Patent application number | Description | Published |
20090142865 | LIQUID CRYSTAL DISPLAY - A liquid crystal display using a ferroelectric liquid crystal, which can give mono-domain alignment of the ferroelectric liquid crystal without forming alignment defects such as zigzag defects, hairpin defects and double domains and which is so remarkably good in alignment stability that the alignment thereof can be maintained even if the temperature of the liquid crystal is raised to the phase transition point or higher. The liquid crystal display has a ferroelectric liquid crystal sandwiched between two substrates, wherein an electrode and a photo alignment layer are each successively formed on opposite faces of the two substrates facing each other, and a constituent material of the respective photo alignment layer has a different composition with the ferroelectric liquid crystal sandwiched there between. | 06-04-2009 |
20100007832 | LIQUID CRYSTAL DISPLAY - A liquid crystal display, using a ferroelectric liquid crystal exhibiting mono-stability, which makes it possible to control the direction of the spontaneous polarization of the ferroelectric liquid crystal. The liquid crystal display is produced by holding a ferroelectric liquid crystal between: an oblique vapor deposition-alignment layer of a first alignment treatment substrate, in which a first electrode layer and the oblique vapor deposition-alignment layer are formed in this order on a first substrate; and a fixed liquid crystal layer of a second alignment treatment substrate, in which a second electrode layer, an alignment layer for reactive liquid crystal and the fixed liquid crystal layer are laminated in this order on the second substrate. | 01-14-2010 |
20100053525 | LIQUID CRYSTAL DISPLAY - A liquid crystal display, using a ferroelectric liquid crystal exhibiting mono-stability, which makes it possible to control the direction of the spontaneous polarization of the ferroelectric liquid crystal. The liquid crystal display includes: a first alignment treatment substrate having a first alignment layer which is a rubbed layer; a second alignment treatment substrate having a second alignment layer which is a photo alignment layer using a photo-dimerization type material; and a liquid crystal layer containing a ferroelectric liquid crystal and held between the first alignment treatment substrate and the second alignment treatment substrate. The ferroelectric liquid crystal exhibits mono-stability, and when a negative voltage is applied to a second electrode layer of the second alignment treatment substrate, a molecular direction of the ferroelectric liquid crystal is changed by about 2 times a tilt angle of the ferroelectric liquid crystal parallel to a surface of the substrate. | 03-04-2010 |
20100060844 | PROCESS FOR PRODUCING LIQUID CRYSTAL DISPLAY - A process for producing a liquid crystal display having less alignment defects, which seldom causes aligning disorder at the boundary where ferroelectric liquid crystals allowed to flow are brought into contact with each other when the ferroelectric liquid crystals are coated on the substrate flow. The process includes a first alignment layer formation step and a liquid crystal coating step. The liquid crystal coating step is a step of linearly coating the ferroelectric liquid crystals on a first alignment layer of a liquid crystal side substrate in a direction substantially perpendicular or substantially parallel to the alignment treatment direction conducted in the first alignment layer formation step. | 03-11-2010 |
Patent application number | Description | Published |
20140048321 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - Provided is a substrate with a built-in electronic component that can minimize an occurrence of a deformation such as warping or distortion of the substrate with a built-in electronic component, which is caused by a difference in rigidity between a region of low rigidity and a region of high rigidity that are formed in a core layer thereof. In the substrate with a built-in electronic component, electronic components | 02-20-2014 |
20140049928 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - Provided is a substrate with a built-in electronic component that can avoid as much as possible the occurrence of malfunctions in the electronic component due to moisture entering, even when an electronic component, provided with a structure in which a terminal pad is present where a hole in the sealing part provided on the main body of a component is located, is built into the substrate. A SAW filter | 02-20-2014 |
20140126157 | ELECTRONIC CIRCUIT MODULE AND METHOD FOR PRODUCING THE SAME - An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface. | 05-08-2014 |
20140126160 | ELECTRONIC CIRCUIT MODULE - There is provided an electronic circuit module that prevents a bonding force between ground wiring and a shield from decreasing and maintains successfully a desirable shield effect. The electronic circuit module includes a core layer also functioning as the ground wiring, each face OS of each first protrusion of the core layer facing to an end face of a shield is adjacent to faces OS of an outer cover made of an insulating synthetic resin facing to the end face of the shield, and the end face of the shield is bonded to both of the each face OS of each first protrusion facing to the end face of the shield and the faces OS of the outer cover facing to the end face of the shield. | 05-08-2014 |
20140133120 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively. | 05-15-2014 |
20140252522 | CAMERA MODULE - In a camera module, a planar part, which is for mitigating deformation of the surface of a second insulating portion on which an imaging device is mounted, is embedded in the second insulating portion of a substrate so as to face the imaging device mounted on the surface (top surface) of the second insulating portion. | 09-11-2014 |
20140253794 | CAMERA MODULE - A camera module, in which a recessed portion that has a greater depth than the thickness of an imaging device is disposed on the surface (top surface) of an embedded-component substrate. An imaging device is bonded to a bottom of the recessed portion such that an opening is present between the surface (top surface) of the imaging device and the surface (top surface) of the embedded-component substrate. Connection pads on the imaging device are connected to conductor pads disposed on the surface (top surface) of the embedded-component substrate by bonding wires that go through the opening. | 09-11-2014 |
20140285988 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other. | 09-25-2014 |
20140307402 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface. | 10-16-2014 |
20140355232 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other. | 12-04-2014 |
20150049439 | CIRCUIT MODULE - A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield. | 02-19-2015 |
20150068795 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND CORE BASE-MATERIAL FOR SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - A substrate with built-in electronic component includes an electronic component, a first wiring layer, a second wiring layer, a via, and a core base-material. The first wiring layer has a first wiring portion. The second wiring layer has a second wiring portion. The via is configured to electrically connect the first wiring portion and the second wiring portion. The core base-material has a metal layer, at least one first storage portion, and a second storage portion, the metal layer being disposed between the first wiring layer and the second wiring layer, the at least one first storage portion being formed in the metal layer, the at least one first storage portion storing the electronic component, the second storage portion being formed on an outside of the first storage portion integrally with the first storage portion, the second storage portion storing the via. | 03-12-2015 |
20150070862 | SUBSTRATE WITH BUILT-IN COMPONENT - There is provided a substrate with built-in component, including a metal core layer having a cavity for storing a component; a wiring layer that is laminated on the core layer and has a plurality of vias for an interlayer connection, the vias being formed at regions opposing to the cavity; and an electronic component including a plurality of terminals electrically connected to the plurality of vias, and a component body that is stored in the cavity and has a support surface for supporting the plurality of terminals, the plurality of terminals being disposed eccentrically from a center of the support surface to a first direction, and the component body being disposed eccentrically from a center of the cavity to a second direction opposite to the first direction. | 03-12-2015 |
20150098203 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively. | 04-09-2015 |