Piers
Piers De Havilland, Golasecca IT
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20110002830 | SELECTIVE CATALYTIC REDUCTION OF NOx ENABLED BY SIDESTREAM UREA DECOMPOSITION - A preferred apparatus arrangement utilizes the enthalpy of the flue gas, which can be supplemented if need be, to convert urea ( | 01-06-2011 |
Piers Element, Lantau Island HK
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20150324872 | Matching Data From Various Channels - Systems, methods and apparatuses for receiving payment information via a first channel and receiving additional information via a second channel are provided. In some examples, a determination may be made as to whether the received payment information matches the received additional information. If so, the payment and additional information may be associated and used to identify an associated outstanding invoice. If not, a determination may be made as to whether a potential match exists. If so, additional processing may occur to determine whether the potential match is an actual match. | 11-12-2015 |
Piers Glydon, Bristol GB
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20110189949 | REPEATER SYSTEM - The present invention provides a repeater system, comprising: first transceiver circuitry, for establishing communications with a base station of a cellular communications system; second transceiver circuitry, for establishing communications with a wireless device; and a single antenna system, comprising a plurality of antenna elements. Signals to and from the first transceiver circuitry and the second transceiver circuitry can each be received and transmitted through the single antenna system. The single antenna system includes beam definition circuitry, in which amplitudes of signals between the first transceiver circuitry and each antenna element, and between the second transceiver circuitry and each antenna element, can be adjusted independently, such that different beam patterns can be provided for the first transceiver circuitry and the second transceiver circuitry. | 08-04-2011 |
Piers Tremlett, Coleford GB
Patent application number | Description | Published |
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20120292781 | INTEGRATED CIRCUIT PACKAGE - An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive back side. Conductive vias extend through the integrated circuit between the front and back sides. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive vias and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side. | 11-22-2012 |
20140070421 | INTEGRATED CIRCUIT PACKAGE - An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive backside. Conductive pathways extend between the front and back sides of the integrated circuit. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive pathways and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side. | 03-13-2014 |