMIDE LAMINATE - A method for producing a polyimide laminate, including forming a thin film of a polyamic acid solution composition on a substrate; and heating the obtained laminate of the substrate and the thin film of the polyamic acid solution composition at least at a temperature of from more than 150° C. to less than 200° C. for 10 minutes or more, and then heating the laminate at the highest temperature of from 400° C. to 550° C., to form a polyimide layer having a thickness of less than 50 μm on the substrate. | 05-15-2014 |
20140218875 | AQUEOUS POLYIMIDE PRECURSOR SOLUTION COMPOSITION AND METHOD FOR PRODUCING AQUEOUS POLYIMIDE PRECURSOR SOLUTION COMPOSITION - An aqueous polyimide precursor solution composition, in which a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid. | 08-07-2014 |
20140363687 | AQUEOUS POLYIMIDE PRECURSOR SOLUTION COMPOSITION AND METHOD FOR PRODUCING AQUEOUS POLYIMIDE PRECURSOR SOLUTION - An aqueous polyimide precursor solution composition in which a polyamic acid which is obtained by reacting a tetracarboxylic acid component and a diamine component is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 moles or more per mole of the tetracarboxylic acid component of the polyamic acid. | 12-11-2014 |