Tan, MY
Boon Teck Tan, Johor Barhru MY
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20100011630 | STEAM IRONING DEVICE, IRONING BOARD AND IRONING SYSTEM, WITH MEANS FOR PROVIDING AN ELECTRICALLY CHARGED STEAM OUTPUT - A steam ironing device ( | 01-21-2010 |
Boon Tek Tan, Johor Bahru MY
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20120042547 | STEAM DISCHARGE UNIT FOR USE IN A SOLEPLATE OF A STEAM IRON - A steam discharge unit ( | 02-23-2012 |
Chang Kian Tan, Bayan Lepas MY
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20140075123 | Concurrent Control For A Page Miss Handler - In an embodiment, a page miss handler includes paging caches and a first walker to receive a first linear address portion and to obtain a corresponding portion of a physical address from a paging structure, a second walker to operate concurrently with the first walker, and a logic to prevent the first walker from storing the obtained physical address portion in a paging cache responsive to the first linear address portion matching a corresponding linear address portion of a concurrent paging structure access by the second walker. Other embodiments are described and claimed. | 03-13-2014 |
Cheah Heng Tan, Bayan Lepas MY
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20110136438 | METHOD AND APPARATUS FOR MAINTAINING TRANSMIT AUDIO IN A HALF DUPLEX SYSTEM - A method for maintaining transmit audio quality under harsh environmental conditions, the method includes receiving audio signals into a microphone of a portable communication device and determining at least one parameter associated with the received audio signals. In accordance with an embodiment, the at least one parameter is compared with a received audio parameter threshold. When the at least one parameter falls outside of the received audio parameter threshold, the audio routing is switched from the microphone to the loudspeaker. Subsequent communication may revert back to the microphone or remain at the loudspeaker depending on monitored audio conditions. | 06-09-2011 |
20120134304 | ACOUSTIC PORTING FOR A PORTABLE COMMUNICATION DEVICE - A portable full duplex communication device ( | 05-31-2012 |
20130136276 | METHOD AND APPARATUS FOR RECEIVING AND PLAYING A SIGNAL IN A RADIO RECEIVER - A method and apparatus for receiving and playing a signal in a radio receiver to suppress microphonic feedback are provided by alternately pitch shifting a received audio signal. The pitch of the received audio signal is alternately shifted up and then down, repeatedly over successive intervals of the audio signal, to produce a pitch swing signal which is then played over a speaker. The alternating pitch shifting prevents the buildup of regenerative feedback normally caused by acoustic vibrations coupling into the radio receiver. | 05-30-2013 |
20150086026 | INTRINSICALLY SAFE AUDIO CIRCUIT FOR A PORTABLE TWO-WAY RADIO - An intrinsically safe audio circuit and intrinsically safe portable two-way radio device meet conventional audio output requirements and intrinsically safe design limitations by separating the speaker coil of the device's speaker into separate coils to limit the energy storage possible in any one of the coils. Each separate coil is driven by one of several different audio power amplifiers that each output a substantially identical signal, and each of which are current limited. | 03-26-2015 |
Chee Voon Tan, Seremban MY
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20110121439 | SEMICONDUCTOR DEVICE WITH PROTRUDING COMPONENT PORTION AND METHOD OF PACKAGING - A semiconductor package device having a protruding component portion and a method of packaging the semiconductor device is disclosed. The semiconductor device has a component, such as a leadframe, and a packaging mold body. The packaging mold body is formed around a portion of the component and a recess is formed in the packaging mold body adjacent the protruding portion of the component to prevent the protruding portion of the component from damaging other adjacent and abutting semiconductor devices. | 05-26-2011 |
20140110828 | Semiconductor Packages and Methods of Formation Thereof - In accordance with an embodiment of the present invention, a semiconductor device includes a lead frame having a die paddle and a lead. A chip is disposed over the die paddle of the lead frame. The semiconductor device further includes a clip, which is disposed over the chip. The clip couples a pad on the chip to the lead of the lead frame. The clip also includes a heat sink. | 04-24-2014 |
Cheng Ann Tan, View MY
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20090216898 | WIRELESS TRANSPORTATION PROTOCOL - A data transportation protocol ( | 08-27-2009 |
Cheng Why Tan, Cheng City MY
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20110147788 | SEMICONDUCTOR DEVICE WITH A LIGHT EMITTING SEMICONDUCTOR DIE - A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements. | 06-23-2011 |
Ching Mei Tan, Serdang MY
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20130189407 | METHOD AND APPARATUS FOR HIGH INTENSITY ULTRASONIC TREATMENT OF BAKING MATERIALS - The present invention discloses a high intensity ultrasonic treatment method and apparatus that is used in conjunction with an existing commercial dough or batter mixer to enhance the rheological, aeration and textural properties of the dough or batter. This change in properties is a result of the phenomenon of acoustic cavitation induced in the dough or batter by treatment with high intensity ultrasonic waves. The present invention discloses a mixing bowl ( | 07-25-2013 |
Chin Jye Tan, Selangor MY
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20100144658 | NOVEL ANTIBIOTICS, BISPOLIDES A1, A2, AND A3 AS WELL AS BISPOLIDES B1, B2A, B2B AND B3 AND PROCESSES FOR PRODUCING SAID ANTIBIOTICS - Seven novel antibiotic substances could be produced by cultivation of a microbial strain which has been isolated from a soil sample and which is designated as | 06-10-2010 |
Chin Kong Tan, Pulau Pinang MY
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20100289215 | STACKING MEANS ENABLING IMPROVED FORMATION OF ILLUSTRATIONS - The present invention relates generally to an improved and enhanced means enabling formation of illustrations wherein the overall illustration formed may comprise differing desired heights to show depth or three dimensional effect of illustrations formed by employing a plurality of stacker units in combination with puzzle units to enhance the height desired, said stacker unit comprising a holed head configured to have a central inwardly burrow and a leg for lodgment onto a substrate member having a plurality of holes of compatible dimension for complementary and snug abutment leaving the holed head of the stacker unit above the substrate member [now acting as an elevated substrate member] for accommodating the leg of a puzzle unit thus enhancing the height of the puzzle unit. | 11-18-2010 |
Chin Leong Tan, Selangor MY
Patent application number | Description | Published |
