Patent application number | Description | Published |
20130087605 | CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD - A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle. | 04-11-2013 |
20130088839 | BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE ASSEMBLY - There is provided a method of manufacturing a board module which includes attaching a metal particle to a surface of a solder bump, which includes at least a tin component and is mounted on an electrode provided on a first surface of an electric part or a printed circuit board, the metal particle having a higher specific gravity and a higher melting point than the solder bump, making the first surface face up, heating the solder bump to a temperature equal to or higher than the melting point of the solder bump so that the metal particle precipitates in the solder bump, and forming an inter-metal compound layer, which has a higher melting point than a melting point of the solder bump, at an interface between the solder bump and the electrode by using the metal particle, which has precipitated, and the tin component of the solder bump. | 04-11-2013 |
20130140069 | CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE - A conductive bonding material includes: copper particles coated with either gallium or gallium alloy; and either tin particles or tin alloy particles. An electronic component includes: a wiring board having electrode pads; a component mounted on the wiring board and having a plurality of electrodes; a sealing resin covering the component; and a plurality of terminals coupled to a wiring line in the wiring board to an external substrate, wherein the plurality of electrodes being coupled to the electrode pads through a conductive bonding material containing copper particles coated with either gallium or gallium alloy particles and either tin particles or tin alloy particles. | 06-06-2013 |
20130259421 | METHOD OF MANUFACTURING OPTICAL WAVEGUIDE DEVICE AND OPTICAL WAVEGUIDE DEVICE - A method of manufacturing an optical waveguide device, the method includes: inserting an inclined surface of a mold which is inclined relative to a surface of a substrate including an optical waveguide member into a through hole in which the optical waveguide member is exposed from one surface side of the substrate; locating an optical component above an opening of the through hole on the other surface side of the substrate; injecting an underfill material into between the optical component and the other surface and into the through hole; and curing the underfill material to form a mirror surface. | 10-03-2013 |
20130313309 | CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - A conductive bonding material includes: a solder component including a metal foamed body of a first metal having at least one pore, the pore absorbs melted first metal when the metal foamed body is heated at a temperature higher than the melting point of the first metal, and a second metal having a melting point lower than the melting point of the first metal. | 11-28-2013 |
20140086525 | OPTICAL UNIT AND METHOD OF MANUFACTURING THE SAME - An optical unit in which an optical part having an optical element is mounted on a base having an optical waveguide includes a hydrophobic first area formed in a region including an optical axis of the optical part, a hydrophobic second area formed in a region facing the first area on a surface of the base, and a hydrophilic filler which fills peripheries of the first area and the second area between the optical part and the base. | 03-27-2014 |
20140285989 | METHOD OF MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE - A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material. | 09-25-2014 |
20140290850 | BONDING APPARATUS AND BONDING METHOD - A bonding apparatus has a light source, a stage, a component holder formed of a light transparent material, a controller, and a driver configured to drive the stage and the component holder under the control of the controller. The component holder includes an incident surface on which light outputted from the light source is made incident, a first reflection surface which is a surface opposite to the incident surface and reflects the incident light from the incident surface, a second reflection surface which reflects the light reflected by the first reflection surface, and an exit surface from which the light reflected by the second reflection surface exits. The bonding apparatus bonds the first component and the second component together with the photo-curing adhesive while holding the second component on the side of the exit surface of the component holder. | 10-02-2014 |