Patent application number | Description | Published |
20130044898 | Sensitivity Adjustment Apparatus And Method For MEMS Devices - A microelectromechanical (MEMS) microphone includes a MEMS motor and a gain adjustment apparatus. The MEMS motor includes at least a diaphragm and a charge plate and is configured to receive sound energy and transform the sound energy into an electrical signal. The gain adjustment apparatus has an input and an output and is coupled to the MEMS motor. The gain adjustment apparatus is configured to receive the electrical signal from the MEMS motor at the input and adjust the gain of the electrical signal as measured from the output of the gain adjustment apparatus. The amount of gain is selected so as to obtain a favorable sensitivity for the microphone. | 02-21-2013 |
20130343580 | Back Plate Apparatus with Multiple Layers Having Non-Uniform Openings - An acoustic microphone includes a back plate, a diaphragm, and a microelectromechanical system (MEMS) structure that is coupled to the back plate and the diaphragm. The MEMS structure is disposed on a substrate. The back plate includes a first layer and a second layer that are disposed in generally parallel relation to each other. The first layer including a first opening with a first sizing and the second layer including a second opening with a second sizing. The first sizing is different from the second sizing. The first opening and the second opening form a channel through the back plate. | 12-26-2013 |
20140044297 | Microphone Assembly With Barrier To Prevent Contaminant Infiltration - A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening. | 02-13-2014 |
20140064546 | MICROPHONE ASSEMBLY - A microphone assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, an acoustic transducer acoustically sealed to the lid, and an interposer. The interposer and the acoustic transducer are electrically connected without using the lid as an electrical conduit. The transducer and interposer are disposed one above the other and the transducer is supported by the interposer or by a pedestal. | 03-06-2014 |
20150237448 | Integrated CMOS/MEMS Microphone Die - The claim invention is directed at a MEMS microphone die fabricated using CMOS-based technologies. In particular, the claims are directed at various aspects of a MEMS microphone die having anisotropic springs, a backplate, a diaphragm, mechanical stops, and a support structure, all of which are fabricated as stacked metallic layers separated by vias using CMOS fabrication technologies. | 08-20-2015 |
20150304753 | Microphone Assembly With Barrier To Prevent Contaminant Infiltration - A micro-electro-mechanical system (MEMS) microphone includes a rectangular substrate with a rigid base layer, a first metal layer, a second metal layer, one or more electrical pathways, an acoustic port, and a patterned flexible printed circuit board material. The MEMS microphone also includes a MEMS microphone die and a solid single-piece rectangular cover. | 10-22-2015 |
20150307349 | MEMS FABRICATION TOOL AND METHOD FOR USING - A tool includes a collet, a vacuum path, and a top die. The collet has a first end and a second end. The second end is configured so as to be coupled to an air suction device. The vacuum path is formed inside and along a length of the collet and extends from the first end to the second end of the collet. The top die is coupled to the first end of the collet. The top die includes a plurality of raised islands, and each of the plurality of raised islands including a hole. The hole communicates with the vacuum path such that a suction applied by the suction device draws air through the hole and then through the vacuum path and is sufficient to pick up a MEMS component disposed in proximity to the hole. | 10-29-2015 |
20160060101 | Integrated CMOS/MEMS Microphone Die Components - The claim invention is directed at a MEMS microphone die fabricated using CMOS-based technologies. In particular, the claims are directed at various aspects of a diaphragm for a MEMS microphone die which is fabricated as stacked metallic layers separated by vias using CMOS fabrication technologies. | 03-03-2016 |