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20100289215 | STACKING MEANS ENABLING IMPROVED FORMATION OF ILLUSTRATIONS - The present invention relates generally to an improved and enhanced means enabling formation of illustrations wherein the overall illustration formed may comprise differing desired heights to show depth or three dimensional effect of illustrations formed by employing a plurality of stacker units in combination with puzzle units to enhance the height desired, said stacker unit comprising a holed head configured to have a central inwardly burrow and a leg for lodgment onto a substrate member having a plurality of holes of compatible dimension for complementary and snug abutment leaving the holed head of the stacker unit above the substrate member [now acting as an elevated substrate member] for accommodating the leg of a puzzle unit thus enhancing the height of the puzzle unit. | 11-18-2010 |
Chin Nyap Tan, Panang MY
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20100277925 | Lighting Structure with Multiple Reflective Surfaces - A system and method for lighting structure designs, for example LED packaging, reflector designs and optics in lighting fixture, has been illustrated. In one embodiment, the lighting structure has multiple reflective surfaces such that a first reflective surface and a second surface form a first angle less than 90 degree while the second surface and a third reflective surface forms a second angle of less than 270 degree. The method can be applied in both LEDs package designs and second level optical application designs of a light module. | 11-04-2010 |
Chin Nyap Tan, Sungai Jawi MY
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20110089463 | Light Source - Light sources are disclosed herein. One embodiment comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer. The substrate may be thinner in the area where the light emitter is affixed than in the areas where the first and second electrically conductive layers are affixed. A heat sink may be attached to the second surface of the substrate. | 04-21-2011 |
20110090698 | LIGHT SOURCE - Light sources are disclosed herein. An embodiment of a light sources comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer. | 04-21-2011 |
Chin Ping Tan, Selangor MY
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20080312342 | Process for the Production of Diacylglycerol - The present invention provides a process for producing a diacylglycerol, which comprises, reacting triacylglycerol with water and an enzyme preparation to obtain a mixture comprising of diacylglycerol, monoacylglycerol and free fatty acid; removing water content in the mixture by way of dehydration; and separating monoacylglycerol, free fatty acid and residual triacylglycerol by at least one separation method to obtain a high-purity diacylglycerol. An oil or fat composition comprising of diacylglycerol obtained from the said process and phytosteryl esters and/or ferulic acid esters in an amount of from 0.5% to 25% by weight of diacylglycerol is also provided. | 12-18-2008 |
Chin Tong Tan, Ipoh MY
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20110133932 | SECURITY SEAL - A security electronic seal is described. The electronic seal uses a first shaft to lock an asset, and a second inexpensive consumable shaft to lock the first shaft. These shafts provide an electronic means of monitoring the security of the seal. The seal can detect tampering of the asset secured by the device, and in some implementations provides a wireless notification. | 06-09-2011 |
Chin Wei Ronnie Tan, Pulau Pinang MY
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20120273935 | Semiconductor Device and Method of Making a Semiconductor Device - A semiconductor device and a method of manufacturing a semiconductor device are disclosed. An embodiment comprises forming a bump on a die, the bump having a solder top, melting the solder top by pressing the solder top directly on a contact pad of a support substrate, and forming a contact between the die and the support substrate. | 11-01-2012 |
Chin Wei Ronnie Tan, Ayer Itam MY
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20110309493 | Electronic Device Package Locking System and Method - Device and method for an electronic device package is disclosed. The electronic device package includes a first pad, a second pad and an encapsulation surrounding the first and second pad, wherein the encapsulation includes a first opening underneath the first pad and a second opening underneath the second pad. A first bump is arranged in the first opening and a second bump is arranged in the second opening, wherein the encapsulation mechanically locks the first bump to the first pad and the second bump to the second pad. | 12-22-2011 |
Chip King Tan, Taiping MY
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20090200650 | INTEGRATED CIRCUIT PACKAGE AND A METHOD OF MAKING - An integrated circuit package includes a substrate and a first semiconductor chip. The first semiconductor chip is provided in a cavity on a first side of the substrate. The package further includes a second semiconductor chip provided on a second side of the substrate. The first semiconductor chip and the second semiconductor chip form a stack. | 08-13-2009 |
20120068323 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE - A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface. | 03-22-2012 |
Chip King Tan, Perak MY
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20090194854 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE - A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface. | 08-06-2009 |
Chuan Chien Tan, Kuching MY
Patent application number | Description | Published |
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20140042592 | Bipolar transistor - A bipolar junction transistor is provided with an emitter region, an oxide region, a base region and a collector region. The base region is located between the emitter region and the oxide region and has a junction with the emitter region and an interface with the oxide region. An at least partially conductive element such as metal or silicon is positioned to overlap with at least part of the junction between the base region and the emitter region, thereby forming a gate. The gate also overlaps with at least part of the interface between the base region and the oxide region. When a suitable bias voltage is applied to the gate, the gain of the transistor can be increased. | 02-13-2014 |
Dah Haur Tan, Bayan Lepas MY
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20130043954 | MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) INCLUDING AIR BRIDGE COUPLER - A monolithic microwave integrated circuit (MMIC) includes a transistor, coupled line and multiple air bridges. The coupled line is configured to output a coupled signal from the transistor, the coupled line running parallel to a drain of the transistor. The air bridges connect the drain of the transistor with a bond pad for outputting a transistor output signal, the bridges being arranged parallel to one another and extending over the coupled line. The air bridges and the coupled line effectively provide coupling of the transistor output signal to a load. | 02-21-2013 |
David Tan, Selangor D.e. MY
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20110070379 | LIGHT AND UV STABILISERS - A light stabiliser AS comprising a surface-active or amphiphilic part A which leads to migration of the stabiliser to the surface of a material during the process of formation of a surface, and solidification of the material, and a stabilising part S which is the photochemically active ingredient and transforms the energy of the incident light to vibrational or heat energy that is dissipated within the material, characterised in that both parts are connected by a chemical bond in the form of a single or multiple bond or of an at least divalent bridging group | 03-24-2011 |
