Patent application number | Description | Published |
20080305716 | HONING METHOD AND HONING CONTROL DEVICE - A honing method and honing control device suitable for the honing having a large processing area is provided. The honing control device includes a grinder and an expansion member for disposition in a processing hole of a workpiece. The amount of an expanding movement when the grinder contacts the inner surface of a gauge hole via the expansion member is stored as a target expansion amount by inserting a honing head into the gauge hole having the same size as a target processing diameter of a master gauge. Then, a honing of an inner surface of the processing hole is performed by inserting the honing head within a processing hole of a workpiece moving the grinder towards an outer side of a diametrical direction by the expansion member installed within the honing head to rotate the honing head. The honing is completed when the amount of the expanding movement of the grinder reaches a target expansion amount established by the master gauge. | 12-11-2008 |
20090104348 | SPRAYED FILM FORMING METHOD AND APPARATUS - A sprayed film forming method and apparatus in which the thickness of the sprayed film in a predetermined region is increased so as to unify the entire thickness. A sprayed film is formed at a cylinder bore inner surface while a spraying gun is moved in an axial direction during rotation inside the bore. Air inside the bore is sucked out to prevent foreign material from being caught in the sprayed film. The flow rate inside the bore tends to become higher at an axial end on a suction side, resulting in a thinned region. The supply speed of a wire serving as a spraying material to the spraying gun or the number of sprays in this region is higher than those at other portions. The thickness at the axial end of the bore is made equal while suppressing an increase in working time and spraying material used. | 04-23-2009 |
20110000085 | CYLINDRICAL INTERNAL SURFACE PROCESSING METHOD - A cylindrical internal surface processing method comprises forming a cylinder bore, roughening an upper section of the bore, depositing coating onto the bore, and machining a lower section of the bore and the coating. The forming of the cylinder bore includes forming the upper and lower sections with the lower section being axially spaced from the upper section and having an axial length greater than zero. The roughening creates a roughened surface such that a radially innermost edge of the roughened surface has an internal diameter smaller than an internal diameter of the lower section. The coating is deposited to cover the upper section and at least a portion of the lower section. The machining forms a tapered portion and a cylindrical portion, a radially outermost edge of the cylindrical portion having an internal diameter larger than that of a radially outermost edge of the roughened surface. | 01-06-2011 |
20120304955 | METHOD FOR PROCESSING CYLINDER BLOCK, CYLINDER BLOCK AND THERMAL-SPRAYED CYLINDER BLOCK - A method for processing a cylinder block is disclosed, wherein a protrusion protruding toward a crankcase is provided at a crankcase-side edge of a cylinder bore and a sprayed coating is formed on an inner surface of the cylinder bore and an inner surface of the protrusion continuous with the inner surface of the cylinder bore. After forming the sprayed coating, at least part of the protrusion is removed together with the sprayed coating formed on the inner surface of the protrusion. Accordingly, even in the case of removing the edge portion of the cylinder bore on the crankcase side, a sufficient margin to be removed can be ensured while a reduction in size of the cylinder block is achieved. | 12-06-2012 |
20140311438 | METHOD FOR MANUFACTURING CYLINDER BLOCK AND CYLINDER BLOCK - A thermally sprayed coating is formed on an inner surface of a cylinder bore of a cylinder block by using a thermal spray gun. The thermal spray gun is reciprocated along an axial direction in the cylinder bore while being rotated, and injects melted droplets generated by melting a wire made of a ferrous material from a nozzle at its end. At this time, a moving speed of the thermal spray gun along the axial direction into the cylinder bore is made equal-to or larger-than a predetermined value, and the number of reciprocating cycles of the thermal spray gun along the axial direction into the cylinder bore is made equal-to or larger-than a predetermined value. | 10-23-2014 |
20140345135 | METHOD FOR MANUFACTURING CYLINDER BLOCK - In a method for manufacturing a cylinder block provided with cylinder bores, the cylinder block is held by a clamp device, stress is generated in the cylinder block by a holding force of the clamp device to duplicate deformations of the cylinder bores after assembling hearing caps thereon, boring is carried out with the cylinder bores deformed in a condition where the stress is generated, and a thermally sprayed coating is formed, after the boring, on each inner surfaces of the cylinder bores deformed in the condition where the stress is generated. According to the method for manufacturing a cylinder block, superior cylindricity, after assembling the bearing caps, of the cylinder bores on each of which the thermally sprayed coating is formed can be brought, and workability degradation of finishing works (honing) for each inner surface of the cylinder bores (thermally sprayed coatings) can be restricted. | 11-27-2014 |
20150044385 | METHOD FOR FINISHING WORK OF SPRAY-COATED SURFACE, AND WORKING TOOL - In a method for a finishing work of a spray-coated surface, an inner surface of a cylindrical hollow member is roughened by forming a helical groove thereon. A thermal spray coating is formed on the inner surface that is roughened, and a finishing work is carried out by cutting the thermal spray coating along a helix of the groove by use of a cutting tool. According to the method for a finishing work, a finishing work of a thermal spray coating with non-uniform hardness can be carried out efficiently. | 02-12-2015 |
Patent application number | Description | Published |
20130252071 | BATTERY - According to one embodiment, a battery includes, an electrode body includes a positive electrode plate, a negative electrode plate, and an insulating separator disposed between the positive and negative electrode plates, a lead electrically connected to the electrode body, and a metal terminal includes a cavity electrically connected to the lead at any one point. | 09-26-2013 |
