Sergio A.
Sergio A. Ajuria, Austin, TX US
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20090284881 | PACKAGE LEVEL ESD PROTECTION AND METHOD THEREFOR - A semiconductor package includes an electrostatic discharge rail capable of being coupled to a first conductive contact and a second conductive contact, a first portion of a voltage triggerable material between the electrostatic discharge rail and the first conductive contact; and a second portion of the voltage triggerable material between the electrostatic discharge rail and the second conductive contact. The first and second conductive contacts may be coupled to the same semiconductor device or different semiconductor devices. | 11-19-2009 |
20150061709 | METHOD FOR FORMING A PACKAGED SEMICONDUCTOR DEVICE - A method of fabricating a packaged semiconductor device includes integrating a plurality of singulated semiconductor die in a die carrier, and forming one or more interconnect layers on the die carrier. The interconnect layers include at least one of conductive intra-layer structures and inter-layer structures coupled to contact pads on the plurality of singulated semiconductor die. A set of landing pads is formed coupled to a first subset of the contact pads via a first set of the conductive intra-layer structures and inter-layer structures. A set of probe pads is formed coupled to a second subset of the contact pads via a second set of the conductive intra-layer structures and inter-layer structures. The die carrier is singulated to form a plurality of packaged semiconductor devices. The set of probe pads is removed during the singulating the die carrier. | 03-05-2015 |
20150200146 | Semiconductor Manufacturing Using Disposable Test Circuitry Within Scribe Lanes - Embodiments are disclosed for semiconductor manufacturing using disposable test circuitry formed within scribe lanes. The manufacturing steps can include forming device circuitry within a semiconductor die and forming test circuitry within a scribe lane. One or more electrical connection route lines are also formed that connect the device circuitry and test circuitry blocks. Further, each die can be connected to a single test circuitry block, or multiple dice can share common test circuitry blocks. After testing, the electrical connection route line(s) are sealed, and the test circuitry is discarded when the device dice are singulated. For certain embodiments, the edge of the devices dice are encapsulated with a protective metal layer, and certain other embodiments include protective sealrings through which the connection route lines pass to enter the dice from the test circuitry blocks within the scribe lanes. | 07-16-2015 |
20160064294 | SEMICONDUCTOR MANUFACTURING FOR FORMING BOND PADS AND SEAL RINGS - An integrated circuit die includes a first bond pad having a bond contact area at a first depth into a plurality of build-up layers over a semiconductor substrate of the integrated circuit die, having sidewalls that surround the bond contact area, the sidewalls extending from the first depth to a top surface of the plurality of build-up layers, and having a top portion that extends over a portion of a top surface of the plurality of build-up layers. | 03-03-2016 |
20160064324 | SEMICONDUCTOR PACKAGE WITH EMBEDDED CAPACITOR AND METHODS OF MANUFACTURING SAME - A semiconductor package with an embedded capacitor and corresponding manufacturing methods are described. The semiconductor package with the embedded capacitor includes a semiconductor die having a first metal layer extending across at least a portion of a first side of the semiconductor die and a package structure formed on the first side of the semiconductor die. A first electrical conductor of the embedded capacitor is formed in the first metal layer of the semiconductor die. The package structure includes a second metal layer that has formed therein a second electrical conductor of the embedded capacitor. A dielectric of the embedded capacitor is positioned within either the semiconductor die or the package structure of the semiconductor package to isolate the first electrical conductor from the second electrical conductor of the embedded capacitor. | 03-03-2016 |
Sergio A. Arias-Quintero, Jupiter, FL US
Patent application number | Description | Published |
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20140366547 | GAS TURBINE EFFICIENCY AND REGULATION SPEED IMPROVEMENTS USING SUPPLEMENTARY AIR SYSTEM CONTINUOUS AND STORAGE SYSTEMS AND METHODS OF USING THE SAME - The present invention discloses a novel apparatus and methods for augmenting the power of a gas turbine engine, improving gas turbine engine operation, and reducing the response time necessary to meet changing demands of a power plant. Improvements in power augmentation and engine operation include additional heated compressed air injection, steam injection, water recovery, exhaust tempering, fuel heating, and stored heated air injection. | 12-18-2014 |
Sergio A. Bermudez Rodriguez, Boston, MA US
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20160088807 | TARGETED IRRIGATION USING A CENTRAL PIVOT IRRIGATION SYSTEM WITH A SENSOR NETWORK - A system includes a plurality of optical sensors located along at least one pipe segment of a rotating arm that pivots around an irrigation area of a field, the plurality of optical sensors continuously monitors soil and vegetation conditions and transmits sensed data to a central computer, and a plurality of in-ground sensors scattered in the irrigation area of the field, the plurality of in-ground sensors continuously monitors soil conditions and transmits sensed data to a plurality of gateway devices located in the rotating arm, the plurality of gateway devices transmits data from the plurality of in-ground sensors to the central computer where data from the plurality of optical sensors and the plurality of in-ground sensors is integrated with external data to determine water and fertilizer needs based on which an irrigation schedule is created. | 03-31-2016 |
Sergio A. Gradilone, Rochester, MN US
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20150119413 | TREATMENT OF POLYCYSTIC DISEASES WITH AN HDAC6 INHIBITOR - An HDAC6-specific inhibitor (i.e., a compound of Formula I or II) is shown to reduce the pathogenesis associated with polycystic disease. Administration of an HDAC6-specific inhibitor attenuated many of the symptoms characteristic of polycystic liver disease including cyst formation, cyst growth and cholangiocyte proliferation. Treatment with a HDAC6-specific inhibitor also increased the amount of bile duct acetylated tubulin and β-catenin phosphorylation and/or acetylation while reducing bile duct β-catenin synthesis. These results demonstrate that HDAC6 is overexpressed in cystic cholangiocytes and that its pharmacological inhibition reduces cholangiocyte proliferation and cyst growth. | 04-30-2015 |
Sergio A. Guillen-Castellanos, Calgary CA
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20090203850 | HALOBUTYL ELASTOMERS - The present invention relates to the modification of butyl elastomers, particularly halobutyl elastomers, under solvent free conditions with a phase transfer catalyst in the presence of an alkyl metal salt of an oxygen or sulfur-based nucleophile. | 08-13-2009 |
Sergio A. Maiocchi, Wattlegrove AU
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20110068723 | System For Operating DC Motors And Power Converters - A system is disclosed for driving a DC motor ( | 03-24-2011 |
Sergio A. Pignari, Incisa Scapaccino (at) IT
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20100033165 | MEASURING INDUCED CURRENTS ON A CAN BUS - A device for measuring currents induced in a CAN bus harness. In some embodiments, the device includes a first termination node, a second termination node, a current separator, a detection circuit, and a power source circuit. The current separator circuit has an RF transformer connected to the first termination node and separates a common mode RF current and a differential mode RF current of an RF current signal. The detection circuit is connected to the current separator circuit and receives at least one of the common mode RF current and the differential mode RF current from the separator circuit. The detection circuit also converts the common mode RF current and differential mode RF current to an non-RF output signal. The power source circuit provides power to the detection circuit. | 02-11-2010 |