Eng Wah Tan, Melaka MY
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20120025217 | LED LIGHTING MODULE - The invention relates to a light emitting diode (LED) module that is characterized by a thermally conductive substrate which is used as the base of the module; a plurality of cavities positioned on the module; each cavity is filled with a transparent or diffused encapsulant material and a plurality of LED semiconductors chips are mounted within each cavity. | 02-02-2012 |
20120025223 | LED LIGHTING DEVICE WITH HIGH COLOUR RE-PRODUCIBILITY - The invention relates to a light emitting diode (LED) lighting device that is comprised of a plurality of LED components and is characterized by the mixture of; a first group of light source provided by blue LEDs mixed with luminescence conversion element and the blue light has a dominant wavelength in the range from 430 nm to 460 nm and the luminescence conversion element absorbs a portion of this blue light and converts to a secondary light have a peak wavelength in the range of 520 nm to 545 nm; a second group of light source provided by LEDs with dominant wavelength in the range of 600 nm to 610 nm and a third group of light source provided by LEDs with dominant wavelength in the range of 615 nm to 625 nm to produce mixture of light that has good color re-producibility. | 02-02-2012 |
20120026731 | LED LIGHTING DEVICE WITH UNIFORM COLOR MIXING - The invention relates to a light emitting diode (LED) lighting device that is comprised of a plurality of LED components and is characterized by the mixture of a primary light provided by the first and majority group of components and a secondary light provided by a second minority group of components and the components emitting the secondary light source have a viewing angle in the range of 130° to 160° and is greater than that of the primary light source. This wide angle of emission ensures that the secondary light is uniformly mixed into the primary light. | 02-02-2012 |
20120256205 | LED LIGHTING MODULE WITH UNIFORM LIGHT OUTPUT - The invention relates to a light emitting diode (LED) module that is characterized by a thermally conductive substrate which is used as the base of the module; and a plurality of cavities positioned on the module; and a plurality of LED semiconductors chips are mounted within each cavity. Within each cavity; secondary cavities are formed and a plurality of LED semiconductors chips are mounted within each of the secondary cavity. A multiple layer configuration of encapsulation is used to fill the cavities to help mix and diffuse the light from the LED chips and ensure that we achieve a uniform light output from the light emitting surface of the module. | 10-11-2012 |
20130277693 | LIGHT EMITTING DIODE (LED) COMPONENT WITH HIGH SIGNAL-TO-NOISE RATIO - The invention relates to a light emitting diode (LED) component that is assembled with a plurality of LED chips, incorporating luminescence conversion element and is characterized by a wide color spectrum ranging from 400 nm to 680 nm and has a high signal-to-noise ratio for each of the peak wavelength in the spectrum. | 10-24-2013 |
Gin Ghee Tan, Bayan Lepas MY
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20130134578 | DEVICE HAVING MULTIPLE WIRE BONDS FOR A BOND AREA AND METHODS THEREOF - Wire bonds are formed at an integrated circuit device so that multiple wires are bonded to a single bond pad. In a particular embodiment, the multiple wires are bonded by first applying a stud bump to the pad and successively bonding each of the wires to the stud bump. Another stud bump can be placed over the bonded wires to provide additional connection security. | 05-30-2013 |
Hiang Teik Tan, Georgetown MY
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20100271134 | High Gain Stacked Cascade Amplifier with Current Compensation to reduce Gain Compression - A high gain stacked cascade amplifier includes a first amplifying element, a second amplifying element, a current mirror bias element, and a dynamic bias adjustment element. The first and second amplifying elements are coupled in series to form the high gain stacked cascade amplifier configuration. The current mirror bias element provides a bias to the first and second amplifying elements. The dynamic bias adjustment element is coupled to the second amplifying element. The dynamic bias adjustment element is configured to increase a gain compression point of a composite filter, formed by the first and second amplifying elements, in response to a determination that an input signal causes gain compression in the first amplifying element. | 10-28-2010 |
Hong Yun Tan, Bayan Lepas MY
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20140070876 | LINEAR VOLTAGE REGULATOR BASED ON-DIE GRID - Described is a linear voltage regulator circuit comprising a first voltage regulator comprising a first source follower having a first node to provide a first power supply, and a second node different from the first node; and a second voltage regulator comprising a second source follower having a first node to provide a second power supply, and a second node different from the first node, wherein the second nodes of the first and second voltage regulators are electrically shorted. | 03-13-2014 |
20140126090 | HIGH-VOLTAGE POWER GATING - Power gating circuits. A transistor stack is coupled between a voltage supply to provide a gated supply voltage. The supply voltage is greater than the maximum junction voltage of the individual transistors in the transistor stack. Termination circuitry for input/output (I/O) lines coupled to operate using the gated supply voltage. The termination circuitry comprising at least a resistive element coupled between an I/O interface and a termination voltage supply. | 05-08-2014 |
20140168881 | THRESHOLD VOLTAGE DEPENDENT POWER-GATE DRIVER - Described is an apparatus which comprises: a first node to provide an un-gated power supply; a second node to provide a threshold dependent supply; an inverter with an input and an output, the inverter coupled to the first and second nodes, the inverter to receive the un-gated power supply at its power supply node, and to receive the threshold dependent supply for supplying ground supply at its ground node; and a transistor with its gate terminal coupled to the output of the inverter, the transistor to provide gated power supply to one or more logic units. | 06-19-2014 |
Jee Hong Tan, Kemaman MY
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20100139572 | Swiflets Farming for Production of Edible Bird's Nests - A swiftlet breeding facility, for use in creating and harvesting edible bird's nests. The facility includes sub-systems for injecting live insect and worm prey, and water, into an aerial enclosure to provide a feeding system imitative of a natural swiftlet feeding environment. | 06-10-2010 |
20120255501 | Swiftlets Farming for Production of Edible Bird's Nests - A swiftlet breeding facility, for use in creating and harvesting edible bird's nests. The facility includes sub-systems for injecting live insect and worm prey, and water, into an aerial enclosure to provide a feeding system imitative of a natural swiftlet feeding environment. | 10-11-2012 |
Jun Tan, Kedah MY
