Patent application number | Description | Published |
20080217045 | UNDERLAY SUBSTRATE, SCREEN PRINTING METHOD AND MANUFACTURING METHOD OF PRINTED CIRCUIT SUBSTRATE - A plurality of through holes having an equal size are formed in an underlay substrate. Positions of the plurality of through holes are suitably set according to the shape of a substrate sheet. Specifically, an equal number of through holes are formed in each of end blank corresponding regions that, when the substrate sheet and the underlay substrate are overlapped with each other, overlap with end blank regions of the substrate sheet, of the underlay substrate. In addition, the through holes are formed at equal spacing in portions excluding the end blank corresponding regions in a blank corresponding region, which overlaps with a blank region of the substrate sheet, of the underlay substrate. | 09-11-2008 |
20080217048 | Wired circuit board and producing method thereof - A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer and including a wire and a terminal portion, an insulating cover layer formed on the insulating base layer and having an opening portion to expose the terminal portion, and a metal thin film including a protecting portion interposed between the wire and the insulating cover layer, and an exposed portion formed continuously from the protecting portion on a peripheral end portion of the terminal portion exposed from the opening portion. | 09-11-2008 |
20080217383 | MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD - A screen plate having a plurality of openings is placed on a suspension substrate in which a plurality of conductive pads are formed. Conductive paste is moved in one direction on an upper surface of the screen plate, so that the conductive paste is applied onto the conductive pads through the openings. A recess that is inwardly bent is formed in each of the openings of the screen plate. | 09-11-2008 |
20080278858 | Wired circuit board - The wired circuit board includes a metal supporting board, a metal foil formed on the metal supporting board, a first insulating layer formed on the metal supporting board so as to cover the metal foil, and a conductive pattern formed on the first insulating layer and having a plurality of wires. The metal foil is arranged along a lengthwise direction of each of the wires so as not to be opposed to part of the wires in a thickness direction and so as to be opposed to a remainder of the wires in the thickness direction. | 11-13-2008 |
20090008137 | Wired circuit board and producing method thererof - A wired circuit board includes a metal supporting board having a depressed portion, a conductive portion embedded in the depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wired formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion. | 01-08-2009 |
20090014410 | Producing method of suspension board with circuit - A producing method of a suspension board with circuit includes simultaneously forming a conductive pattern formed on an insulating layer formed on a metal supporting board and having a terminal portion for connecting to an electronic component, and a mark formed on the metal supporting board, or on the insulating layer and having an opening for forming a reference hole for mounting the electronic component, and forming the reference hole by etching the metal supporting board disposed in the opening of the mark, or the insulating layer and the metal supporting board each disposed in the opening of the mark. | 01-15-2009 |
20090173521 | Wired circuit board - A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged in opposed relation to the first wire in a thickness direction. The thickness of the first wire is 1 μm or less and is | 07-09-2009 |