Patent application number | Description | Published |
20080218799 | Extended COB-USB With Dual-Personality Contacts - A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB memory card includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. Passive components are mounted on a lower surface of the PCB using SMT methods, and IC dies are mounted using COB methods, and then the components and IC dies are covered by a plastic molded housing. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The PCBA includes dual-personality electronics for USB and EUSB communications. | 09-11-2008 |
20080235939 | Manufacturing Method For Micro-SD Flash Memory Card - A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCB regions arranged in parallel rows. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded layer is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The panel is then singulated using one of a laser cutting method, an abrasive water jet cutting method, and a mechanical grinding method such that the resulting PCB substrate and plastic housing have the width, height and length specified by MicroSD specifications. A front edge chamfer process is then performed. | 10-02-2008 |
20080266816 | Light-Weight Solid State Drive With Rivet Sets - A Solid State Drive (SSD) device includes a printed circuit board assembly (PCBA) defining rivet holes, and a support structure including parallel side frame rails defining rivet openings and support platforms for receiving and supporting the PCBA. Compression-mated rivet sets are used to connect the PCBA to the support structure, each rivet set including a female rivet portion and an associated male rivet portion. The PCBA is mounted onto the support structure such that the rivet holes are aligned with the rivet openings of the plurality of rivet openings, and then the rivet sets are mounted and secured using an automatic rivet tool such that each rivet set extends through an associated rivet hole/opening and fixedly engaged such that the PCBA and the support structure are held between end caps of the respective male and female rivet portions. | 10-30-2008 |
20080286990 | Direct Package Mold Process For Single Chip SD Flash Cards - A Secure Digital device including a PCBA having passive components mounted on a PCB using surface mount technology (SMT) techniques, and active components (e.g., controller and flash memory) mounted using chip-on-board (COB) techniques. The components are mounted only on one side of the PCB, and then a molded plastic casing is formed over both sides of the PCB such that the components are encased in the plastic, and a thin plastic layer is formed over the PCB surface opposite to the components. The molded plastic casing is formed to include openings that expose metal contacts provided on the PCB, and ribs that separate the openings. In one embodiment the metal contacts are formed on the same side as the thin plastic layer, and in an alternate embodiment the metal contacts are formed on a block that is mounted on the PCB during the SMT process. | 11-20-2008 |
20090086448 | SOLID STATE DRIVE WITH COVERLESS CASING - The present invention discloses a solid state drive with a coverless casing, which comprises: a printed circuit board assembly and a coverless casing. In the resent invention, the coverless casing is free of a top cover; thereby, air circulation can be enhanced to cool down the electronic components on a printed circuit board assembly more efficiently. Further, in the present invention, the coverless casing is designed to have the printed circuit board assembly electrically connected to the chassis ground of the host system via the coverless casings; thereby, unwanted electrostatic charges can be dissipated to the chassis ground of the host system before it can damage the electronic components on the printed circuit board assembly; thus, the ESD resistance thereof is promoted. Furthermore, the solid state drive with a coverless casing of the present invention is made of lightweight materials and easy to fabricate and simple to assemble; therefore, the present invention have the advantages of light weight and low cost. | 04-02-2009 |
20090093136 | Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs - A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. | 04-09-2009 |
20090097215 | UV-EPOXY AND ULTRASONIC CASE ASSEMBLY METHODS FOR USB FLASH DRIVE - The present invention discloses UV-epoxy and ultrasonic case assembly methods for a USB flash drive, wherein a transparent or translucent top cover is fastened to a bottom cover containing a printed circuit board assembly via an UV-cure epoxy glue or an ultrasonic weld method. As the top cover of the USB flash drive is transparent or translucent, the USB flash drive has a see-through property and presents an aesthetic taste, which can attract the attention of consumers. Further, the method of the present invention uses less case parts and fewer steps and thus can fabricate a USB flash drive having a lower cost and a better quality at a higher throughput. Furthermore, the USB flash drive fabricated according to the method of the present invention has a better moisture resistance and a better water resistance. | 04-16-2009 |
20090100295 | RELIABLE MEMORY MODULE TESTING AND MANUFACTURING METHOD - A method of testing memory modules comprising jumping through all addressable memory blocks a first and second time is disclosed. Each jumped-to address is determined by first XORing the last two bits of the previous address, and then XORing the first result with a bit representation of the previous jump direction for a second result. The second result determines the direction of the next jump, either upwards or downwards. Each jumped-to address is XORed with its contents, and the result is written to the address. For initially empty and defect-free memory, this results in all 1 values written for the first time jumping, and all 0 values written for the second time jumping. Finally, after the second time jumping, all addressable memory values are checked, and any non-0 value addresses are identified as defective memory cells. | 04-16-2009 |
20090190277 | ESD Protection For USB Memory Devices - ESD protection for a portable electronic device is provided by sandwiching a metal ground layer between prepreg (i.e., FR4 or other non-conductive PCB material) layers to form an ESD preventive PCB structure, where the metal ground layer is electrically connected to one or more of the integrated circuit (IC) components (e.g., at least one controller die, a non-volatile memory die, oscillator and passive components) that are mounted on the PCB by way of conductive via structures, and is accessible by way of one or more conductive anchor hole structures to external grounding structures. The one or more conductive anchor hole structures are positioned such that the metal ground layer is automatically electrically connected to the chassis ground of a host system when the portable device is coupled to a plug structure of the host system, e.g., by way of a metal connector jacket. | 07-30-2009 |