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20140165369 | THREADED INSERT WITH THERMAL INSULATION CAPABILITY - A thermally-insulative insert device and method of use of same is disclosed. Specifically, the thermally-insulative insert device, comprising internal and external threads, allows attachment of an assembled part to a heat source while reducing heat transfer between the assembled part and the heat source. It is also an aspect of the present disclosure to provide easy-to-implement and cost-effective methods of using and assembling the thermally-insulative insert device. | 06-19-2014 |
Kheng Leng Tan, Gelugor MY
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20100289055 | SILICONE LEADED CHIP CARRIER - In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant. | 11-18-2010 |
20110079802 | LIGHT EMITTER - Embodiments of light sources are disclosed herein. An embodiment of the light source comprises a lead frame having a first side and a second side. A hole extends through the lead frame between the first side and the second side. An adhesive is located in the hole and extends beyond the hole, wherein the adhesive extends beyond the diameter of the hole on the first side and the second side of the first lead frame. A light emitter adhered to the adhesive proximate the first side of the first lead frame. | 04-07-2011 |
20110176573 | Silicone Leaded Chip Carrier - In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant. | 07-21-2011 |
20120104436 | LIGHT EMITTING PACKAGE WITH A MECHANICAL LATCH - A surface mount light emitting device package with mechanical latching means for locking a lens on to the package is provided. The surface mount light emitting package may include an encapsulation layer or a lens, a lead frame, at least one lead, a body, a die, and a layer of transparent gel encapsulant material. The lead frame may include at least one protrusion which is bent upward to from at least one latch for engaging the lens. | 05-03-2012 |
20120162979 | LIGHT SOURCE WITH TUNABLE CRI - A light-emitting device with at least two light-emitting dies encapsulated with two different types of the wavelength-converting materials is disclosed. Each of the wavelength-converting materials is configured to produce a visible light from a narrow band light near UV region produced by the light-emitting dies, but with different correlated color temperatures (CCT) and different spectral contents. The combination of the two visible light forms the desired visible white light. The Color rendering index of the light-emitting device is tunable by adjusting the supply current to the light-emitting dies. In another embodiment, a light module with tunable CRI for an illumination system is disclosed. | 06-28-2012 |
Kheng Leng Tan, Bayan Lepas MY
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20090057708 | LED Light Source Having Improved Resistance to Thermal Cycling - A light source and method for making the same are disclosed. The light source includes a substrate, a die, and a cup. The substrate has a plurality of electrical traces thereon and the die includes an LED that is connected to two of the traces. The cup overlies the substrate and is filled with an encapsulant material. The die is located within the cup and is encapsulated by the substrate and the encapsulant material. The cup and encapsulant material have substantially the same coefficient of thermal expansion. The cup can include reflective sidewalls positioned to reflect light leaving the die. The cup, encapsulant and substrate can be constructed from the same material. | 03-05-2009 |
20110044062 | LIGHT SOURCE - An embodiment of a light source comprises a first lead and a second lead. The first lead comprises a first mounting surface wherein a first light emitter is connectable to the first mounting surface, a support member attached to the first mounting surface, a conductor portion attached to the support member, and at least one tab extending from the first mounting surface, the at least one tab being used to hold the first lead during fabrication. The second lead is second lead located adjacent the first lead and comprises a second mounting surface wherein a second light emitter is connectable to the second mounting surface, at least two support members attached to the second mounting surface, and a conductor portion attached to each of the support members. | 02-24-2011 |
Kiah Ling Tan, Bayan Lepas MY
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20140191417 | Multi-Chip Package Assembly with Improved Bond Wire Separation - A multi-chip package is disclosed that has a construction capable of preventing and/or reducing electrical shorts caused by shifts in bond wires. The multi-chip package includes a die attach formed between connection points of a bond wire. The die attach is made of a non-conductive material and can be constructed so as to support or encompass a portion of the bond wire. By contacting the bond wire, the die attach restricts the motion of the bond wire by acting as a physical barrier to the bond wire's movement and/or as a source of friction. In this manner, undesired position shifts of the bond wires can be prevented, reducing device failures and allowing for improved manufacturing allowances. | 07-10-2014 |
Kia Leong Tan, Bayan Lepas MY
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20140189312 | PROGRAMMABLE HARDWARE ACCELERATORS IN CPU - Embodiments of the present invention may include a data processing system comprising a processing execution block to execute instructions stored in an instruction queue, a programmable hardware accelerator, and a controller programmed to monitor the instruction queue to detect a first type of instructions stored in the instruction queue, reprogram the programmable hardware accelerator to execute the first type of instructions, and transmit the first type of instructions to the programmable hardware accelerator to be executed. | 07-03-2014 |
Kim Pin Tan, Bayan Lepas MY
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20120274375 | FREQUENCY CONTROL CLOCK TUNING CIRCUITRY - Circuits and a method for tuning an integrated circuit (IC) are disclosed. The IC includes multiple programmable fuses coupled to a control block. The programmable fuses used may be one-time programmable (OTP) fuses. The control block reads settings or data stored in the programmable fuses. A tuning circuit coupled to the control block receives the delay transmitted by the control block. The tuning circuit allows tuning of the IC without changes to the fabrication mask. The tuning circuit may include delay chains to provide additional delay to the IC when needed and the delay in the tuning circuit is configured based on the delay value stored in the programmable fuses and transmitted by the control block. | 11-01-2012 |
Kuan Loon Tan, Georgetown MY
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20120151109 | Method and apparatus to reduce serial bus transmission power - In some embodiments, a serial bus interface circuit includes at least two serial ports, a memory to store a relationship between serial bus addresses and the at least two serial ports, and a controller to control access to the at least two serial ports. The controller may be configured to receive an access request for a serial bus address, determine a first port of the at least two serial ports corresponding to the serial bus address using the relationships stored in the memory, and disable a second port of the at least two serial ports. Other embodiments are disclosed and claimed. | 06-14-2012 |
