Patent application number | Description | Published |
20140104417 | SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE - Disclosed herein are a system of measuring a warpage and a method of measuring a warpage. The system of measuring a warpage of a sample by analyzing an image photographed by the camera using light that is diffused from a light source and reflected on a surface of a sample and is arrived at the camera through a reference grating part, the system includes: an intake part that removes a fume generated from the sample. By this configuration, it is possible to measure the warpage while effectively removing the fume generated from the sample according to the increase in the temperature of the sample at the time of measuring the warpage, thereby improving the accuracy of the warpage measurement. | 04-17-2014 |
20140145323 | LAMINATION LAYER TYPE SEMICONDUCTOR PACKAGE - Disclosed herein is a lamination layer type semiconductor package, and more particularly, a lamination layer type semiconductor package capable of maintaining a thickness of a package on package structure at a minimum and minimizing a warpage defect by mounting two chips so as to correspond to each other. The lamination layer type semiconductor package includes: an upper package having an upper flip chip mounted on an upper substrate; a lower package having a lower flip chip mounted on a lower substrate and disposed so as to closely adhere the upper flip chip and the lower flip chip to each other; a heat dissipation adhesive member adhesively fixing the upper flip chip and the lower flip chip and dissipating heat generated from the upper flip chip and the lower flip chip; and a molding member molding between the upper substrate and the lower substrate. | 05-29-2014 |
20140184782 | SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE - Disclosed herein are a system for measuring a warpage and a method for measuring a warpage. The system for measuring a warpage includes: a heating plate portion heating the sample; and a reference gating portion disposed between the sample and the camera so as to be spaced apart from the sample by a predetermined distance, wherein the reference grating portion includes a plurality of wires that are each spaced apart from each other by a predetermined interval, thereby accurately measuring the warpage without being affected by the fume generated from the sample. | 07-03-2014 |
20150015954 | CAMERA MODULE - There is provided a camera module including: a lens barrel having a lens; and a housing having the lens barrel inserted thereinto, wherein an outer surface of the lens barrel facing an inner surface of the housing is provided with a first groove formed inwardly concave, and the inner surface of the housing is provided with a first foreign object collecting portion formed with a step difference and a second foreign object collecting portion formed with a step difference from the first foreign object collecting portion. | 01-15-2015 |
20150103240 | CAMERA MODULE, METHOD FOR ALIGNING OPTICAL AXIS OF CAMERA MODULE AND PORTABLE ELECTRONIC DEVICE INCLUDING CAMERA MODULE - A camera module may include a lens barrel supporting a lens, a frame in which the lens barrel is provided, and a housing accommodating the frame. The frame may be pressed toward one surface of the housing to thereby be relatively aligned in the housing so that an optical axis of the lens is positioned perpendicularly with respect to an image formation surface of an image sensor. | 04-16-2015 |
20150163386 | CAMERA MODULE - There is provided a camera module including: a housing having a lens barrel disposed therein; an infrared filter attached to an inner surface of the housing and disposed below the lens barrel; and a board coupled to a lower portion of the housing and having an image sensor mounted thereon, wherein the board has a plurality of terminals formed thereon, the image sensor has a plurality of bonding pads formed therein, and the plurality of bonding pads are electrically connected to the plurality of terminals by bonding wires, respectively, and the plurality of bonding pads have a coating material applied thereto in order to absorb external light incident thereto. | 06-11-2015 |
20150346453 | CAMERA MODULE AND DRIVING CONTROL SYSTEM FOR CAMERA MODULE - A camera module includes a lens barrel, a housing accommodating the lens barrel therein, a ball bearing contacting rolling surfaces, which are respectively provided on the lens barrel and the housing, and a semi-wet lubricant applied to a surface of the ball bearing. | 12-03-2015 |
20160142595 | CAMERA MODULE - A camera module includes a housing having a guide groove formed therein, the guide groove being extended lengthwise in an optical axis direction, a lens barrel mounted in the housing and having a guide protrusion inserted into the guide groove, and an elastic member disposed on the guide groove so that the guide protrusion may be prevented from being separated from the guide groove. | 05-19-2016 |