Patent application number | Description | Published |
20090079648 | HIGH FREQUENCY MODULE - To provide a high-frequency module having an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss. | 03-26-2009 |
20090127674 | MULTILAYER DIELECTRIC SUBSTRATE AND SEMICONDUCTOR PACKAGE - A multilayer dielectric substrate that mounts a semiconductor device in a cavity formed on a substrate. The multilayer dielectric substrate includes an opening formed in a surface-layer grounding conductor on the substrate in the cavity, and an impedance transformer, with a length of about ¼ of an in-substrate effective wavelength of a signal wave, electrically connected through the opening to the cavity. The multilayer dielectric substrate further includes a short-circuited end dielectric transmission line with a length of about ¼ of the in-substrate effective wavelength of the signal wave, a coupling opening formed on an inner-layer grounding conductor in a connecting section of the impedance transformer and the dielectric transmission line, and a resistor formed in the coupling opening. | 05-21-2009 |
20090309680 | WAVEGUIDE CONNECTION STRUCTURE - A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about λ/4 away from a long side edge of the first waveguide, where λ is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about λ. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about λg/4, where λg is an in-substrate effective wavelength of the signal wave. | 12-17-2009 |
20100117711 | SEMICONDUCTOR CHIP AND RADIO FREQUENCY CIRCUIT - A two-terminal semiconductor device is formed on a semiconductor substrate. Two wiring patterns are respectively connected to terminals of the semiconductor device, and two electrode pads are respectively connected to the wiring patterns for connecting a signal input/output circuit formed on a separate substrate. Two parallel wiring patterns are respectively connected to the wiring patterns, and two reactance-circuit connection electrode pads are respectively connected to the parallel wiring patterns for electrically connecting a reactance circuit formed on the separate substrate separately from the signal input/output circuit. | 05-13-2010 |
20100315177 | EVEN HARMONIC MIXER - Provided is an even harmonic mixer which is reduced in cost and size. The even harmonic mixer includes: a transducer in which a conductor of a microstrip line is connected to a ground plane of a waveguide, for transducing an RF signal transmitted in a waveguide mode into a transmission mode of the microstrip line; an anti-parallel diode pair which is cascade-connected to a microstrip line side of the transducer, and formed on a semiconductor substrate; a branching circuit for branching an LO signal and an IF signal; an open-end stub which is disposed between the transducer and the anti-parallel diode pair, and has a line length of about ½ wavelength at an RF signal frequency; and an open-end stub which is disposed between the anti-parallel diode pair and the branching circuit, and has a line length of about ¼ wavelength at the RF signal frequency. | 12-16-2010 |
20100315799 | HIGH FREQUENCY STORING CASE AND HIGH FREQUENCY MODULE - A cavity configured by electrically connecting an earth conductor formed on a multilayer dielectric substrate and on which a plurality of high frequency circuits are mounted, and a shield cover member. A waveguide aperture is formed on the earth conductor on which the high frequency circuits are mounted and is electrically coupled to the cavity, and an end-short-circuited dielectric waveguide formed in a direction of layer lamination of the multilayer dielectric substrate is connected to the waveguide aperture, and has a length approximately ¼ of an effective wavelength in the substrate of a signal wave. Spatial isolation between the high frequency circuits is ensured by an inexpensive and simple configuration using the single cavity. | 12-16-2010 |
20110163919 | HIGH-FREQUENCY CIRCUIT PACKAGE AND SENSOR MODULE - Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate ( | 07-07-2011 |
20110175793 | HIGH-FREQUENCY CIRCUIT PACKAGE AND SENSOR MODULE - Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate ( | 07-21-2011 |
20110187482 | WAVEGUIDE CONNECTION STRUCTURE - A choke structure including: an inside surface conductive pattern formed in the surrounding of a through hole on the surface of a dielectric substrate opposing a waveguide substrate; an outside surface conductive pattern formed in the surrounding of the inside surface conductive pattern positioned apart therefrom; a conductor opening provided between the inside surface conductive pattern and the outside surface conductive pattern and in which a dielectric member is exposed; a dielectric transmission path short-circuited at an end that is formed by an inner layer conductor, which is provided away from the conductor opening by a predetermined distance in the layer-stacking direction of the dielectric substrate; and a plurality of penetrating conductors, which connect the inner layer conductor to the inside surface conductive pattern. | 08-04-2011 |
20110241805 | WAVEGUIDE CONNECTION BETWEEN A MULTILAYER WAVEGUIDE SUBSTRATE AND A METAL WAVEGUIDE SUBSTRATE INCLUDING A CHOKE STRUCTURE IN THE MULTILAYER WAVEGUIDE - A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about λ/4 away from a long side edge of the first waveguide, where μ is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about λ. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about λg/4, where λg is an in-substrate effective wavelength of the signal wave. | 10-06-2011 |
20140085858 | HIGH-FREQUENCY PACKAGE - A high-frequency package includes a first dielectric substrate having a signal line and a grounding conductor provided on a back side, a high-frequency element connected to a back side of the first dielectric substrate with a first connection conductor therebetween, a second dielectric substrate having a signal line and a grounding conductor provided on a front side facing the back side with the high-frequency element therebetween, and second connection conductors that are arranged so as to surround the high-frequency element and connect the grounding conductor on the back side of the first dielectric substrate and the grounding conductor on the front side of the second dielectric substrate. In the high-frequency package, a dielectric space surrounded by a conductor pattern is formed in the front side of the second dielectric substrate under the high-frequency element. | 03-27-2014 |