20140108845 | METHOD AND APPARATUS TO REDUCE SERIAL BUS TRANSMISSION POWER - In some embodiments, a serial bus interface circuit includes at least two serial ports, a memory to store a relationship between serial bus addresses and the at least two serial ports, and a controller to control access to the at least two serial ports. The controller may be configured to receive an access request for a serial bus address, determine a first port of the at least two serial ports corresponding to the serial bus address using the relationships stored in the memory, and disable a second port of the at least two serial ports. Other embodiments are disclosed and claimed. | 04-17-2014 |
Lan Chu Tan, Shah Alarm MY
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20110084411 | SEMICONDUCTOR DIE - A semiconductor die has a polyimide layer disposed on its top surface. At the corners of the die top, the polyimide layer is roughened or patterned, but not enough such that the die top is exposed. The patterned corners enhance adhesion of a mold compound later disposed on the die top by allowing for enhanced hydrogen bonding between the polyimide layer and the mold compound. | 04-14-2011 |
Lan Chu Tan, Klang MY
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20090134207 | SOLDER BALL ATTACHMENT RING AND METHOD OF USE - A method of attaching a solder ball to a bonding pad includes disposing flux on the bonding pad, attaching a conductive metal ring to the pad using the flux, and placing the solder ball in the ring. A reflow operation is performed that secures the ring to the pad and melts the solder ball into and around the ring. A solder joint is formed between solder ball and the pad, with the ring secured within the ball. Use of the ring allows for higher stand-off height to be achieved with similar solder ball size, without having to use bigger ball size as in the conventional method, which causes solder ball bridging. With higher stand-off height, better board level reliability performance can be obtained. | 05-28-2009 |
20110059579 | METHOD OF FORMING TAPE BALL GRID ARRAY PACKAGE - A method of forming a semiconductor package including providing a substrate having a through hole formed therein. A tape is attached to a surface of the substrate such that the through hole is covered by the tape. An integrated circuit (IC) die is attached to the tape. The IC die is electrically connected to the substrate via a plurality of electrical connections. The IC die and the electrical connections are encapsulated and the tape is removed from the substrate. | 03-10-2011 |
Lan Chu Tan, Seksyen MY
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20120073859 | POLYMER CORE WIRE - A wire capable of conducting electrical current has a polymer core and a coating layer surrounding the core. The coating layer, which may be, for example, gold or copper, conducts electrical current and the core provides strength so that the wire is able to withstand bending and breakage. Among other things, the polymer core wire is useful for connecting an integrated circuit to a lead frame or substrate. | 03-29-2012 |
Lan Chu Tan, Shah Alam MY
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20120139063 | PRESSURE SENSOR AND METHOD OF ASSEMBLING SAME - A method of packaging a pressure sensing die includes providing a lead frame with lead fingers and attaching the pressure sensing die to the lead fingers such that bond pads of the die are electrically coupled to the lead fingers and a void is formed between the die and the lead fingers. A gel material is dispensed via an underside of the lead frame into the void such that the gel material substantially fills the void. The gel material is then cured and the die and the lead frame are encapsulated with a mold compound. The finished package does not include a metal lid. | 06-07-2012 |
20120139067 | PRESSURE SENSOR AND METHOD OF PACKAGING SAME - A method of packaging a pressure sensor die that does not use pre-molded lead frames. Instead a lead frame array is attached to a tape and a non-conductive material is deposited on the lead frames. The non-conductive material is cured and the tape is removed. Pressure sensor dies then are attached to respective die pads of the lead frames and electrically connected to lead frame leads with bond wires. A gel is dispensed onto a top surface of the pressure sensor dies and then a lid is attached to each of the lead frames to cover the pressure sensor dies. The lead frames are singulated to form individual pressure sensor packages. | 06-07-2012 |
20120168884 | PRESSURE SENSOR AND METHOD OF PACKAGING SAME - A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant. | 07-05-2012 |
20120306031 | SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME - A semiconductor sensor die is packaged with a footed lid that has side walls and a top portion with a central hole. Gel material is dispensed into a cavity formed by the side walls such that it covers the die prior to attaching the lid top portion. | 12-06-2012 |
Lee Li Tan, Selangor MY
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20100144658 | NOVEL ANTIBIOTICS, BISPOLIDES A1, A2, AND A3 AS WELL AS BISPOLIDES B1, B2A, B2B AND B3 AND PROCESSES FOR PRODUCING SAID ANTIBIOTICS - Seven novel antibiotic substances could be produced by cultivation of a microbial strain which has been isolated from a soil sample and which is designated as | 06-10-2010 |
Meng Whui Tan, Bayan Lepas MY
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20100266158 | SYSTEM AND METHOD FOR OPTICALLY TRACKING A MOBILE DEVICE - A system and method for optically tracking a mobile device uses a first displacement value along a first direction and a second displacement value along a second direction, which are produced using frames of image data of a navigation surface, to compute first and second tracking values that indicate the current position of the mobile device. The first tracking value is computed using the second displacement value and the sine of a tracking angle value, while the second tracking value is computed using the second displacement value and the cosine of the tracking angle value. The tracking angle value is an angle value derived using at least one previous second displacement value. | 10-21-2010 |
Meng Whui Tan, Sungai Ara MY
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20080212870 | COMBINED BEACON AND SCENE NAVIGATION SYSTEM - A controller and navigation system to implement beacon-based navigation and scene-based navigation is described. The navigation system may generate position data for the controller to compensate for a misalignment of the controller relative to the coordinate system of the navigation system. The navigation system may also distinguish between a beacon light source and a non-beacon light source. | 09-04-2008 |
20090256724 | SYSTEM AND METHOD FOR PERFORMING AN OPTICAL TRACKING OPERATION USING RELATIVE REFERENCING - A system and method for performing an optical tracking operation computes a translated movement value of a displacement values using a relationship between a reference displacement value derived using a reference surface and a corresponding displacement value using a target surface. The displacement value is produced using image correlation by optically sensing the target surface. The translated movement value is used for the optical tracking operation. | 10-15-2009 |
