Patent application number | Description | Published |
20130322598 | RADIATION DETECTION APPARATUS AND IMAGING SYSTEM - A radiation detection apparatus comprising a sensor panel in which a plurality of sensors for detecting light are arranged, and a scintillator layer containing scintillator particles for converting an incident radiation into light, and an adhesive resin which has an adherence property and bonds the scintillator particles, wherein the scintillator layer is adhered to the sensor panel by the adhesive resin, a modulus of elasticity in tensile of the adhesive resin is higher than 0.7 GPa and lower than 3.5 GPa, and a volume ratio of the adhesive resin to the scintillator particles is not lower than 1% and not higher than 5%. | 12-05-2013 |
20130334431 | DETECTING APPARATUS AND RADIATION DETECTING SYSTEM - In order to provide a detecting apparatus which is able to reduce unevenness in image even if an organic material is used for a protective layer covering a plurality of photoeectric conversion elements, the detecting apparatus includes a plurality of photoelectric conversion elements, a protective layer made from an organic material, provided so as to cover the plurality of photoelectric conversion elements, and a conductive member provided between the plurality of photoelectric conversion elements and the protective layer so as to cover the plurality of photoelectric conversion elements and receiving a predetermined potential. | 12-19-2013 |
20130341516 | RADIATION DETECTION APPARATUS, METHOD OF MANUFACTURING THE SAME, AND IMAGING SYSTEM - A radiation detection apparatus comprises a sensor panel including a plurality of sensor units which detect radiation and are arrayed, each of the plurality of sensor units comprising a pixel array including a plurality of pixels which detect light and are two-dimensionally arranged, a scintillator layer which converts radiation into light, and a first scintillator protective layer disposed to cover the scintillator layer, and the radiation detection apparatus further comprising a second scintillator protective layer disposed to cover the plurality of sensor units. | 12-26-2013 |
20140034836 | RADIATION DETECTION APPARATUS, MANUFACTURING METHOD THEREOF, AND RADIATION DETECTION SYSTEM - A radiation detection apparatus includes a sensor panel configured to detect light; and a scintillator layer arranged on the sensor panel. The scintillator layer has a scintillator configured to convert radiation into light of a wavelength that is detectable by the sensor panel. The scintillator layer also has particles that have a property of generating a bubble and expanding so as to weaken adhesive force between the sensor panel and the scintillator layer. The scintillator layer also a resin that holds the scintillator and the particles so as to be mixed together. The scintillator layer is adhered to the sensor panel with use of the resin. | 02-06-2014 |
20140054467 | RADIATION IMAGING APPARATUS AND RADIATION IMAGING SYSTEM - A radiation imaging apparatus comprising a plurality of sensor units each including a plurality of photoelectric converters, a substrate configured to support the plurality of sensor units, and a scintillator, wherein the scintillator comprises scintillator grains configured to convert radiation into light and a binder configured to make the scintillator grains adhere to each other, and the scintillator includes first portions provided between the plurality of sensor units and a second portion provided on the plurality of sensor units and the substrate. | 02-27-2014 |
20140374608 | RADIATION DETECTION APPARATUS AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a radiation detection apparatus, includes a bonding step of bonding, on a support substrate, a sensor substrate including a photoelectric converter in which a plurality of photoelectric conversion elements are arranged, by using a bonding layer including a passage which exhausts a gas between the support substrate and the sensor substrate, and a formation step of forming a scintillator layer on the photoelectric converter after the bonding step. The bonding layer has a heat resistance by which bonding between the support substrate and the sensor substrate by the bonding layer is maintained in the formation step. | 12-25-2014 |
Patent application number | Description | Published |
20130153775 | RADIATION DETECTION APPARATUS - A radiation detection apparatus comprising, a sensor panel including sensor unit disposed on a plurality of photoelectric converters on a substrate, a first scintillator layer disposed on the sensor panel, and a second scintillator layer disposed on the first scintillator layer, wherein the first scintillator layer and the second scintillator layer respectively emit light beams having different wavelengths, and the sensor unit which includes a first photoelectric converter configured to detect the light beam emitted by the first scintillator layer, a first transistor configured to output a signal from the first scintillator layer, a second photoelectric converter configured to detect the light beam emitted by the second scintillator layer, and a second transistor configured to output a signal from the second scintillator layer, and individually convert the light beams having the different wavelengths into electrical signals. | 06-20-2013 |
20130168559 | RADIATION DETECTION APPARATUS - A radiation detection apparatus including a sensor panel which includes a plurality of pixels two-dimensionally arranged on a substrate and detects light, and a scintillator layer which is disposed on the sensor panel and converts radiation into light, the apparatus, comprising members embedded in regions between the plurality of pixels in the scintillator layer, wherein the member satisfies a relationship of μ | 07-04-2013 |
20140284456 | RADIATION DETECTION APPARATUS AND RADIATION DETECTION SYSTEM - A radiation detection apparatus includes a substrate; a pixel area constituted of one or more pixels including a sensor element on the substrate; and a light source, wherein the light source is disposed at a side of the substrate in which the pixel area is disposed and outside of the pixel area, and light from the light source is incident on the sensor element. | 09-25-2014 |