Patent application number | Description | Published |
20130241684 | METHOD FOR MANUFACTURING COMMON MODE FILTER AND COMMON MODE FILTER - Disclosed herein are a method for manufacturing common mode filter and a common mode filter. The method includes: performing electroplating on first coil patterns made of a conductive material to form second coil patterns having a cross-sectional area increased as compared to the first coil patterns. Therefore, the common mode filter fulfilling a miniaturization demand and having the improved characteristics such as the inductance, the DC resistance, and the like, may be implemented. | 09-19-2013 |
20130300527 | METHOD OF MANUFACTURING COIL ELEMENT AND COIL ELEMENT - The present invention relates to a method of manufacturing a coil element and a coil element, which include a process of forming, aligning, and coupling a first auxiliary layer and a second auxiliary layer of which coil portions formed of a plating pattern are disposed on a substrate or an insulating layer, and it is possible to overcome limitations due to collapse or deformation of a photoresist pattern even when forming a fine-pitch fine conductor coil with a high aspect ratio by applying a plating method using a photoresist pattern. | 11-14-2013 |
20130333202 | Method for Manufacturing High Frequency Inductor - Disclosed herein is a method for manufacturing a high frequency inductor, the method including; forming a primary coil for manufacturing the high frequency inductor on a wafer; coating a primary PSV on the wafer on which the primary coil is formed; forming a secondary coil for manufacturing the high frequency inductor, after the coating of the primary PSV; coating a secondary PSV, after the forming of the secondary coil; forming a barrier layer on an electrode portion to be exposed of the high frequency inductor, after the coating of the secondary PSV; filling and curing an insulating resin on the wafer, after the forming of the barrier layer; and polishing the cured resin up to the barrier layer to expose the electrode. | 12-19-2013 |
20140002231 | COMMON MODE NOISE FILTER | 01-02-2014 |
20140028430 | MULTILAYER INDUCTOR AND PROTECTING LAYER COMPOSITION FOR MULTILAYER INDUCTOR - Disclosed herein are a multilayer inductor including a protecting layer including an inorganic filler having different stretching ratios in traverse and mechanical directions or an inorganic filler coated with a color former, and a protecting layer composition of a multilayer inductor, including 10 to 30 parts by weight of an inorganic filler having different stretching ratios in traverse and mechanical directions, and 10 to 30 parts by weight of a dispersant, based on 100 parts by weight of an epoxy resin, so that thermal deformation of an inductor chip can be reduced by including the inorganic filler having different stretching ratios in traverse and machine directions in the outermost insulating layer of the multilayer inductor, thereby reducing change in external appearance due to heat, thereby providing a multilayer inductor securing reliability. | 01-30-2014 |
20140035714 | FERRITE POWDER, METHOD FOR PREPARING THE SAME, AND COMMON MODE NOISE FILTER INCLUDING THE SAME AS MATERIAL FOR MAGNETIC LAYER - Disclosed herein are a ferrite powder not including pores in a surface thereof, a method for preparing the same, and a common mode noise filter including the same as a material for a magnetic layer. The spherical ferrite powder in which the pores in the surface thereof are removed as a magnetic layer of the common mode noise filter has high density, such that dispersibility is improved, thereby making it possible to improve adhesive strength with a polymer binder to be mixed. In addition, the adhesive strength between the polymer binder and the ferrite powder is improved, such that at the time of manufacturing or mounting of a chip, a defect such as a crack generated by a thermal impact due to a lack of adhesive strength between the ferrite powder and the polymer binder may be suppressed, thereby securing the reliability with respect to the thermal impact. | 02-06-2014 |
20140049353 | INDUCTOR AND METHOD OF MANUFACTURING INDUCTOR - The present invention relates to an inductor and a method of manufacturing an inductor and provides an inductor which can minimize the area required for mounting, reduce parasitic capacitance generated between a circuit pattern of a substrate and a coil pattern of the inductor, and be efficiently manufactured by providing both of a first external electrode portion and a second external electrode portion on one of six surfaces of the inductor while including a coil pattern portion; an insulating portion; the first external electrode portion; and the second external electrode portion. | 02-20-2014 |
20140062637 | Common Mode Filter With ESD Protection Pattern Built Therein - Disclosed herein is a common mode filter with an ESD protection pattern built therein. The common mode filter includes a base substrate that is made of an insulating material, a first insulating layer that is formed on the base substrate, a coil-shaped internal electrode that is formed on the first insulating layer, a second insulating layer that is formed on the internal electrode, a first external electrode terminal that is formed on the second insulating layer, a first ferrite resin layer that is formed on the second insulating layer and receives the first external electrode terminal, an ESD protection pattern that is formed on the first external electrode terminal, a second external electrode terminal that is formed on the ESD protection pattern, and a second ferrite resin layer that is formed on the first ferrite resin layer and receives the second external electrode terminal. | 03-06-2014 |
20140062644 | THIN FILM TYPE COMMON MODE FILTER - Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained. | 03-06-2014 |
20140132366 | FILTER CHIP ELEMENT AND METHOD OF PREPARING THE SAME - Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components. | 05-15-2014 |
20140133107 | THIN FILM TYPE CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other. | 05-15-2014 |