20100172545 | ABSOLUTE TRACKING IN A SUB-PIXEL RANGE - An optical navigation device for absolute tracking in a sub-pixel range. The optical navigation device includes an image sensor and a tracking engine. The image sensor includes a pixel array to generate a plurality of tracking images. The tracking images correspond to incident light at the pixel array. The tracking engine determines a sub-pixel displacement value of a tracking surface based on a comparison of at least two of the tracking images. The tracking engine includes a sub-pixel approximation engine and a linear approximation engine. The sub-pixel approximation engine generates an intermediate sub-pixel displacement value based on a sub-pixel approximation according to a non-linear sub-pixel distribution. The linear approximation engine generates a final sub-pixel displacement value from the intermediate sub-pixel displacement value. | 07-08-2010 |
Michael Tan, Johor MY
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20100218337 | HOVER VACUUM CLEANER - A self-propulsion hovering vacuum cleaner for domestic or industrial application has air outlets predisposed symmetrically along the longitudinal axis of the underside of the casing for directing more air to the front and back directions of the vacuum cleaner to achieve even distribution of air underneath the vacuum cleaner, thereby reducing juddering or rocking effects. The underside of the casing has a curved surface predisposed symmetrically along the longitudinal axis of the underside of the casing for better retention of air to enhance the hovering effect. In another embodiment of the present invention, air distribution channels are predisposed symmetrically on both sides of the underside of the casing along the longitudinal axis. The air distribution channels are in communication with the air outlets for directing more air to the front and back of the vacuum cleaner. The improved hovering vacuum machine also has self-propulsion features and self-cooling features. | 09-02-2010 |
Ming Hui Tan, Penampang MY
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20130319506 | SOLAR CONCENTRATOR ASSEMBLY - The present invention provides a solar concentrator assembly comprising a non-imaging dish concentrator and a photovoltaic receiver for the application of concentrator photovoltaic system that provides uniform solar flux, matches the square or rectangular solar images to the square or rectangular dimension of the photovoltaic receiver and produces high solar concentration ratio. The present invention also provides a solar concentrator assembly that is cost effective and has simpler mechanical structure. | 12-05-2013 |
Rosalina Roslan Tan, Serdang MY
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20110189222 | COMPOSITION FOR WOUND HEALING - A composition to be orally administered and/or topically applied for enhancing wound healing, tissue repair and cardiovascular health protection comprising an extract of vegetative parts of Ipomoea, Arecaceae plant family and/or seaweeds through extraction using alcoholic solvent with or without combination with a co-solvent, which may be aqueous or organic as an active ingredient. | 08-04-2011 |
Shook Gunn Tan, Georgetown MY
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20110267257 | METHOD AND APPARATUS FOR DISPLAYING AN IMAGE ON A COMMUNICATION DEVICE - A method and apparatus for displaying an image on a communication device are provided. The communication device is formed of a housing ( | 11-03-2011 |
Siang Lin Tan, Bayan Lepas MY
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20090083021 | EMULATION OF AHCI-BASED SOLID STATE DRIVE USING NAND INTERFACE - A device, method, and system are disclosed. In one embodiment, the device includes an emulator to facilitate direct communication between an advanced host controller interface (AHCI) software driver and NAND host controller interface (HCI) hardware. | 03-26-2009 |
Siang Yeong Tan, Tanjun Bunga MY
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20140132216 | TECHNIQUES FOR SERIAL INTERFACE CHARGING - Techniques for serial interface charging are described. An apparatus may comprise, for example, a serial interface such as a thunderbolt interface and a charger control circuit coupled to the serial interface, the charger control circuit arranged to operate in a charging mode or an on-the-go (OTG) mode based on information received from the serial interface. Another apparatus may comprise, for example, a serial interface such as a thunderbolt interface and a charger circuit coupled to the serial interface, the charger circuit arranged to operate in a first charging mode or a second charging mode based on information received from the serial interface, the information comprising characteristics of a device coupled to the serial interface. Other embodiments are described and claimed. | 05-15-2014 |
Siew Hwa Tan, Klang MY
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20140155266 | POTENTIATOR FOR SOLUBLE LIQUID HERBICIDE - An emulsion composition for use as potentiator in a soluble liquid herbicide formulation comprising a natural oil-based ester, a hydrophilic surfactant, a lipophilic surfactant, a natural oil-based ethanol amide co-surfactant and a natural oil-based glyceride ethoxylate co-surfactant. | 06-05-2014 |
Soon Yoeng Tan, Skudai MY
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20100196805 | MASK AND METHOD TO PATTERN CHROMELESS PHASE LITHOGRAPHY CONTACT HOLE - A method of making a mask is disclosed. The method includes providing a first and a second mask layers and disposing a first phase shift region on the first mask layer. A second phase shift region is disposed on the second mask layer, wherein the first and second phase shift regions are out of phase. A continuous unit cell is formed in the first phase shift region. The unit cell comprises a center section and distinct extension sections. The extension sections are contiguous to and extend outwards from the center section. The distinct extension sections have a same width as the center section. The second phase shift region is adjacent to the unit cell in the first phase shift region. | 08-05-2010 |
Sze Lin Celine Tan, Melaka MY
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20130154123 | Semiconductor Device and Fabrication Method - In various embodiments, a semiconductor device may include: a carrier; a semiconductor chip disposed over a first side of the carrier; a layer stack disposed between the carrier and the semiconductor chip or over a second side of the carrier opposite the semiconductor chip, or both, the layer stack including at least a first electrically insulating layer, the first electrically insulating layer having a laminate having a first electrically insulating matrix material and a first mechanically stabilizing material embedded in the first electrically insulating matrix material. | 06-20-2013 |
Take Huat Tan, Selangor MY
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20080197065 | Sintered polymeric materials and applications thereof - The present invention provides sintered polymeric materials and methods of making the same which are useful in a variety of applications. In one embodiment, the present invention provides a sintered polymeric material comprising at least one plastic and at least one elastomer. | 08-21-2008 |
