Patent application number | Description | Published |
20110042649 | Thin-Film Transistor, Carbon-Based Layer and Method of Producing Thereof - The present invention relates to a thin-film transistor which comprises a conductive and predominantly continuous carbon-based layer ( | 02-24-2011 |
20140145301 | SINGLE-CHIP INTEGRATED CIRCUIT WITH CAPACITIVE ISOLATION - An integrated circuit, including at least two integrated circuit portions mutually spaced on a single electrically insulating die and at least one coupling region on the die to provide capacitive coupling between the otherwise mutually isolated integrated circuit portions, the integrated circuit portions being formed by a plurality of layers on the single die, the layers including metal and dielectric layers and at least one semiconductor layer; wherein at least one of the dielectric layers extends from the integrated circuit portions across the coupling region and at least a corresponding one of the metal layers and/or at least one semiconductor layer extends from each of the integrated circuit portions and partially across the coupling region to form capacitors therein and thereby provide the capacitive coupling between the integrated circuit portions. | 05-29-2014 |
20140209928 | LIGHT SOURCE ASSEMBLY AND A PROCESS FOR PRODUCING A LIGHT SOURCE ASSEMBLY - A light source assembly, including one or more light emitting diodes disposed within a hermetically sealed enclosure, wherein the light emitting diodes are in the form of one or more unpackaged planar semiconductor dies mounted on an inner surface of a wall of the enclosure, wherein the wall of the enclosure includes electrically conductive tracks that connect electrical contacts of the unpackaged planar semiconductor dies to corresponding electrical contacts external of the sealed enclosure. | 07-31-2014 |