Patent application number | Description | Published |
20130181639 | MOTOR DRIVE SYSTEM - A first drive circuit of a motor drive apparatus drives a motor by converting electric power of a battery. A relay is connected in high potential line between the battery and an inverter. A diode is connected in parallel to the relay. The diode conducts a current in a regeneration direction, which is from a high potential side of the inverter to a high potential electrode of the battery, under a state that the relay is in the off-state. Thus, an inductive voltage, which is generated by the motor when a reverse input torque is applied from a load side, is led to the battery through the diode, and switching elements forming the inverter are protected from the inductive voltage. | 07-18-2013 |
20130234632 | IN-VEHICLE POWER SUPPLY SYSTEM WITH MULTIPLE VOLTAGE-REDUCING DEVICES - An in-vehicle power supply system includes a DC power source, a steering power converter, a steering drive control unit, a plurality of voltage-reducing devices, and a voltage-reducing control unit. The steering power converter converts electric power supplied from the DC power source, and provides the electric power converted to a steering assist motor. The steering drive control unit is supplied with electric power from the DC power source, and controls the steering power converter. The voltage-reducing devices are coupled in parallel to each other between the DC power source and the steering power converter. Each of the voltage-reducing devices reduces a power source voltage of the DC power source and generates a reduced voltage when being operated. The voltage-reducing control unit determines operation state or non-operation state of each of the voltage-reducing devices such that at least one of the voltage-reducing devices is in operation at a time. | 09-12-2013 |
20140021897 | ROTARY ELECTRIC MACHINE CONTROL APPARATUS AND ELECTRIC POWER STEERING APPARATUS USING THE SAME - An inverter circuit converts electric power supplied to a motor by on/off operations of FETs. A microcomputer controls driving of the motor by controlling the on/off operations of the FETs. The microcomputer operates as a current direction determination part. The microcomputer detects a first potential difference, which is a potential difference between both ends of each diode, and a second potential difference, which is a potential difference between both ends of each diode, when both FETs of each phase are in an off-state. The microcomputer can further determine a direction of current flowing in the motor based on the detected first potential difference and the detected second potential difference. | 01-23-2014 |
20140111944 | HEAT DISSIPATION STRUCTURE FOR MULTILAYER BOARD AND METHOD OF MANUFACTURING THE STRUCTURE - A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion located between the electronic device and the heat dissipator has no interlayer connection conductor made of electrically conducting material and serves as an electrically insulating layer for providing electrical isolation between the electronic device and the heat dissipator. | 04-24-2014 |
20140218869 | HEAT RADIATION STRUCTURE OF ELECTRIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A heat radiation structure for an electric device includes: at least one multi-layer substrate including a plurality of base parts made of insulation material and a conductor pattern, which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion in the base parts; the electric device having at least one of a first electric element built in the at least one multi-layer substrate and a second electric element, which is not built in the multi-layer substrate; and a low heat resistance element opposed to the electric device. The low heat resistance element has a heat resistance lower than the insulation material. | 08-07-2014 |
20140222290 | ROTARY ELECTRIC MACHINE CONTROL APPARATUS AND ELECTRIC POWER STEERING SYSTEM USING THE SAME - Comparators of a rotary electric machine control apparatus acquire terminal voltages of each phase, which are developed at junction points between high-potential side FETs and low-potential side FETs, respectively. In switching over ON and OFF of the high-potential side FETs and the low-potential side FETs, a control unit determines a flow direction of a phase current supplied to each phase coil based on a terminal voltage developed in a dead time period, in which a the high-potential side FET and the low-potential side FET forming a pair are both turned off. Thus, the flow direction of each phase current is determined in a simple configuration. | 08-07-2014 |
20160037659 | ELECTRONIC DEVICE - An ECU includes a substrate and a chassis. Electronic components are mounted on a first primary surface of the substrate. The chassis includes a protruding portion that protrudes toward a position different from where the electronic components are. A height of the protruding portion is greater than a height of the electronic components, and shorter than a gap between the substrate and the heat sink. When warping occurs in the substrate and the first primary surface approaches an opposing surface of the heat sink, the protruding portion contacts the first primary surface. Accordingly, the electronic components are prevented from contacting the heat sink. Further, other electronic components may be mounted on an entire area of a second primary surface of the substrate. | 02-04-2016 |
20160037674 | ELECTRONIC DEVICE, DRIVE APPARATUS HAVING THE ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE ELECTRONIC DEVICE - An electronic device includes a circuit board, a heat sink and thermal gel. The circuit board has an electronic component, which is mounted to a first principal surface of the circuit board. The heat sink has an opposing surface, which is opposed to the first principal surface of the circuit board. The thermal gel is filled between the circuit board and the heat sink to cover the electronic component. The circuit board has through-holes. At least a portion of each through-hole is formed in a bonding range, to which the thermal gel is bonded. The through-holes enable visual recognition of the thermal gel through the through-holes. | 02-04-2016 |