Patent application number | Description | Published |
20090080156 | Cooling Arrangement to Cool Components on Circuit Board - A circuit board including a blower thereon to cool a heat generating arrangement. The circuit board includes a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; and a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement. | 03-26-2009 |
20090096087 | MICROELECTRONIC ASSEMBLY AND METHOD OF PREPARING SAME - A microelectronic assembly includes a die ( | 04-16-2009 |
20110077794 | Sensor-Based Thermal Specification Enabling a Real-Time Metric for Compliance - An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison. | 03-31-2011 |
20120166015 | POWER AND THERMAL OPTIMIZATION OF PROCESSOR AND COOLING - In some embodiments a processor is adapted to store a relationship of power as a function of temperature and voltage, wherein the stored relationship data is to be used for managing power in a system including the processor. Other embodiments are described and claimed. | 06-28-2012 |
20130060399 | SENSOR-BASED THERMAL SPECIFICATION ENABLING A REAL-TIME METRIC FOR COMPLIANCE - An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison. | 03-07-2013 |
20130329358 | TRANSIENT THERMAL MANAGEMENT SYSTEMS FOR SEMICONDUCTOR DEVICES - Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units. The switching between cooling systems allows the semiconductor device(s) to be maintained at a lower operating temperature than if switching between cooling subsystems were not employed. | 12-12-2013 |
20140002989 | INTEGRATED HEAT SPREADER THAT MAXIMIZES HEAT TRANSFER FROM A MULTI-CHIP PACKAGE | 01-02-2014 |
20140123287 | SECURING THERMAL MANAGEMENT PARAMETERS IN FIRMWARE FROM CYBER ATTACK - Methods and systems may provide for identifying a thermal management setting in a computing system, and comparing the thermal management setting to valid configuration information. In addition, the thermal management setting may be modified if it does not comply with the valid configuration information, wherein the modification can cause the thermal management setting to comply with the valid configuration information. Additionally, a threat risk notification can be initiated in order to notify users of the non-compliance. | 05-01-2014 |
20140188434 | MAINTENANCE PREDICTION OF ELECTRONIC DEVICES USING PERIODIC THERMAL EVALUATION - A method for determining whether to perform maintenance for an electronic device includes generating a baseline characterization of thermal performance for a heat-generating component of the electronic device at a baseline date. The method also includes generating an assessment characterization of the thermal performance at an assessment date after the baseline date. The method further includes generating a historical trend that includes the baseline characterization and the assessment characterization. Additionally, the method includes determining whether to perform maintenance for the heat-generating component based on the historical trend and a specified maintenance parameter. | 07-03-2014 |
20140281445 | PROCESSOR HAVING FREQUENCY OF OPERATION INFORMATION FOR GUARANTEED OPERATION UNDER HIGH TEMPERATURE EVENTS - A processor is described having a semiconductor chip having non volatile storage circuitry. The non volatile storage circuitry has information identifying a maximum operational frequency of the processor at which the processor's operation is guaranteed for an ambient temperature that corresponds to an extreme thermal event. | 09-18-2014 |