20130302663 | ASSEMBLED BATTERY - According to one embodiment provides an assembled battery which comprises electric cells each having a protruding electrode terminal, a bus bar which is connected to the electrode terminal, also electrically connected to the electrode terminal, and comprises an accommodating portion that has an opening and accommodates the electrode terminal along a protruding direction of the protruding portion from the opening, and a protruding portion which is formed on one of a peripheral surface of the electrode terminal along the protruding direction and an inner surface of the accommodating portion along the protruding direction, protrudes toward the other of the peripheral surface and the inner surface, extends in the protruding direction, and comes into contact with the other. | 11-14-2013 |
Patent application number | Description | Published |
20140287202 | TRANSFER MOLD MANUFACTURING METHOD, TRANSFER MOLD MANUFACTURED THEREBY, AND COMPONENT PRODUCED BY THE TRANSFER MOLD - A transfer mold that is used in production of a component by electroplating and has high workability and superior durability as well as a component produced thereby are provided. A method therefor includes the steps of forming a pattern of a desired component by providing a reverse pattern of the pattern of the desired component on a metal substrate and etching the metal substrate using the reverse pattern as a mask and treating the reverse pattern with heat or removing the reverse pattern and forming an insulation layer in a portion where the reverse pattern has been removed. | 09-25-2014 |
20140291157 | TRANSFER MOLD MANUFACTURING METHOD, TRANSFER MOLD MANUFACTURED THEREBY, AND COMPONENT PRODUCED BY THE TRANSFER MOLD - A transfer mold, which has superior durability and high aspect ratio, for production of a component by electroplating and a component produced thereby are provided. A method therefor includes the steps of forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern forming a desired angle, creating a transfer mold by filing up the resist pattern having the shape of the component by electroplating to a predetermined thickness and providing a master mold by separating the transfer mold from the metal substrate. | 10-02-2014 |
20140311911 | MULTI-STAGE TRANSFER MOLD MANUFACTURING METHOD, MULTI-STAGE TRANSFER MOLD MANUFACTURED THEREBY, AND COMPONENT PRODUCED THEREBY - A multi-stage transfer mold manufacturing method that can save labor in a step of connecting by a multi-stage connection, a multi-stage transfer mold manufactured thereby, and a component produced thereby are provided for production of a multi-stage component by electroplating. A method therefor includes the steps of forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern forming a desired angle, forming, on the resist pattern, a resist pattern having a shape and a thickness of a connection pillar for connecting with an upper layer, creating a transfer mold by filling up the resist pattern on which the resist pattern having the shape of the connection pillar by electroplating to a predetermined thickness, and providing a master mold by separating the transfer mold from the metal substrate. | 10-23-2014 |
Patent application number | Description | Published |
20100046275 | NONVOLATILE SEMICONDUCTOR STORAGE APPARATUS AND DATA PROGRAMMING METHOD THEREOF - The semiconductor storage apparatus includes a memory cell array including memory cells each having a rectifying element and a variable resistive element connected in series, the memory cells being arranged in crossing portions of a plurality of first wires and a plurality of second wires, and a control circuit configured to control charging to the first wire. The control circuit charges the first wire connected to a selected memory cell up to a first potential, and then set the first wire in a floating state. Then it charges another first wire adjacent to the first wire connected to the selected memory cell to a second potential. The potential of the first wire connected to the selected memory cell is thereby caused to rise to a third potential by coupling. | 02-25-2010 |
20110044090 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment includes: a memory cell array including a plurality of first lines and second lines intersecting each other and a plurality of memory cells connected at intersections of the plurality of first lines and second lines; and a first line control circuit and a second line control circuit configured to select the first lines and the second lines respectively to supply a voltage or current necessary for a resetting operation or a setting operation on the memory cells. The first line control circuit supplies unselected ones of the first lines with an unselecting voltage corresponding to the distance between the unselected first lines and the second line control circuit. | 02-24-2011 |
20110066878 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes a memory cell array including memory cells arranged at respective intersections between first wirings and second wirings. Each of the memory cells includes a rectifier element and a variable resistance element connected in series. A control circuit is configured to apply a first voltage to a selected first wiring and a second voltage lower than the first voltage to a selected second wiring so that a certain potential difference is applied to a selected memory cell positioned at an intersection between the selected first wiring and the selected second wiring. | 03-17-2011 |
20130128673 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes memory cells storing data based on respective threshold voltages, having a positive threshold voltage in a data erased state, and includes respective control electrodes. Word lines are selectively electrically connected to the control electrodes of the memory cells, and charged to a potential before writing data to the memory cells. A voltage generator outputs a voltage at an output and includes a first path which discharges the output. A connection circuit is selectively electrically connected to the output of the voltage generator and a first word line, and selectively electrically connects the first word line to a first node which supplies a potential. | 05-23-2013 |