20140145797 | COMMON MODE NOISE CHIP FILTER AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a common mode noise chip filter and a method for manufacturing the same, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer complex layer formed on the result substrate having the coil patterns formed therein, wherein the ferrite-polymer complex layer has a multilayer structure, so that the ferrite-polymer complex layer filling an inner space of the substrate having inner coil patterns is formed to have the multilayer structure but not a single-layer structure, thereby lowering internal stress, and thus improving reliability of the common mode noise chip filter as a product. | 05-29-2014 |
20140145814 | THIN FILM TYPE CHIP DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a thin film type chip device including a coil pattern formed on the substrate; a cavity defining pattern defining a cavity through which a part of the coil pattern is exposed; a filling layer filled in the cavity; and a magnetic layer including a surface layer covering a surface of the filling layer. | 05-29-2014 |
20140159565 | ELECTROSTATIC DISCHARGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an electrostatic discharging structure including single-wall carbon nano tubes disposed between electrodes at a predetermined interval to precisely control discharge starting voltage generating a discharge phenomenon between electrodes, and a method of manufacturing an electrostatic discharging structure. | 06-12-2014 |
20140159849 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an electronic component and a method of manufacturing the same. In the electronic component having a hexahedral shape and including an insulating portion formed on an upper part of a base substrate, a coil pattern portion formed in the insulating portion and wound with a conductive wire, and a plurality of external electrodes separated from each other and electrically connected with the coil pattern portion, each external electrode covers a part of an upper surface of the insulating portion and extending to an upper surface of the electronic component and a region between the external electrodes is provided with a ferrite block covering an exposed surface of the insulating portion, thereby improving magnetic permeability as compared with the electronic component of the related art. | 06-12-2014 |
20140160610 | COMMON MODE FILTER - Disclosed herein is a common mode filter. The common mode filter includes a main body that includes a coil electrode, first and second external electrodes connected with both ends of the coil electrode, respectively, and a ground electrode, and an electro static discharge (ESD) protection layer that includes a switching member formed therein, and is provided on any one surface of the main body. Here, one end of the coil electrode is connected with the second external electrode, the other end thereof is connected with the first external electrode through the switching member, and the switching member is disconnected from the coil electrode in accordance with a switching operation when a surge current is applied and connected with the ground electrode. Therefore, it is possible to protect the common mode filter from a surge current by ESD. | 06-12-2014 |
20140167902 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a common mode filter capable of implementing high inductance without deterioration of a moisture resistance load, and a method of manufacturing the same. The common mode filter includes: a magnetic substrate; an insulating layer disposed on the magnetic substrate; and a coil electrode layer disposed in the insulating layer, wherein the magnetic substrate has a groove part formed at an edge of an upper surface thereof, and a material of the insulating layer is filled into the groove part. | 06-19-2014 |
20140176277 | COMMON MODE FILTER HAVING SIGNAL COMPENSATION FUNCTION - Disclosed herein is a common mode filter having a signal compensating function, including: a magnetic substance substrate included as a base of the common mode filter; a first conductor coil portion that is formed on a surface of the magnetic substance substrate and is included to remove common mode noise generated in a circuit; and a second conductor coil portion that is electrically connected to the first conductor coil portion to be formed on an upper portion of the first conductor coil portion, and is included to compensate for a signal reduction portion of the circuit due to removal of noise by using the first conductor coil portion. | 06-26-2014 |
20140176279 | COMMON MODE FILTER - Disclosed herein is a common mode filter including: a coil part including a conductor coil provided in an insulating part; a plurality of external electrodes provided on the insulating part while being electrically connected to the conductor coil; and a magnetic material part provided in a region between the plurality of external electrodes on the insulating part. By this configuration, impedance characteristics of the common mode filter may be improved. | 06-26-2014 |
20140176280 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a common mode filter, inlcuding: an external magnetic layer; an insulating layer formed on the external magnetic layer and having coil electrodes therein; a protecting layer formed on the insulating layer; an internal magnetic layer formed inside an opening part formed in one surface of the protecting layer; and external electrode terminals passing through the protecting layer and connected with end portions of the coil electrodes, so that there can be provided a common mode filter having excellent durability, moisture resistance, and heat resistance. | 06-26-2014 |
20140176283 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a common mode filter for increasing inductance using simpler structure and a method of manufacturing the same, the common mode filter including: a magnetic material substrate; an insulating layer included on an upper portion of the magnetic material substrate and having a coil electrode formed therein; an opening part penetrating through a central portion of the insulating layer; and a magnetic composite formed in the opening part, wherein the opening part has a side wall inclined at a predetermined angle. | 06-26-2014 |
