Segaram
Para Kanagasabai Segaram, Queensland AU
Patent application number | Description | Published |
---|---|---|
20100165562 | MEMORY MODULE - A sub system for a computing device comprising a plurality of chips mounted on a foldable substrate wherein the foldable substrate and the chips are layered by folding the substrate whereby the chips are disposed in at least one stacked configuration and wherein the sub system is adapted to be received on a host board. In addition, removable connections using resilient and nanostructure based members. | 07-01-2010 |
Rara K. Segaram, Brookfield AU
Patent application number | Description | Published |
---|---|---|
20130078826 | TORSIONALLY-INDUCED CONTACT-FORCE CONDUCTORS FOR ELECTRICAL CONNECTOR SYSTEMS - An electrical connector comprising a pair of elongated bodies, each having a facing ramp, the ramp having an notch, each having a rotatable torsion bar conductor with a tip located in the notch, the end of a tip spaced above the ramp such that when the two bodies are mated, the tips engage the ramp of the other connector and rotate against a torsional restoring force, and when fully mated, the two ramps abut each other, notches aligned, with the respective tips of the torsion bars engaging the torsion bar of the other body in the aligned notches. | 03-28-2013 |
Steve Segaram, Westmead, New South Wales AU
Patent application number | Description | Published |
---|---|---|
20150368034 | AN INFUSION PACKAGE AND ASSEMBLY - An infusion package is disclosed comprising a permeable membrane defining an elongate cavity to hold an infusible material; and at least one rigid member extending longitudinally along at least a portion of the cavity such that the rigid member is retained by at least a portion of the permeable membrane. | 12-24-2015 |