Shih-Kuang
Shih-Kuang Chen, Kaohsiung City TW
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20140191350 | IMAGE SENSOR CHIP PACKAGE AND FABRICATING METHOD THEREOF - An image sensor chip package is disclosed, which includes a substrate, an image sensor component formed on the substrate, a spacer formed on the substrate and surrounding the image sensor component, and a transparent plate. A stress notch is formed on a side of the transparent plate, and a breaking surface is extended from the stress notch. A method for fabricating the image sensor chip package is also disclosed. | 07-10-2014 |
20140213010 | WAFER PACKAGING METHOD - A wafer packaging method includes the following steps. A light transmissive carrier is provided. A hydrolytic temporary bonding layer is formed on the light transmissive carrier. A first surface of a light transmissive protection sheet is bonded to the hydrolytic temporary bonding layer, such that the hydrolytic temporary bonding layer is located between the light transmissive protection sheet and the light transmissive carrier. A second surface of the light transmissive protection sheet facing away from the first surface is bonded to a third surface of a wafer. The light transmissive carrier, the hydrolytic temporary bonding layer, the light transmissive protection sheet, and the wafer are immersed in a high temperature liquid, such that adhesion force of the hydrolytic temporary bonding layer is eliminated. The light transmissive protection sheet and the wafer are obtained from the high temperature liquid. | 07-31-2014 |
20140252642 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a semiconductor substrate; a device region formed in the semiconductor substrate; at least a conducting pad disposed over a surface of the semiconductor substrate; a protection plate disposed over the surface of the semiconductor substrate; and a spacer layer disposed between the surface of the semiconductor substrate and the protection plate, wherein the protection plate and the spacer layer surround a cavity over the device region, the spacer layer has an outer side surface away from the cavity, and the outer side surface of the spacer layer is not a cutting surface. | 09-11-2014 |
Shih-Kuang Chiu, Taichung Hsien TW
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20130017643 | METHOD FOR FABRICATING PACKAGE STRUCTURE HAVING MEMS ELEMENTSAANM LIN; Chen-HanAACI Taichung HsienAACO TWAAGP LIN; Chen-Han Taichung Hsien TWAANM CHANG; Hong-DaAACI Taichung HsienAACO TWAAGP CHANG; Hong-Da Taichung Hsien TWAANM LIU; Cheng-HsiangAACI Taichung HsienAACO TWAAGP LIU; Cheng-Hsiang Taichung Hsien TWAANM LIAO; Hsin-YiAACI Taichung HsienAACO TWAAGP LIAO; Hsin-Yi Taichung Hsien TWAANM CHIU; Shih-KuangAACI Taichung HsienAACO TWAAGP CHIU; Shih-Kuang Taichung Hsien TW - A fabrication method of a package structure having MEMS elements includes: disposing a plate on top of a wafer having MEMS elements and second alignment keys; cutting the plate to form therein a plurality of openings exposing the second alignment keys; performing a wire bonding process and disposing block bodies corresponding to the second alignment keys, respectively; forming an encapsulant and partially removing the encapsulant and the block bodies from the top of the encapsulant; and aligning through the second alignment keys so as to form on the encapsulant a plurality of metal traces. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce the fabrication costs. Further, since the plate only covers the MEMS elements and the encapsulant is partially removed, the overall thickness and size of the package structure are reduced. | 01-17-2013 |
Shih-Kuang Tsai, Taipei TW
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20150231830 | DEVICE OF COLOR 3D PRINTING AND METHOD THEREOF - A device of color 3D printing and the method thereof are disclosed. The method is adapted to print a color 3D part. The device of color 3D printing at least has a print bed and a print head. The method includes the steps as follows. A solid model of the color 3D part is established, wherein the solid model at least consists of plural points and a color data for each thereof. A temperature/color table for a plastic material is then established. The table consists of plural heating temperatures for transforming the plastic material to specific colors respectively. The coordinates and color data of each point are obtained according to a predetermined sequence. The positions of the print bed and the print head are controlled according to obtained coordinates. The plastic material is heated according to the color data and the temperature/color table and is printed by the print head. | 08-20-2015 |
Shih-Kuang Tsai, New Taipei City TW
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20150312119 | SYSTEM FOR THE NETWORK MONITORING OF 3D PRINTING AND METHOD THEREOF - Monitoring a 3D printer comprises a network information module, a photographic device, a status report module, and a fixed format instruction receiver module. The photographic device is capable of periodically shooting a print status of the 3D printer. The status report module is capable of periodically reporting the print status or instantly reporting a print error of the 3D printer. The fixed format instruction receiver module is capable of receiving a remote fixed format instruction to operate the 3D printer. Thus, the system may not require an operator to monitor the 3D printer for long. Even on the remote end, the system can monitor a print status of a printed object and may execute a corresponding treatment when a print error of the 3D printer has occurred. | 10-29-2015 |