Tadashi Endo
Tadashi Endo, Fukuoka JP
Patent application number | Description | Published |
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20090125141 | WORKING APPARATUS AND WORKING METHOD FOR CIRCUIT BOARD - In estimating a curved surface model by approximating the shape of the board surface of a circuit board, auxiliary measurement spots are set other than measurement spots on the board surface, eligibility as a sampling displacement magnitude in estimating a curved surface model is determined according to a difference in a displacement magnitude from a work reference surface. When the sampling displacement magnitude is determined to be ineligible, a new measurement spot is reset. By this operation, a local increase and decrease in the displacement magnitude due to a discontinuity of the board surface exerts no influence on the estimation of the curved surface model, and the curved surface model approximated more closely to the shape of the actual board surface is estimated, leading to an improvement in the work quality with the working height adjusted to the proper height. | 05-14-2009 |
20090300908 | ELECTRONIC COMPONENT MOUNTER AND MOUNTING METHOD - It is an object to provide a method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency. | 12-10-2009 |
20100060724 | MOVING DEVICE AND ELECTRONIC COMPONENT MOUNTING APPARATUS - An electronic component mounting apparatus includes two second linear-motion devices on each of which an image pickup device and a mounting head are placed so as to be movable in an X direction, a first linear-motion device for moving the second linear-motion devices in a Y direction independently of each other, in which the image pickup device is placed at such a position as to be contained within an X-directional width of the mounting head and moreover contained within a Y-directional total width of the mounting head and the second linear-motion device. Thus, since the image pickup region of the camera is contained within the moving region of the mounting head, there is no need for ensuring a moving distance taking into account only the camera's image pickup region, so that the moving-axis length of the second linear-motion devices can be reduced. | 03-11-2010 |
20100229380 | ELECTRONIC COMPONENT MOUNTING APPARATUS AND NOZZLE PLACEMENT HISTORY DATA MANAGEMENT METHOD - An electronic component mounting apparatus and a nozzle placement history data management method for making it possible to correctly manage nozzle placement history data and ensure data reliability are provided. | 09-16-2010 |
20100321487 | COMPONENT PLACEMENT APPARATUS - To provide a component placement apparatus capable of preventing free operation of a mounting head within the movable region from being restricted as well as improving the mounting takt time. | 12-23-2010 |
Tadashi Endo, Urayasu-Shi JP
Patent application number | Description | Published |
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20120191789 | INFORMATION PROCESSING APPARATUS, MAILBOX MANAGEMENT METHOD, AND STORAGE MEDIUM - An information processing apparatus stores capacity limit information of a mailbox assigned to a group, and stores information of a list of a plurality of e-mail addresses belonging to the group and set capacities of individual mailboxes corresponding to individual e-mail addresses, receives a value of a set capacity of a mailbox corresponding to an e-mail address stored in a storage unit from an administrator terminal, determines whether the set capacities of all mailboxes corresponding to the plurality of e-mail addresses that belong to the group do not exceed a capacity limit of the mailbox assigned to the group, if a set capacity is changed to the set capacity of the mailbox corresponding to the received e-mail address, and updates the value of the set capacity of the mailbox corresponding to the received e-mail address if it is determined that the set capacities do not exceed the capacity limit. | 07-26-2012 |
Tadashi Endo, Yamanashi JP
Patent application number | Description | Published |
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20120317804 | ELECTRONIC COMPONENT MOUNTING DEVICE AND AN OPERATION PERFORMING METHOD FOR MOUNTING ELECTRONIC COMPONENTS - It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. Height precision division information that divide the height precision required for up and down movements of operating heads into the first division which indicates a normal height precision and the second division which indicates that a high height precision is required based on the type of electronic components are stored as operation data beforehand. In operation performing procedures, when an electronic component belongs to the first division, an operating head is made to move up and down based on an approximate operation position height derived from an approximate curved surface of the top surface of a board which is calculated by using the height measurement result obtained by measuring a plurality of height measuring points on the surface of the board, and when the electronic component belongs to the second division, the operating head is made to move up and down based on an individual operation position height obtained by individually measuring the board height at the operation position. | 12-20-2012 |
20130276281 | LOWER SUPPORTING PIN LAYOUT DETERMINATION APPARATUS AND LOWER SUPPORTING PIN LAYOUT DETERMINATION METHOD - A lower supporting pin module | 10-24-2013 |
20130291379 | ELECTRONIC COMPONENT MOUNTING DEVICE, ELECTRONIC COMPONENT MOUNTING METHOD, AND METHOD FOR CHANGING ARRANGEMENT OF BOTTOM RECEPTION PIN MODULE - A bottom reception pin module | 11-07-2013 |
20130298382 | BOTTOM RECEPTION PIN MODULE FOR ELECTRONIC COMPONENT MOUNTING DEVICE, SUBSTRATE BOTTOM RECEPTION DEVICE, AND SUBSTRATE BOTTOM RECEPTION METHOD - A bottom reception pin module | 11-14-2013 |
20140201998 | LOWER RECEIVING PIN ARRANGEMENT METHOD AND LOWER RECEIVING PIN RETURN METHOD - A pre-array temporary placement area A | 07-24-2014 |