Schifferli
Christopher Schifferli, Kenmore, NY US
Patent application number | Description | Published |
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20120073877 | HARDPAN AUGER - Taught is an auger having a working head ( | 03-29-2012 |
Gwendolin Schifferli, Bahrdorf-Saalsdorf DE
Patent application number | Description | Published |
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20130088047 | VEHICLE BODY COMPRISING A LONGITUDINAL MEMBER AND AN ELASTOMER BEARING ARRANGED THEREON, ESPECIALLY AS A TRANSMISSION MOUNTING - The invention relates to a vehicle body comprising at least one longitudinal member ( | 04-11-2013 |
20130214558 | BODY STRUCTURE, IN PARTICULAR FLOOR STRUCTURE, FOR A MOTOR VEHICLE - The invention relates to a car body structure, especially a substructure, for a motor vehicle, with beam components that create defined load paths in collision situations. According to the invention, the beam components situated in the area of at least one defined load path—especially a head-on collision load path and/or a side collision load path and/or a rear-end collision load path—at least partially comprise high-strength beam components, preferably completely through-hardened or at least partially through-hardened high-strength beam components, made out of a hot-worked or press-hardened steel sheet, said beam components being joined to each other directly or indirectly, preferably directly, especially being joined to each other positively or non-positively and/or by bonding. | 08-22-2013 |
Rolf Schifferli, Zofingen CH
Patent application number | Description | Published |
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20150123262 | POWER SEMICONDUCTOR CLAMPING STACK - An exemplary power semiconductor clamping stack includes a plurality of power semiconductor components that are arranged in a row along the stacking direction, and a first and second end plate. The row of power semiconductor components is arranged between the first and second end plate and a clamping force is applied to the first and second end plate in order to tension the row of power semiconductor components between the first and second end plate. A clamping force measuring device is arranged between the first end plate and the row of power semiconductor components in order to adjust the clamping force. | 05-07-2015 |