Patent application number | Description | Published |
20090196312 | Integrated circuit - An integrated circuit multiplexes transmission data faster than by a system clock, and transfers a timing pulse Txclk for that multiplexing and a multiplexed signal Txdata from a transmitter chip | 08-06-2009 |
20090196388 | SIGNAL TRANSMISSION SYSTEM AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - Disclosed is a semiconductor integrated circuit device including a transmitting circuit and a receiving coil inductively coupled to a transmitting coil. The transmitting circuit transmits data by supplying a current through the transmitting coil not at the time of transition of data but at every rising edge or falling edge of a clock used in transmission of data. At every rising edge or falling edge of the clock, a receiving circuit captures a voltage induced in the receiving coil due to the current flowing through the transmitting coil, reproduces the transmitted data and outputs the reproduced data. | 08-06-2009 |
20090267848 | Electronic circuit - An electronic circuit, for which a coil | 10-29-2009 |
20090322383 | SEMICONDUCTOR DEVICE, SIGNAL TRANSMITTER, AND SIGNAL TRANSMISSION METHOD - A semiconductor device is provided with a plurality of semiconductor chips and at least one transmission coil ( | 12-31-2009 |
20110039493 | ELECTRONIC CIRCUIT - By stacking and mounting a second substrate | 02-17-2011 |
20110090036 | INDUCTOR ELEMENT, INTEGRATED CIRCUIT DEVICE, AND THREE-DIMENSIONAL CIRCUIT DEVICE - The invention relates to an inductor element, an integrated circuit device and a three-dimensional circuit device where a wire passes through the opening of a coil so that the efficiency in the use of wires is high. | 04-21-2011 |
20110133309 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - The invention relates to a semiconductor device and a manufacturing method for the same, and makes the rejection rate of the product after chips are stacked and mounted sufficiently low, even when the chips are selected in a conventional, simple and inexpensive wafer test. | 06-09-2011 |
20110156488 | ELECTRONIC CIRCUIT - An electronic circuit carries out communication by inductive coupling between chips which are stacked and mounted. The electronic circuit relays an inter-chip communication signal by a repeater which receives a signal from a transmitter to recognize a transmission source and a receiving destination, and relays a received signal when the repeater itself exists between the transmission source and the receiving destination, and does not relay the received signal when the repeater itself does not exist between the transmission source and the receiving destination. Accordingly, data can be transferred at high speed up to a chip farther than the dimensions of a coil through communications by inductive coupling between the stacked and mounted chips. | 06-30-2011 |
20110201271 | ELECTRONIC CIRCUIT AND COMMUNICATION FUNCTIONALITY INSPECTION METHOD - To provide an electronic circuit capable of easily testing semiconductor chips that are inductively coupled to each other and that communicate with each other, and an inspection method performed in the electronic circuit. An electronic circuit includes: a first substrate; a first transmission coil that is formed by a wire and transmits a signal; a first transmission circuit that outputs a signal to the first transmission coil; a first reception coil that is formed by a wire at such a position that the first reception coil is inductively coupled to the first transmission coil and receives the signal from the first transmission coil; a first reception circuit that receives the signal from the first reception coil; and a first determination circuit that compares data input to the first transmission circuit and data output from the first reception circuit, the first transmission coil, the first transmission circuit, the first reception coil, the first reception circuit and the first determination circuit being mounted on the first substrate. | 08-18-2011 |
20110255352 | ELECTRONIC CIRCUIT - An electronic circuit for which a coil | 10-20-2011 |
20110260786 | ELECTRONIC CIRCUIT - To provide an electronic circuit that has an interposer (rewiring layer) inserted therein and an asynchronous receiver capable of properly receiving a signal. An electronic circuit includes: a first substrate having a first coil that is formed by a wire and transmits a signal and a first transmission circuit that is connected to the first coil and asynchronously outputs the signal to the first coil; a second substrate having a second coil that is formed by a wire at a position corresponding to the first coil and forms a communication channel with the first coil to receive the signal and a third coil that is connected to the second coil by a wire on the substrate and transmits the signal; and a third substrate having a fourth coil that is formed by a wire at a position corresponding to the third coil and forms a communication channel with the third coil to receive the signal and a first reception circuit that is connected to the fourth coil and asynchronously receives the signal, the first substrate, the second substrate and the third substrate being stacked on one another, and the first transmission circuit changes a current that is to be made to flow to the first coil each time a logical value of transmission data changes. | 10-27-2011 |
20110309907 | INDUCTOR ELEMENT AND INTEGRATED CIRCUIT DEVICE - The invention relates to an inductor element and an integrated circuit device where the efficiency of use of wire materials is high and noise interference through capacitive/inductive coupling from peripheral wires is low. | 12-22-2011 |
20120091211 | SEALED SEMICONDUCTOR RECORDING MEDIUM AND SEALED SEMICONDUCTOR MEMORY - The invention relates to a sealed semiconductor recording medium and a sealed semiconductor memory and provides at low cost a sealed semiconductor memory with high reliability that can allow wireless data communication to be carried out at high speed without interference. At least one semiconductor substrate is provided with a number of read only memory blocks having such a size that the maximum side is 20 mm or less in such a state that the read only memory blocks do not share a power source wire, wherein each of the above-described read only memory blocks has a coil for power reception and a coil for data communication, and data different from each other are written in the above-described read only memory blocks. | 04-19-2012 |
20120217658 | MULTI-STACK SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - The invention relates to a multi-stack semiconductor integrated circuit device where communication between semiconductor chips can be efficiently carried out by bypassing a number of chips. Each semiconductor chip that forms a multi-stack semiconductor integrated circuit device having a stack structure where four or more semiconductor chips having the same shape are stacked on top of each other is provided with: a first coil for transmission/reception for communication between chips over a long distance; and a second coil for transmission/reception for communication between chips over a short distance, of which the size is smaller than that of the above-described first coil for transmission/reception. | 08-30-2012 |
20130324044 | INTER-MODULE COMMUNICATION APPARATUS - The invention relates to an inter-module communication apparatus where the reflection is reduced so that the communication channel can provide high speed and broadband as compared to inductive coupling. | 12-05-2013 |
20150054349 | WIRELESS POWER SUPPLY DEVICE - Wirelessly supplying power is rapidly changed by a switching circuit | 02-26-2015 |