Patent application number | Description | Published |
20140239998 | Turret Handlers and Methods of Operations Thereof - In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret of a turret handler, transporting the plurality of semiconductor components using the main turret to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component in the first set at a first test pad using a tester while transporting a second semiconductor component in the second set to a second test pad and testing the second semiconductor component using the tester while transporting the first semiconductor component out of the first test pad. The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret. | 08-28-2014 |
20140353766 | Small Footprint Semiconductor Package - A semiconductor assembly includes a substrate with electrically conductive regions and a semiconductor package. The semiconductor package includes a semiconductor die, first and second terminals, and a mold compound. The die has opposing first and second main surfaces, an edge disposed perpendicular to the first and second main surfaces, a first electrode at the first main surface, and a second electrode at the second main surface. The first terminal is attached to the first electrode. The second terminal is attached to the second electrode. The mold compound encloses at least part of the die and the first and second terminals so that each of the terminals has a side parallel with and facing away from the die that remains at least partly uncovered by the mold compound. The first and second terminals of the semiconductor package are connected to different ones of the electrically conductive regions of the substrate. | 12-04-2014 |
20150061140 | Molded Semiconductor Package with Pluggable Lead - A semiconductor package includes a semiconductor die having a plurality of terminals, a molding compound encapsulating the semiconductor die, and a pluggable lead dimensioned for insertion into an external receptacle. The pluggable lead protrudes from the molding compound and provides a separate electrical pathway for more than one terminal of the semiconductor die. The separate electrical pathways of the pluggable lead can be provided by electrical conductors isolated from one another by electrical insulator such as molding compound or other insulation material/medium. | 03-05-2015 |
20150200148 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A semiconductor device is provided, wherein the semiconductor device comprises a carrier, wherein the carrier comprises a first portion configured to hold a semiconductor chip; and a second portion configured for mounting the semiconductor device to a support, the second portion further comprising a first feature configured to be connected to the support; and at least one second feature configured to facilitate transfer of heat away from the first portion, wherein the at least one second feature increases a surface area of the second portion. | 07-16-2015 |
20150214179 | SEMICONDUCTOR DEVICE INCLUDING FLEXIBLE LEADS - A semiconductor device includes a semiconductor chip including a transistor. A first flexible lead is electrically coupled to a first electrode on a first surface of the semiconductor chip. A second flexible lead is electrically coupled to a second electrode on the first surface of the semiconductor chip. A third flexible lead is electrically coupled to a third electrode on a second surface of the semiconductor chip, the second surface opposite to the first surface. | 07-30-2015 |
20150214189 | Semiconductor Device Having Multiple Contact Clips - A semiconductor device includes a device carrier, a first semiconductor chip mounted on the device carrier and a second semiconductor chip mounted on the device carrier. Further, the semiconductor device includes a first contact clip bonded to a first electrode of the first semiconductor chip, a second contact clip bonded to a first electrode of the second semiconductor chip and an insulating connector configured to hold the first contact clip and the second contact clip together. | 07-30-2015 |
20150249047 | Interposer with Programmable Matrix for Realizing Configurable Vertical Semiconductor Package Arrangements - An interposer for establishing a vertical connection between semiconductor packages includes an electrically insulating substrate having a first main side and a second main side opposite the first main side, a plurality of first electrical conductors at the first main side of the substrate, a plurality of second electrical conductors at the second main side of the substrate, and a programmable connection matrix at one or both main sides of the substrate. The programmable connection matrix includes programmable junctions configured to open or close electrical connections between different ones of the first electrical conductors and different ones of the second electrical conductors upon programming of the junctions. | 09-03-2015 |
20150279757 | SEMICONDUCTOR DIE PACKAGE WITH MULTIPLE MOUNTING CONFIGURATIONS - A semiconductor die package includes first, second and third metal blocks insulated from one another. The first metal block has a thinner inner section, a first thicker outer section at a first end of the thinner inner section and a second thicker outer section at a second end of the thinner inner section opposing the first end. The second metal block has a thicker outer section and a thinner inner section protruding inward from the thicker outer section. The third metal block has a thicker outer section and a thinner inner section protruding inward from the thicker outer section. A semiconductor die has a first terminal attached to the thinner inner section of the first metal block, a second terminal attached to the thinner inner section of the second metal block, and a third terminal attached to the thinner inner section of the third metal block. | 10-01-2015 |