Patent application number | Description | Published |
20120126279 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT - An optoelectronic semi-conductor component includes a first carrier having a top side and an underside laying opposite the top side of the first carrier, wherein the first carrier has a first and a second region; at least one optoelectronic semiconductor chip arranged at the top side on the first carrier; and at least one electronic component arranged in the second region at the underside of the first carrier, wherein the first region has a greater thickness in a vertical direction than the second region, wherein, at the underside, the first region projects beyond the second region in a vertical direction, and the at least one electronic component is electrically conductively connected to the at least one optoelectronic semi-conductor chip. | 05-24-2012 |
20130113010 | Optoelectronic Component and Method for Producing an Optoelectronic Component - An optoelectronic component comprising an optoelectronic semiconductor chip ( | 05-09-2013 |
20130200417 | RADIATION-EMITTING COMPONENT AND METHOD FOR PRODUCING A RADIATION-EMITTING COMPONENT - A radiation-emitting component including a semiconductor chip having a semiconductor body with an active region that generates a primary radiation, and including a conversion element that at least partly converts the primary radiation, wherein the conversion element is fixed to the semiconductor chip with a connecting layer and a radiation conversion substance is formed in the connecting layer. | 08-08-2013 |
20130210181 | PROCESS FOR PRODUCING A LAYER COMPOSITE CONSISTING OF A LUMINESCENCE CONVERSION LAYER AND A SCATTERING LAYER - A process of producing a layer composite includes a luminescence conversion layer and a scattering layer, wherein a press having a first pressing tool with a cavity and a second pressing tool is used including introducing a first polymer including a luminescence conversion substance into the cavity, inserting a film between the first and second tools, closing the press and carrying out a first pressing, hardening the first polymer to form a luminescence conversion layer in the press, opening the press, wherein the luminescence conversion layer adhering to the film remains in the press, introducing a second polymer including scattering particles into the cavity, closing the press and carrying out a second pressing, hardening the second polymer to form a scattering layer disposed on the luminescence conversion layer, opening the press, and removing the support film with the layer composite including the luminescence conversion layer and the scattering layer. | 08-15-2013 |
20130228799 | METHOD FOR PRODUCING A SILICONE FOIL, SILICONE FOIL AND OPTOELECTRONIC SEMICONDUCTOR COMPONENT COMPRISING A SILICONE FOIL - A method of producing a silicone foil for use in an optoelectronic semiconductor component by molding including introducing a mold foil into a mold, introducing a carrier foil into the mold, wherein the carrier foil is fitted on a substrate foil and the substrate foil projects laterally beyond the carrier foil at least in places within a cavity of the mold, providing and applying a silicone base composition to the mold foil or to the carrier foil, molding the silicone base composition for the silicone foil in the mold between the mold foil and the carrier foil, wherein the silicone base composition is brought into contact with the substrate foil in at least one overlap region laterally alongside the carrier foil, removing the mold foil from the silicone foil, and separating the overlap region. | 09-05-2013 |
20130334558 | METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT - A method of producing an optoelectronic component includes providing a cavity; introducing a liquid matrix material with phosphor particles distributed therein into the cavity; introducing a semiconductor chip into the matrix material; sedimenting the phosphor particles in the matrix material; and curing the matrix material, wherein a conversion layer including phosphor particles is produced, said conversion layer being arranged on the semiconductor chip. | 12-19-2013 |
20140168988 | OPTICAL ELEMENT, OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF - An optical element for light outcoupling and/or conversion of light includes a light-emitting semiconductor chip with at least one layer selected from a wavelength conversion layer, a scattering layer, a light outcoupling layer and a lens layer, which each includes a plastics material processable in a compression molding method. | 06-19-2014 |
20150187685 | LEADFRAME ASSEMBLY, HOUSING ASSEMBLY, MODULE ASSEMBLY AND METHOD OF DETERMINING AT LEAST ONE VALUE OF A MEASUREMENT VARIABLE OF AN ELECTRONIC MODULE - A leadframe assembly is formed from an electrically conductive material. The leadframe assembly includes a first longitudinal element, at least one second longitudinal element, a plurality of first leadframe sections and a plurality of second leadframe sections. | 07-02-2015 |