Patent application number | Description | Published |
20090061362 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING DOUBLE PATTERNING AND MASK - To provide a semiconductor device manufacturing method using double patterning, in which layout patterns are distributed avoiding yield reduction factors. The semiconductor device manufacturing method includes the steps of: preparing a plurality of masks for use in the double patterning; and performing the double patterning using the plurality of masks. The step of preparing the plurality of masks includes a step of distributing a group of layout patterns to the plurality of masks, in accordance with characteristics of exposure steps respectively using the plurality of masks, and in consideration of size of the layout patterns. | 03-05-2009 |
20090278569 | Semiconductor Device and its Manufacturing Method, Semiconductor Manufacturing Mask, and Optical Proximity Processing Method - An object of the present invention is to reduce processing time and manufacturing cost for a semiconductor device including a logic circuit. To accomplish the above object, an area ( | 11-12-2009 |
20120091510 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, MASK FOR SEMICONDUCTOR MANUFACTURE, AND OPTICAL PROXIMITY CORRECTION METHOD - An object of the present invention is to reduce processing time and manufacturing cost for a semiconductor device including a logic circuit. To accomplish the above object, an area ( | 04-19-2012 |
20130249597 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD THEREOF, MASK FOR SEMICONDUCTOR MANUFACTURE, AND OPTICAL PROXIMITY CORRECTION METHOD - An object of the present invention is to reduce processing time and manufacturing cost for a semiconductor device including a logic circuit. To accomplish the above object, an area ( | 09-26-2013 |
Patent application number | Description | Published |
20130058687 | BELT DRIVING APPARATUS AND IMAGE FORMING APPARATUS - A belt driving apparatus includes: an endless belt having a stepped region at its edge; a driving member for driving the endless belt; a moving member for moving the endless belt in a widthwise direction; a mark provided at a part of the endless belt with respect to a circumferential direction and located at a position corresponding to the stepped region of the endless belt with respect to a rotational direction; a mark detecting member for detecting the mark during rotation of the endless belt; an edge position detecting member for detecting a widthwise position of at least one of edges of the endless belt during rotation; and a controller for controlling, after the mark detecting member detects the mark, the moving member on the basis of a detection result of the edge other than the stepped region of the endless belt. | 03-07-2013 |
20130129394 | IMAGE FORMING APPARATUS INCLUDING TRANSFER BELT - An image forming apparatus includes: a belt position detection unit configured to detect a position of a transfer belt in a rotating shaft direction of a driving roller; a roller driving unit configured to tilt a steering roller to control the position of the transfer belt in the rotating shaft direction of the driving roller; a storage unit configured to store data about a reference position of a steering roller; and a control unit configured to acquire data about a tilt amount of the steering roller with respect to the reference position and control, in the rotating shaft direction of the driving roller based on the data about the tilt amount, a formation position of a toner image formed on each of the plurality of image carriers by the image forming unit. | 05-23-2013 |
20130287420 | IMAGE FORMING APPARATUS - An image forming apparatus includes a first detection portion at a first guide provided in an image forming unit and a second detection portion at a second guide provided in a unit drawable to the exterior of the image forming apparatus. Since there are many parts in this apparatus, an error in the relative positions of the first and the second detection portions is large. The image forming apparatus includes a lock member configured to lock the unit to an image forming apparatus main body, and a pressure member configured to, when the unit is locked to the image forming apparatus main body, press the first guide and the second guide to each other. As a result, adjustment of the relative positions of the first and the second detection portions is not required at the time of replacement of the unit or the detection portions. | 10-31-2013 |
20130287438 | IMAGE FORMING APPARATUS - An image forming apparatus includes: an image bearing member; a transfer member; and a contact-and-separation portion. The contact-and-separation means includes: an urging member; a movement driving portion; and a controller for controlling the movement driving portion so that the transfer member is locatable at a contact position where the transfer member is contacted to the image bearing member, a first spaced position where the transfer member is spaced from the image bearing member in a state in which a load by the urging force is exerted on the movement driving portion, and a second spaced position where the transfer member is spaced from the image bearing member in a state in which the load by the urging force is not exerted on the movement driving portion. | 10-31-2013 |
20140042687 | IMAGE FORMING APPARATUS - Provided is an image forming apparatus capable of improving operation performances. Sheet feeding cassettes and having sheet stacking portions SS | 02-13-2014 |
Patent application number | Description | Published |
20100301466 | SEMICONDUCTOR DEVICE - The reliability of a semiconductor device is to be improved. A microcomputer chip (semiconductor chip) having a plurality of pads formed on a main surface thereof is mounted over an upper surface of a wiring substrate in an opposed state of the chip main surface to the substrate upper surface. Pads coupled to a plurality of terminals (bonding leads) formed over the substrate upper surface comprise a plurality of first pads in which a unique electric current different from the electric current flowing through other pads flows and a plurality of second pads in which an electric current common to the pads flows or does not flow. Another first pad of the first pads or one of the second pads are arranged next to the first pad. The first pads are electrically coupled to a plurality of bonding leads respectively via a plurality of bumps (first conductive members), while the second pads are bonded to the terminals via a plurality of bumps (second conductive members). | 12-02-2010 |
20130128647 | DATA PROCESSING DEVICE - A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board. | 05-23-2013 |
20140160826 | DATA PROCESSING DEVICE - A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board. | 06-12-2014 |
20140193954 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The reliability of a semiconductor device is to be improved. A microcomputer chip (semiconductor chip) having a plurality of pads formed on a main surface thereof is mounted over an upper surface of a wiring substrate in an opposed state of the chip main surface to the substrate upper surface. Pads coupled to a plurality of terminals (bonding leads) formed over the substrate upper surface comprise a plurality of first pads in which a unique electric current different from the electric current flowing through other pads flows and a plurality of second pads in which an electric current common to the pads flows or does not flow. Another first pad of the first pads or one of the second pads are arranged next to the first pad. The first pads are electrically coupled to a plurality of bonding leads respectively via a plurality of bumps (first conductive members), while the second pads are bonded to the terminals via a plurality of bumps (second conductive members). | 07-10-2014 |
20150036406 | DATA PROCESSING DEVICE - A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board. | 02-05-2015 |