Patent application number | Description | Published |
20080258837 | BALUN SIGNAL TRANSFORMER | 10-23-2008 |
20090195324 | BALUN TRANSFORMER WITH IMPROVED HARMONIC SUPPRESSION - An electronic assembly includes a substrate ( | 08-06-2009 |
20100026411 | BALUN SIGNAL TRANSFORMER AND METHOD OF FORMING - A balanced-unbalanced (balun) signal transformer includes an unbalanced port, a balanced port coupled to the unbalanced port, the balanced port comprising a first terminal and a second terminal, a first capacitor coupled to the first terminal, a first inductor coupled to ground and the first capacitor, a second capacitor coupled to the second terminal, and a second inductor coupled to ground and the second capacitor. The transformer may also include a third capacitor coupled to a terminal of the unbalanced port; and a third inductor coupled to the third capacitor and the third terminal. | 02-04-2010 |
20130005109 | METHOD FOR FORMING A TOROIDAL INDUCTOR IN A SEMICONDUCTOR SUBSTRATE - A toroidal inductor formed in a semiconductor substrate. Through-silicon vias are used to connect metal layers formed on top and bottom surfaces of the semiconductor substrate. In one embodiment, the vias are elongated and laid out in two concentric circles, an inner circle enclosed by an outer circle. The vias of the outer concentric circle are longer than the vias of the inner circle so that spaces between vias are the same for both circles. In another embodiment, each elongated via may include a plurality of circular vias formed in a line. Metals layers on the top and bottom of the semiconductor substrate are patterned to form wedge shaped connectors between the inner and outer vias to form the spirals of the toroidal inductor. The wedge shaped connectors with elongated vias allow spacing between spirals to be constant. | 01-03-2013 |
20130171950 | PLANAR INVERTED-F ANTENNAS, AND MODULES AND SYSTEMS IN WHICH THEY ARE INCORPORATED - An embodiment of an antenna includes a radiation frame and a planar inverted-F antenna (PIFA). The radiation frame has a frame shape that defines a central opening. The PIFA includes an antenna arm, a feed arm, and a shorting arm. A distal end of the shorting arm is conductively coupled with the radiation frame. The antenna may be coupled to a substrate of an RF module. The RF module may be included in a system that also includes a non-RF component that produces a signal for transmission. In such a system, the RF module is configured to receive the signal, convert the signal to an RF signal, and radiate the RF signal over an air interface. | 07-04-2013 |
20130171951 | EXTENDABLE-ARM ANTENNAS, AND MODULES AND SYSTEMS IN WHICH THEY ARE INCORPORATED - Embodiments of antennas and radio frequency (RF) modules include a substrate, a first antenna arm coupled to the substrate, and a first conductive structure between a distal end of the first antenna arm and a bottom surface of the substrate. An embodiment of a system includes a first substrate, a first conductive structure on a top surface of the first substrate, and an antenna coupled to the top surface of the first substrate. The antenna includes a second substrate, a first antenna arm coupled to the second substrate, and a second conductive structure having a proximal end and a distal end. The proximal end of the second conductive structure is coupled to a distal end of the first antenna arm, and the distal end of the second conductive structure extends to a bottom surface of the second substrate and is coupled to the first conductive structure on the first substrate. | 07-04-2013 |
20140312457 | INTEGRATED CIRCUIT CHIP WITH DISCONTINUOUS GUARD RING - An electronic apparatus includes a semiconductor substrate, a circuit block disposed in and supported by the semiconductor substrate and comprising an inductor, and a discontinuous noise isolation guard ring surrounding the circuit block. The discontinuous noise isolation guard ring includes a metal ring supported by the semiconductor substrate and a ring-shaped region disposed in the semiconductor substrate, having a dopant concentration level, and electrically coupled to the metal ring, to inhibit noise in the semiconductor substrate from reaching the circuit. The metal ring has a first gap and the ring-shaped region has a second gap. | 10-23-2014 |
20150280785 | SYSTEMS AND DEVICES WITH COMMON MODE NOISE SUPPRESSION STRUCTURES AND METHODS - An embodiment of a transformer-based system or galvanic isolation device includes a first coil, a second coil aligned with the first coil across a gap, and a first capacitor coupled between the first coil and a first voltage reference. A first electrode of the first capacitor may be formed from a conductive electrode structure that is electrically isolated from the first coil, and a second electrode of the first capacitor may be formed from at least a portion of the first coil. The system or device also may include a second capacitor coupled between the second coil and a second voltage reference. The first and second coils may form portions of first and second IC die, respectively, and the system or device may also include one or more dielectric components within the gap between the IC die, where the dielectric component(s) are positioned directly between the first and second coils. | 10-01-2015 |