Shen-Li
Shen-Li Fu, Kaohsiung City TW
Patent application number | Description | Published |
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20120266662 | System for Detecting a Liquid Sample - A system is provided for detecting a liquid sample, and includes: a flow cell assembly formed with a sample receiving space therein, and inlet and outlet channels extending to the sample receiving space for guiding the liquid sample into and away from the sample receiving space; a sensor device including a sample detecting unit that is disposed in the sample receiving space, and that is operable to detect the liquid sample and to generate a detection signal accordingly, and a signal conducting unit that is connected electrically to the sensor device for conducting the detection signal therefrom; and a liquid introducing unit and a liquid discharging unit coupled to the inlet and outlet channels and cooperating therewith to form an introducing path and a discharging path for introducing the liquid sample into and for discharging the liquid sample from the sample receiving space, respectively. | 10-25-2012 |
20120267573 | METHOD FOR MAKING FLUORESCENT GOLD NANO-MATERIAL - A method for making a fluorescent gold nano-material having a gold nanocluster and thiol ligands on a surface of the gold nanocluster includes reacting a mixture of a gold-containing compound, an alkyl alcohol, and a thiol compound. | 10-25-2012 |
Shen-Li Hsiao, Hukou Township TW
Patent application number | Description | Published |
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20130313122 | Method For Fabricating Conductive Structures of Substrate - A method for fabricating a conductive structure of a substrate includes the steps of: providing an insulating substrate having opposite first and second surfaces and forming an insulating adhesive film on the second surface of the insulating substrate; forming at least a through hole penetrating the insulating substrate and the insulating adhesive film and forming a conductive foil on the insulating adhesive film so as to cover the through hole; and forming a shielding material on the conductive foil and the second surface of the insulating substrate and performing an electrochemical deposition process through the conductive foil so as to fill the through hole with a conductive material along a direction towards the first surface of the insulating substrate, thereby preventing the formation of voids in the through hole and hence reducing the overall resistance and preventing a blister effect from occurring. | 11-28-2013 |
Shen-Li Hsiao, Hsinchu County 303 TW
Patent application number | Description | Published |
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20140027051 | Method of Fabricating a Light Emitting Diode Packaging Structure - A method of fabricating a light emitting diode packaging structure provides a metallized ceramic heat dissipation substrate and a reflector layer, and a metallized ceramic heat dissipation substrate which is bonded with the reflector layer through an adhesive. The reflector layer has an opening for a surface of the metallized ceramic heat dissipation substrate to be exposed therefrom. The reflector layer may be formed with ceramic or polymer plastic material, to enhance the refractory property and the reliability of the package structure. In addition, the packaging structure may make use of existing packaging machine for subsequent electronic component packaging, without increasing the fabrication cost. | 01-30-2014 |