Tat Kin Tan, Balik Pulau MY
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20120166792 | EFFICIENT NEMO SECURITY WITH IBE - An apparatus, method and system are provided to use identity based encryption (IBE) in Mobile IP and/or Network Mobility (NEMO) compliant communication networks to secure communications between various entities of the communication networks, as selected entities and their associated apparatus/system roam among the communication networks. Other embodiments may be disclosed or claimed. | 06-28-2012 |
Teik Sin Tan, Pulau MY
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20110104544 | METHOD AND APPARATUS FOR DISASSEMBLING A HERMETICALLY SEALED BATTERY - A battery pack includes a cover coupled to a housing, wherein the cover and the housing are hermetically sealed to enclose one or more batteries. A wire is integrally molded within a perimeter of the cover to allow for the removal of the cover from the housing upon application of current to the wire. The wire is molded within the cover so as to be co-located along an edge of the housing. First and second contacts are coupled to the wire and remain exposed on the cover. The cover can be separated from the housing in response to current being applied to the first and second contacts and pulling of the wire. | 05-05-2011 |
Tek Seng Tan, Desa Ara MY
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20100117222 | Void Reduction in Indium Thermal Interface Material - Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling. | 05-13-2010 |
Tien Lai Tan, Melaka MY
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20090045493 | SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING - A semiconductor component and method for producing. The semiconductor component includes a semiconductor device and a leadframe. A package layout is defined and the orientation of electrically conductive members with respect to the semiconductor device and inner contact areas of the leadframe is altered so as to maximize the interfacial bonding area. The constraints of the standard package dimensions and the component assembly method are taken into account. | 02-19-2009 |
20090137086 | METHOD FOR MAKING A DEVICE INCLUDING PLACING A SEMICONDUCTOR CHIP ON A SUBSTRATE - A method for making a device is disclosed. One embodiment provides a substrate having a first element protruding from the substrate. A semiconductor chip has a first electrode on a first surface and a second electrode on a second surface opposite to the first surface. The semiconductor chip is placed over the first element of the substrate with the first surface of the semiconductor chip facing the substrate. The second electrode of the semiconductor chip is electrically coupled to the substrate, and the substrate is at least partially removed. | 05-28-2009 |
20090189259 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING - An electronic device and method of manufacturing. One embodiment includes attaching a first semiconductor chip to a first metallic clip. The first semiconductor chip is placed over a leadframe after the attachment of the first semiconductor chip to the first metallic clip. | 07-30-2009 |
Tien Tjiu Tan, Mt. Kiara, Kuala Lumpur MY
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20100166340 | Pack of unfolded plastic bags - In an embodiment of the invention, a bottom seal of a plastic bag is strengthened by welding together 8 layers of plastic film. In one respect, an embodiment of the invention provides a bag pack that includes multiple T-shirt style plastic bags. The bag pack may be manufactured by folding a 4-layered structure into an 8-layered structure, welding a bottom edge, and then unfolding the 8-layered structure before stacking 4-layered bags into a bag pack. | 07-01-2010 |
Tong Tee Tan, Johor MY
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20090302954 | Temperature Compensation Circuit and Method - Disclosed are various embodiments of temperature-compensated relaxation oscillator circuits that may be fabricated using conventional CMOS manufacturing techniques. The relaxation oscillator circuits described herein exhibit superior low temperature coefficient performance characteristics, and do not require the use of expensive off-chip high precision resistors to effect temperature compensation. Positive and negative temperature coefficient resistors arranged in a resistor array offset one another to provide temperature compensation in the relaxation oscillator circuit. | 12-10-2009 |
Tzer Nan Tan, Ayer Itam MY
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20120141114 | Three-pole tilt control system for camera module - A novel camera module includes a housing having a lens unit receiving portion and an image capture device receiving portion, which includes a plurality of discrete support members. A lens unit is coupled to the lens unit receiving portion of the housing. An image capture device has a top surface, which includes an image sensor array. The top surface of the image capture device contacts the bottom of the discrete support members of the housing to align the tilt of the image capture device with respect to the housing. In a particular embodiment, the image capture device is mounted on a surface of a circuit substrate that is coupled to the housing. In an alternate embodiment, the housing is coupled directly to the image capture device. | 06-07-2012 |
20130070147 | THREE-POLE TILT CONTROL SYSTEM FOR CAMERA MODULE - A novel camera module includes a housing having a lens unit receiving portion and an image capture device receiving portion, which includes a plurality of discrete support members. A lens unit is coupled to the lens unit receiving portion of the housing. An image capture device has a top surface, which includes an image sensor array. The top surface of the image capture device contacts the bottom of the discrete support members of the housing to align the tilt of the image capture device with respect to the housing. In a particular embodiment, the image capture device is mounted on a surface of a circuit substrate that is coupled to the housing. In an alternate embodiment, the housing is coupled directly to the image capture device. | 03-21-2013 |
Tze Swan Tan, Pahang MY
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20110292711 | DATA ENCODING SCHEME TO REDUCE SENSE CURRENT - Techniques for encoding and decoding fuse data to reduce sense current are disclosed. An embodiment to encode fuse sense data includes inverting each of the bits of the fuse data and using an individual fuse as a flag bit to record the data inversion. The states of the respective fuses may represent different logic states. A fuse may be blown to indicate a logic one and likewise, an unblown fuse may indicate a logic zero. A blown fuse and an unblown fuse may have different current consumption. An unblown fuse may consume more sensing current compared to a blown fuse. Another embodiment to decode the encoded fuse data includes embedded logic circuits and a separate fuse as a flag bit. Encoding and decoding fuse data may reduce fuse sensing current. | 12-01-2011 |
Yean Hong Tan, Bayan Lepas MY
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20100311274 | ECO CONTACTOR - The present invention relates to an improved a shielded contactor having an insulative material or proxy ( | 12-09-2010 |