20140176284 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a method of manufacturing a common mode filter forming a coil electrode by directly patterning metal layers laminated on both surfaces of a core insulating layer while not using a build-up process, and the common mode filter manufactured according to the method. | 06-26-2014 |
20140184377 | INDUCTOR - Disclosed herein is an inductor including: a substrate; an insulating part provided on the substrate; and a conductive pattern part provided in the insulating part, wherein the insulating part includes first and second insulating parts that are provided at regions physically separated from each other, the first and second insulating parts being made of materials of which at least one of dielectric constant and heat resistance are different. In the inductor according to the present invention, high Q and L values may be implemented, and deformation by heat treatment may also be decreased, thereby making it possible to improve reliability. | 07-03-2014 |
20140192446 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is an electrostatic discharge protection device including: a substrate; electrodes disposed to be spaced apart from each other on the substrate; and an electrostatic discharge absorbing layer having atypical metal lumps formed on the substrate. | 07-10-2014 |
20140192452 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND CHIP COMPONENT WITH THE SAME - Disclosed herein is an electrostatic discharge protection device including: a lower cover; electrodes disposed on the lower cover, being spaced apart from each other; a conductor disposed on the lower cover; and a semiconducting material layer covering the lower cover and the electrodes and formed of a semiconducting material. | 07-10-2014 |
20140203900 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a common mode filter including: a magnetic substrate; an electrode layer disposed on one surface of the magnetic substrate and formed of a coil electrode and an insulating resin enclosing the coil electrode; and an uneven layer disposed between the magnetic substrate and the electrode and formed of a groove and a projection, wherein a part of the insulating resin is depressed between the groove of the uneven layer, whereby an adhesion between the magnetic substrate and the insulating resin is increased. | 07-24-2014 |
20140240075 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode. | 08-28-2014 |
20140285304 | INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is an inductor including: a core layer having a conductive pattern formed on a surface thereof and having a through-hole formed at a region in which the conductive pattern is not formed; and a magnetic layer covering the core layer, wherein the magnetic layer includes: a filled part filled in the through-hole and having high magnetic material filling density; and a cover part covering the surface of the core layer and having magnetic material filling density lower than that of the filled part. | 09-25-2014 |
20140285305 | INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process. | 09-25-2014 |
20140312992 | COMMON MODE FILTER - Disclosed herein is a common mode filter having improved insertion loss characteristics. The common mode filter includes: first and second coil electrode patterns formed at an upper layer and alternately disposed; and first and second coil electrode patterns formed at a lower layer and alternately disposed, wherein the outermost pattern of the upper layer and the outermost pattern of the lower layer are coil electrode patterns having the same order. | 10-23-2014 |
20140313005 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a common mode filter capable of increasing a thickness of the coil electrode in a more simple and stable scheme. The common mode filter includes: a magnetic substrate; a coil electrode formed on one surface of the magnetic substrate and enclosed by an insulating resin; and external electrode terminals connected to both ends of the coil electrode, wherein the coil electrode includes a first metal pattern layer and a second metal pattern layer formed on the first metal pattern layer by performing electroplating using the first metal pattern layer as a lead wire. | 10-23-2014 |
20140333404 | COIL COMPONENT - Disclosed herein is a coil component including: an insulating layer containing a ferrite powder and a coil electrode embedded in the insulating layer, in which a particle diameter of the ferrite powder is smaller than a wavelength of light which is used during an exposure process, thereby increasing permeability and improving an impedance characteristic. | 11-13-2014 |
20140333406 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a common mode filter. | 11-13-2014 |
20150040382 | INDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF - Disclosed herein are an inductor element and a manufacturing method thereof. The inductor element includes: an electrode body formed of insulating material and having an internal electrode having a coil shape disposed therein; and external terminals formed on a part of the electrode body and each connected with both ends of the internal electrode, wherein electrode body is formed and separated on a base substrate, whereby a size of the inductor element is reduced. | 02-12-2015 |
20150048920 | INDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an inductor element having an internal electrode in which a first plating layer and a second plating layer having a coil shape are embedded, the inductor element including: a first plating layer formed on a support member; an insulating layer covering the first plating layer and provided with an opening which exposes an upper surface of the first plating layer; and a second plating layer filled in the opening, whereby the inductor element in which the internal electrode having a high aspect ratio is embedded is implemented. | 02-19-2015 |
20150082897 | TOUCH SENSOR MODULE - Disclosed herein is a touch sensor module, including: a flexible cable provided with a terminal part; an adhesive layer formed to transfer an electrical signal by being contacted on one surface of the terminal part; a base substrate including an electrode pad which is formed to correspond to the terminal part and formed to be contact on the other surface of the adhesive layer; and a first passivation layer coating one end of the electrode pad. | 03-26-2015 |