20090194616 | Sporoderm-Broken Polypore Production - A cryogenic grinding mill for grinding organic base material pieces into sub-micron-sized powder particles. An upper grinding block is rotated relative to a stationary lower grinding block by a motor, and is maintained at a temperature below −150° C. by a cryogenic system including an annular liquid nitrogen chamber disposed around the grinding blocks. The upper grinding block defines a trench for receiving base material pieces fed by a feed system, and includes through-holes that extend from the trench to a grinding region formed between the grinding surfaces of the upper and lower blocks. When the upper grinding block is rotated, the base material pieces are gravity-fed from the trench to the grinding region, and ground powder material is forced to a peripheral edge of the grinding region. The powder material is then filtered, and particles having an undesirably large size are fed back into the trench for re-grinding. | 08-06-2009 |
20090258516 | USB Device With Connected Cap - A USB device including a housing and a protective cap that are slidably and/or pivotably connected together such that the protective cap is able to slide and/or pivot between an open position, in which a plug connector extending from the front of the housing is exposed for operable coupling to a host system, and a closed position, in which the protective cap is disposed over the front end portion of the housing to protect the plug connector. A pivoting/sliding mechanism is provided on the housing and cap that secures the protective cap to the housing at all times, including during transitional movements of the protective cap between the opened and closed positions. | 10-15-2009 |
20090273096 | High Density Memory Device Manufacturing Using Isolated Step Pads - An electronic device includes multiple IC dies stacked in an offset stacking arrangement on a substrate. Each IC die includes electrically isolated step pads that facilitates transmitting a dedicated signal between a (beginning) substrate bonding pad and a selected (terminal) contact pad of any die by way of short bonding wires that extend up the stack between the electrically isolated step pads. A memory devices includes stacked memory IC die, wherein “shared” signal transmission paths are formed by associated bonding wires that link corresponding contact pads of each memory die, and dedicated select/control signals are transmitted to each memory die by separate transmission paths formed in part by associated electrically isolated step pads. Substrate space overhung by the stack is used for passive components and IC dies. Memory controller die may be mounted on the stack and connected by dedicated transmission paths utilizing the electrically isolated step pads. | 11-05-2009 |
20090316368 | USB Package With Bistable Sliding Mechanism - A USB device including a bistable mechanism that serves to bias a plug connector into one of two stable states, where the first stable state is associated with a retracted position in which the plug connector is fully retracted inside a housing, and the second stable state is associated with a deployed position in which the plug connector extends through the front opening for coupling to a host system. Movement of the plug connector form the retracted to the deployed position is performed by manually applying a force to a handle portion that protrudes through a slot defined in the housing. The bistable mechanism resists the deploying force until an equilibrium point is reach, after which the bistable mechanism releases stored potential energy to complete the deploying process and to maintain the plug connector is the deployed position. | 12-24-2009 |
20100105251 | Micro-SD To Secure Digital Adaptor Card And Manufacturing Method - A microSD-to-SD adaptor card includes a base substrate having a lead frame structure, a protective cap forming a chamber that encloses eight microSD contact pins of the lead frame structure, and a thermoset plastic casing formed over the protective cap and exposed portions of the base substrate to provide the adaptor card with standard SD card dimensions. A rear opening facilitates insertion of a standard microSD card, whereby the eight contact pads on the microSD card are contacted by the eight microSD contact pins inside the chamber to allow electrical signals generated by the microSD card to be transmitted to a host system by way of a standard SD socket. A grip anchor pin is disposed inside the chamber to engage a grip notch disposed on the microSD card. A pre-molded switch slot is provided on the molded plastic casing, and an insert-in write protect switch is mounted after molding. | 04-29-2010 |
20100110647 | Molded Memory Card With Write Protection Switch Assembly - A Secure Digital device including a PCBA having passive components mounted on a PCB using surface mount technology (SMT) techniques, and active components (e.g., controller and flash memory) mounted using chip-on-board (COB) techniques. The components are mounted only on one side of the PCB, and then a molded plastic casing is formed over both sides of the PCB such that the components are encased in the plastic, and a thin plastic layer is formed over the PCB surface opposite to the components. The molded plastic casing is formed to include openings that expose metal contacts provided on the PCB, and ribs that separate the openings. The molded plastic casing defines a pre-molded switch slot that facilitates an insert-in switch assembly process for mounting a write protect switch. The write protect switch includes a movable switch button engaged in the switch slot, and a switch cap secured over the switch slot. | 05-06-2010 |
20100248512 | USB Device With Connected Cap - A USB device including a housing and a protective cap that are slidably and/or pivotably connected together such that the protective cap is able to slide and/or pivot between an open position, in which a plug connector extending from the front of the housing is exposed for operable coupling to a host system, and a closed position, in which the protective cap is disposed over the front end portion of the housing to protect the plug connector. A pivoting/sliding mechanism is provided on the housing and cap that secures the protective cap to the housing at all times, including during transitional movements of the protective cap between the opened and closed positions. | 09-30-2010 |
20120030943 | Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs - A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device | 02-09-2012 |