Patent application number | Description | Published |
20090079122 | DEVICE FOR FLUID TREATING PLATE-LIKE ARTICLES - A device for fluid treatment of a plate-like article includes a rotary head for holding and rotating a plate-like article around a substantially vertical rotation axis | 03-26-2009 |
20100147336 | APPARATUS AND METHOD FOR ULTRASONIC WET TREATMENT OF PLATE-LIKE ARTICLES - Disclosed is a method and a respective apparatus for ultrasonic wet treatment of a plate-like article, which comprises: bringing a solid element, which is connected to a transducer in close proximity to a surface of a plate-like article so that a gap is formed between the solid element and the plate-like article, the gap having a distance d | 06-17-2010 |
20110250044 | DEVICE FOR TREATING DISC-LIKE ARTICLE AND METHOD FOR OPERATING SAME - A device for supporting and rotating a disc-like article includes:
| 10-13-2011 |
20110253181 | DEVICE FOR TREATING DISC-LIKE ARTICLES - A device for treating a disc-like article with a fluid, includes elements for dispensing a fluid onto the article and a chuck for holding and rotating the article around an axis perpendicular thereto. The chuck includes a base body, a drive ring, and gripping members for contacting the article at its edge. The gripping members are eccentrically movable with respect to the center of the article. The eccentric movement of the gripping members is driven by a drive ring rotatably mounted to the base body, so that the drive ring is rotatable against the base body around the axis. The relative rotational movement of the drive ring against the base body is carried out by either holding the base body and rotating the drive ring or by holding the drive ring and rotating the base body, whereby the to-be-held-part (drive ring or base body) is held without touching the respective to-be-held-part by magnetic force. | 10-20-2011 |
20110290283 | CLOSED CHAMBER WITH FLUID SEPARATION FEATURE - Selective recovery of excess process fluid from within a closed process chamber is achieved by providing a magnetically drive ring chuck and at least one process fluid collector within the closed process chamber, with the ring chuck and the fluid collector being vertically movable relative to each other. | 12-01-2011 |
20110304107 | DEVICE FOR TREATING DISC-LIKE ARTICLES - A device for treating a disc-like article with a fluid, includes elements for dispensing a fluid onto the article and a chuck for holding and rotating the article around an axis perpendicular thereto. The chuck includes a base body, a drive ring, and gripping members for contacting the article at its edge. The gripping members are eccentrically movable with respect to the center of the article. The eccentric movement of the gripping members is driven by a drive ring rotatably mounted to the base body, so that the drive ring is rotatable against the base body around the axis. The relative rotational movement of the drive ring against the base body is carried out by either holding the base body and rotating the drive ring or by holding the drive ring and rotating the base body, whereby the to-be-held-part (drive ring or base body) is held without touching the respective to-be-held-part by magnetic force. | 12-15-2011 |
20120018940 | DEVICE FOR HOLDING WAFER SHAPED ARTICLES - A device for holding wafer-shaped articles, such as semiconductor wafers, is equipped with a series of pins that are brought into contact with a peripheral edge of the wafer-shaped article, under control of a common gear ring or a series of conjointly operated gear sectors. In the regions of the gear ring or gear sectors engaging the pin assemblies, those elements are designed to yield more readily than other regions of the gear ring or gear sectors, to accommodate differential thermal expansion of the chuck components in the vicinity of the pin assemblies. | 01-26-2012 |
20120138097 | METHOD AND APPARATUS FOR SURFACE TREATMENT USING INORGANIC ACID AND OZONE - Improved removal of ion-implanted photoresist in a single wafer front-end wet processing station is achieved by dissolving gaseous ozone into relatively cool inorganic acid, dispensing the acid ozone mixture onto a wafer, and rapidly heating the surface of the wafer to a temperature at least 30° C. higher than the temperature of the acid ozone mixture. | 06-07-2012 |
20120167914 | DEVICE AND METHOD FOR WET TREATING DISC-LIKE SUBSTRATES - A method for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate. | 07-05-2012 |
20130062839 | APPARATUS FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES - A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber. | 03-14-2013 |
20130101372 | METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES - A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber has a side wall, a holder located within the closed process chamber adapted to receive a wafer shaped article, and a door for loading and unloading a wafer shaped article into and from the closed process chamber. The door in a first position blocks an opening in the side wall of the chamber and seals against an interior surface of the side wall of the chamber. The door is connected to an exterior of the chamber via a linkage that guides the door in a nonlinear translational movement between the first position and a second position in which the door is positioned interiorly of the chamber so as to permit loading and unloading of a wafer shaped article through the opening. | 04-25-2013 |
20130154203 | DEVICE FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES AND GRIPPING PIN FOR USE IN THE DEVICE - A device for processing wafer-shaped articles comprises a rotary chuck having a series of pins adapted to hold a wafer shaped article on the rotary chuck. Each of the pins comprises a cylindrical body and a projecting gripping portion formed integrally therewith. The cylindrical body and gripping portion are made from a ceramic material. The gripping portion comprises cylindrical surfaces having a common generatrix with surfaces of the cylindrical body. | 06-20-2013 |
20140209129 | METHOD AND APPARATUS FOR SURFACE TREATMENT USING INORGANIC ACID AND OZONE - Improved removal of ion-implanted photoresist in a single wafer front-end wet processing station is achieved by dissolving gaseous ozone into relatively cool inorganic acid, dispensing the acid ozone mixture onto a wafer, and rapidly heating the surface of the wafer to a temperature at least 30° C. higher than the temperature of the acid ozone mixture. | 07-31-2014 |