Patent application number | Description | Published |
20100078204 | Printed circuit board including electronic component embedded therein and method of manufacturing the same - Disclosed herein is a printed circuit board including an electronic component embedded therein and a method of manufacturing the printed circuit board. The electronic component is disposed in a cavity of a resin layer including circuit layers formed on both sides thereof. The resin layer, the electronic component and the circuit layers are attached to each other via adhesive layers disposed therebetween. The printed circuit board is manufactured by a compression process, thus shortening a production time and simplifying a manufacturing process. | 04-01-2010 |
20110083891 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an electronic component-embedded printed circuit board, including: a flexible film; an insulation layer formed on one side of the flexible film; an electronic component mounted on the one side of the flexible film in a face-down manner such that the electronic component is buried in the insulation layer; and a circuit layer including a connecting pattern which is formed on the one side of the flexible film and is connected with a connecting terminal of the electronic component by a connecting member. The electronic component-embedded printed circuit board is advantageous in that the position alignment between the connecting patterns and the connecting terminals is easy and the connection reliability therebetween is high because the connecting patterns formed on a flexible film are directly connected to the connecting terminals of an electronic component using connecting members, and in that the production cost thereof can be reduced because additional rewiring is not required. | 04-14-2011 |
20110083892 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is an electronic component-embedded printed circuit board, which includes an insulating base, an insulating layer formed on one surface of the insulating base, an electronic component embedded in the insulating layer so that an active surface of the electronic component having a connection terminal faces the insulating base, a trench formed in the insulating base to expose the connection terminal, and a connection pattern formed and embedded in the trench, and in which the embedded connection pattern is finely formed by an imprinting process and is connected to the connection terminal of the electronic to component, thus obviating a need for an additional redistribution layer and reducing the manufacturing cost. A method of manufacturing such a printed circuit board is also provided. | 04-14-2011 |
20110127076 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an electronic component-embedded printed circuit board, including: a base plate having a cavity formed therein in a thickness direction thereof; an electronic component which is disposed in the cavity such that an active surface of the electronic component is flush with one side of the base plate; an insulating material layer which is formed on the other side of the base plate to bury the electronic component; and a first circuit layer which is formed on one side of the base plate and includes connection patterns coming into contact with connecting terminals of the electronic component, and a method of manufacturing the same. The electronic component-embedded printed circuit board is advantageous in that the active surface of an electronic component is disposed such that it is flush with one side of a base plate, so that additional viaholes do not need to be formed, with the result that a laser process requiring high cost can be omitted, thereby simplifying the manufacturing process of a printed circuit board and reducing the manufacturing cost thereof. | 06-02-2011 |
20110164391 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an electronic component-embedded printed circuit board, including: a metal substrate including an anodic oxide film formed over the entire surface thereof; two electronic components disposed in a cavity formed in the metal substrate in two stages; an insulation layer formed on both sides of the metal substrate to bury the electronic components disposed in the cavity; and circuit layers including vias connected with connecting terminals of the electronic components and formed on the exposed surfaces of the insulation layer. The electronic component-embedded printed circuit board is advantageous in that its radiation performance of radiating the heat generated from an electronic component can be improved, and its production cost can be reduced, because a metal substrate is used instead of a conventional insulating material. | 07-07-2011 |
20120061833 | EMBEDDED BALL GRID ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed herein are an embedded ball grid array substrate and a manufacturing method thereof. The embedded ball grid array includes: a core layer having a cavity therein; a semiconductor device embedded in the cavity of the core layer; a first circuit layer having a circuit pattern including a wire bonding pad formed thereon; a second circuit layer having a circuit pattern including a solder ball pattern formed thereon; and a wire electrically connecting the semiconductor device to the wire bonding pad. | 03-15-2012 |
20120160550 | PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - Disclosed is a printed circuit board having an embedded electronic component, which includes a first insulating layer, an electronic component disposed in an opening formed in a thickness direction of the first insulating layer and having a metal bump, a polymer layer formed on one side of the first insulating layer and on which the electronic component is seated so that the metal bump of the electronic component perforates the polymer layer, a second insulating layer formed on the other side of the first insulating layer so as to embed the electronic component, a first circuit layer formed on the second insulating layer, and a second circuit layer formed on the polymer layer so as to be directly electrically connected to the metal bump that perforates the polymer layer, and in which roughness is formed on the polymer layer so that the force of adhesion of the polymer layer to a plating layer is enhanced, thus ensuring reliability of the electrical connection of a circuit layer which is subsequently formed. | 06-28-2012 |
20130320516 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings. | 12-05-2013 |