Patent application number | Description | Published |
20110102102 | DUPLEXER - A duplexer that achieves a reduction in the size and an increase in the performance includes a transmission filter including piezoelectric thin film resonators and a reception filter including piezoelectric thin film resonators and an elastic wave resonator. The piezoelectric thin film resonators of the transmission filter and the piezoelectric thin film resonators and the elastic wave resonator of the reception filter are provided on the same substrate. | 05-05-2011 |
20110131774 | METHOD OF MANUFACTURING STACKED THIN FILM PIEZOELECTRIC FILTER - A method of manufacturing a stacked thin film piezoelectric filter includes the steps of forming a lower thin film piezoelectric resonator on a substrate, measuring a frequency of the lower thin film piezoelectric resonator and adjusting the frequency, forming an acoustic coupling layer on the lower thin film piezoelectric resonator whose frequency has been adjusted, forming the stacked thin film piezoelectric filter by forming an upper thin film piezoelectric resonator on the acoustic coupling layer, and measuring a frequency of the upper thin film piezoelectric resonator and adjusting the frequency. | 06-09-2011 |
20110146041 | METHOD OF MANUFACTURING PIEZOELECTRIC DEVICE - A method of manufacturing a piezoelectric device includes the steps of bonding a first substrate to a second substrate having a toughness greater than that of the first substrate, forming a first though-hole through the first substrate from the side opposite to the side on which the second substrate is bonded, and forming a second through-hole through the second substrate at a location corresponding to the first through-hole by a formation method different from that used to form the first through-hole from the side opposite to the side on which the first substrate is bonded. | 06-23-2011 |
20110193654 | ELASTIC WAVE FILTER DEVICE AND MODULE INCLUDING THE SAME - An elastic wave filter device in which elastic wave filters and parallel resonators are provided on a piezoelectric substrate includes a plurality of ground ports. The elastic wave filters include input-side resonators and output-side resonators. The input-side resonators are connected between a reception input port and a first one of the ground ports. The output-side resonators are connected between reception output ports and the first ground port. The parallel resonators are connected in parallel to output lines and are connected to second and third ground ports. | 08-11-2011 |
20120001704 | ACOUSTIC WAVE DEVICE - An acoustic wave device includes resonator structures each including resonators arranged next to each other, and each of the resonator structures is excited in at least two vibration modes as the resonators thereof are coupled and resonate with each other. At least one of the resonator structures exhibits stronger resonance characteristics in one of the vibration modes than in the other vibration mode or modes within the filter band. | 01-05-2012 |
20120194034 | PIEZOELECTRIC DEVICE - A piezoelectric device includes first and second piezoelectric resonators each including a piezoelectric thin film, an upper electrode provided on one main surface of the piezoelectric thin film, and a lower electrode provided on another main surface of the piezoelectric thin film. In the piezoelectric resonators, portions in which the upper and lower electrodes are superposed on each other with the piezoelectric thin film therebetween define piezoelectric vibrating portions that are acoustically isolated from a substrate. The first and second piezoelectric resonators are connected in series or parallel between an input terminal and an output terminal such that polarization directions of corresponding portions of the piezoelectric thin film are opposite to each other when seen from the input terminal. The first piezoelectric resonator and the second piezoelectric resonator are arranged to have different resonant frequencies of a transverse vibration mode. | 08-02-2012 |
20130057113 | ELASTIC WAVE DEVICE - In an elastic wave device that significantly reduces and prevents deterioration of a frequency characteristic without roughening an undersurface of a piezoelectric substrate, a structure is bonded to a surface of a piezoelectric substrate other than a main surface of the piezoelectric substrate on which IDTs are located. The structure is provided so that a path difference is defined between a first component and a second component of a bulk wave that is excited by the IDT and propagates in the piezoelectric substrate toward the bonding surface. The first component of the bulk wave is reflected from the bonding surface. The second component of the bulk wave enters the structure from the bonding surface, propagates in the structure, enters the piezoelectric substrate from the bonding surface, and propagates in the same direction as that of the first component reflected from the bonding surface in the piezoelectric substrate. | 03-07-2013 |
20130127300 | PIEZOELECTRIC THIN-FILM RESONATOR AND METHOD FOR PRODUCING PIEZOELECTRIC THIN FILM - A piezoelectric thin-film resonator includes a piezoelectric thin film which includes aluminum nitride containing Sc and which has a concentration distribution such that the concentration of Sc is non-uniform in a thickness direction of the piezoelectric thin film; a first electrode; a second electrode facing the first electrode across the piezoelectric thin film; and a substrate supporting a piezoelectric vibrating section defined by the piezoelectric thin film and the first and second electrodes. | 05-23-2013 |
20140368401 | COMMUNICATION DEVICE - A communication device is provided with a band elimination filter that has one end connected to an antenna terminal, and a first multiplexer that is connected to the other end of the band elimination filter. The band elimination filter is configured to eliminate signals of a frequency band that is different from the frequencies of signals transmitted and received in the first multiplexer, and is configured from a filter circuit that includes a bulk wave element. | 12-18-2014 |
20150017320 | METHOD OF MANUFACTURING STACKED THIN FILM PIEZOELECTRIC FILTER - A method of manufacturing a stacked thin film piezoelectric filter includes the steps of forming a lower thin film piezoelectric resonator on a substrate, measuring a frequency of the lower thin film piezoelectric resonator and adjusting the frequency, forming an acoustic coupling layer on the lower thin film piezoelectric resonator whose frequency has been adjusted, forming the stacked thin film piezoelectric filter by forming an upper thin film piezoelectric resonator on the acoustic coupling layer, and measuring a frequency of the upper thin film piezoelectric resonator and adjusting the frequency. | 01-15-2015 |