20100311284 | AIR GAP CONTACTOR - A contactor having an internal air gap ( | 12-09-2010 |
Yee Liang Tan, Gelugor MY
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20120169362 | MULTI-LAYER DISTRIBUTED NETWORK - Apparatuses and processes for distributing signals in an integrated circuit are disclosed. An embodiment to use a custom layer together with a base layer on an integrated circuit for testing the integrated circuit includes having a structured network on the base layer. The custom layer connects the network to logic elements on the integrated circuit. The network may be evenly distributed across the base layer of the integrated circuit. Even distribution of the network may reduce skew of the test signals. Buffers are also placed along the structured network. The buffers may be placed to ensure a deterministic test signals distribution. Unused buffers in the base layer may be tied off to reduce current leakage. | 07-05-2012 |
20120228760 | SYSTEMS INCLUDING AN I/O STACK AND METHODS FOR FABRICATING SUCH SYSTEMS - Systems including an input/output (I/O) stack and methods for fabricating such systems are described. In one implementation, the methods include stacking an I/O die including I/O elements and excluding a logic element. Also in one implementation, the methods further include stacking an integrated circuit die with respect to the I/O die. The integrated circuit includes logic elements and excludes an I/O element. The separation of the I/O die from the integrated circuit die provides various benefits, such as independent development of each of the dies and more space for the I/O elements on an I/O substrate of the I/O die compared to that in a conventional die. The increase in space allows new process generation of the integrated circuit die in which an increasing number of logic elements are fitted within the same surface area of a substrate of the integrated circuit die. | 09-13-2012 |
Yentiong Tan, Butterworth MY
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20140178142 | HAND-HELD POWER TOOL HAVING A SUPPORT DEVICE - A hand-held power tool includes a machine housing and a support device configured to guide the hand-held power tool in a plane-parallel manner on a workpiece. The support device has a substantially hollow-cylindrical carrier element configured to at least portionally receive the machine housing. The carrier element has a longitudinal slot and a foot plate. The foot plate is disposed at a defined angle at an axial end facing toward the workpiece. The foot plate has a recess for an insert tool. The carrier element is clampable to the machine housing by a swivelable clamping lever and/or a rotatable clamping knob. The clamping lever and the clamping knob are connected to each other by a clamping screw. | 06-26-2014 |
Yew Ai Tan, Kuala Lumpar MY
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20100183786 | PALM PHENOLICS AND FLAVONOIDS AS POTENT BIOLOGICAL AND CHEMICAL ANTIOXIDANTS FOR APPLICATIONS IN FOODS AND EDIBLE OILS - This invention relates to the use of palm phenolics as natural antioxidants and food preservatives. In particular, the present invention relates to antioxidant compounds derived from a plant material, wherein the said antioxidant compounds are phenolics comprising but not confined to phenolic acids and flavonoids extracted from by-products of palm oil mill. | 07-22-2010 |
Yew Ai Tan, Kaula Lumpur MY
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20130211136 | COMPOSITIONS COMPRISING SHIKIMIC ACID OBTAINED FROM OIL PALM BASED MATERIALS AND METHOD OF PRODUCING THEREOF - The present invention provides compositions and method for production of shikimic acid based on extracts obtained from oil palm-based materials, and more particularly oil palm based waste materials and by-products. The method includes purifying shikimic acid from extracts comprising oil palm phenolics (OPP). | 08-15-2013 |
Yew Ai Tan, Taman Cheras MY
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20090252817 | Methods for the treatment or prevention of Diabetes Mellitus and other metabolic imbalances - The invention relates to methods for treatment and prevention of a metabolic imbalance, including diabetes mellitus and other related diseases or disorders, using an extract from a fruit of genus | 10-08-2009 |
Yew Ai Tan, Selangor Darul Ehsan MY
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20100197780 | COMPOUNDS EXTRACTED FROM PALM OIL MILL EFFLUENT FOR THE TREATMENT OF CANCER, COMPOSITIONS THEREOF AND METHODS THEREWITH - The present invention describes a composition and methods for prevention and treatment of cancer comprising compounds extracted from Palm oil mill effluent. Also, the invention describes effective therapeutic dosages of the compounds and their combinations. The present invention can be prepared independently or as a combination product. | 08-05-2010 |
20100209544 | BOTANICAL EXTRACTS FROM OIL PALM VEGETATION LIQUOR FOR COSMECEUTICAL APPLICATIONS - A cosmeceutical composition comprising phenolic compounds, fruit acids and sugars. extracted from the vegetation liquor of the palm oil milling process has been suggested. This composition is rich in antioxidants, and significantly improves skin health, including preventing aging of the skin. | 08-19-2010 |
Zi Hao Tan, Wakah Bharu MY
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20080219566 | SYSTEM AND METHOD FOR IDENTIFYING AND LABELING CLUSTER PIXELS IN A FRAME OF IMAGE DATA FOR OPTICAL NAVIGATION - A system and method for identifying and labeling cluster pixels in a frame of image data for optical navigation determines whether a current pixel of the frame of image data is a cluster pixel and uses neighboring pixels of the current pixel to label the current pixel as belonging to a new cluster or an existing cluster. | 09-11-2008 |
20080260249 | SYSTEM AND METHOD FOR LABELING FEATURE CLUSTERS IN FRAMES OF IMAGE DATA FOR OPTICAL NAVIGATION - A system and method for labeling feature clusters in frames of image data for optical navigation uses distances between feature clusters in a current frame of image data and feature clusters in a previous frame of image data to label the feature clusters in the current frame of image data using identifiers associated with the feature cluster in the previous frame of image data that have been correlated with the feature clusters in the current frame of image data. | 10-23-2008 |
Zi Hao Tan, Kelantan MY
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20120105661 | ROW AND COLUMN JUMPING FOR PIXEL READOUT USING BURST SWITCHING MODE - An imaging apparatus is described for obtaining images. The imaging apparatus includes a pixel array, a row decoder, a column decoder, and a trigger circuit. The pixel array integrates electrical signals corresponding to incident light from a scene. The row decoder enables a selected row of pixels within the pixel array. The column decoder enables readout of a pixel in a selected column of the selected row within the pixel array. The trigger circuit generates one or more burst pulses to traverse through a corresponding number of decoder stages that correspond to pixels which are identified for discarding. Each burst pulse has a duration that is less than a stipulated minimum pulse duration of a typical decoder pulse of the decoders. By using shorter burst pulses, the trigger circuit can quickly jump to a desired row and/or column of pixels for readout, while conserving power. | 05-03-2012 |