Sugikawa
Akihiko Sugikawa, Kanagawa-Ken JP
Patent application number | Description | Published |
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20090089580 | WIRELESS COMMUNICATION DEVICE, PORTABLE TERMINAL, COMMUNICATION CONTROL PROGRAM AND COMMUNICATION SYSTEM - A wireless communication device, comprising: a wireless communication unit which communicates with other communication device located at a prescribed range; a first identification information generator which generates first identification information including a service name of available service and inherent information; an encryption unit configured to encrypt said first identification information by using a prescribed encryption key to generate encryption data; a second identification information generator which generates second identification information including the service name, the inherent information and the encryption data; and an inherent information transmitter which transmits the second identification information for an other communication device which has requested transmission of the inherent information. | 04-02-2009 |
Jun Sugikawa, Utsunomiya-Shi JP
Patent application number | Description | Published |
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20120117779 | MACHINE TOOL ASSEMBLING APPARATUS AND METHOD OF ASSEMBLING MACHINE TOOL USING MACHINE TOOL ASSEMBLING APPARATUS - A machine tool assembling apparatus and a method of assembling a machine tool using the machine tool assembling apparatus are provided. The machine tool assembling apparatus includes a table, a first support mechanism having an arm which is swingable toward and away from the table, and a second support mechanism. The first support mechanism is disposed between the table and the second support mechanism. The first support mechanism is rotated to bring the arm into facing relation to either the table or the second support mechanism. | 05-17-2012 |
Mai Sugikawa, Isehara JP
Patent application number | Description | Published |
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20120248433 | SEMICONDUCTOR DEVICE - A semiconductor device of stable electrical characteristics, whose oxygen vacancies in a metal oxide is reduced, is provided. The semiconductor device includes a gate electrode, a gate insulating film over the gate electrode, a first metal oxide film over the gate insulating film, a source electrode and a drain electrode which are in contact with the first metal oxide film, and a passivation film over the source electrode and the drain electrode. A first insulating film, a second metal oxide film, and a second insulating film are stacked sequentially in the passivation film. | 10-04-2012 |