Patent application number | Description | Published |
20100028809 | DOUBLE PATTERNING FOR LITHOGRAPHY TO INCREASE FEATURE SPATIAL DENSITY - A method of forming a pattern in at least one device layer in or on a substrate comprises: coating the device layer with a first photoresist layer; exposing the first photoresist using a first mask; developing the first photoresist layer to form a first pattern on the substrate; coating the substrate with a protection layer; treating the protection layer to cause a change therein where it is in contact with the first photoresist, to render the changed protection layer substantially immune to a subsequent exposure and/or developing step; coating the substrate with a second photoresist layer; exposing the second photoresist layer using a second mask; and developing the second photoresist layer to form a second pattern on the substrate without significantly affecting the first pattern in the first photoresist layer, wherein the first and second patterns together define interspersed features having a spartial frequency greater than that of the features defined in each of the first and second patterns separately. The process has particular utility in defining source, drain and fin features of finFET devices with a smaller feature size than otherwise achievable with the prevailing lithography tools. | 02-04-2010 |
20100207485 | PRODUCTION OF PRE-COLLAPSED CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS AND APPLICATIONS THEREOF - Methods are provided for production of pre-collapsed capacitive micro-machined ultrasonic transducers (cMUTs). Methods disclosed generally include the steps of obtaining a nearly completed traditional cMUT structure prior to etching and sealing the membrane, defining holes through the membrane of the cMUT structure for each electrode ring fixed relative to the top face of the membrane, applying a bias voltage across the membrane and substrate of the cMUT structure so as to collapse the areas of the membrane proximate to the holes to or toward the substrate, fixing and sealing the collapsed areas of the membrane to the substrate by applying an encasing layer, and discontinuing or reducing the bias voltage. CMUT assemblies are provided, including packaged assemblies, integrated assemblies with an integrated circuit/chip (e.g., a beam-steering chip) and a cMUT/lens assembly. Advantageous cMUT-based applications utilizing the disclosed pre-collapsed cMUTs are also provided, e.g., ultrasound transducer-based applications, catheter-based applications, needle-based applications and flowmeter applications. | 08-19-2010 |
20110003614 | PROXIMITY SENSOR, IN PARTICULAR MICROPHONE FOR RECEPTION OF SOUND SIGNALS IN THE HUMAN AUDIBLE SOUND RANGE, WITH ULTRASONIC PROXIMITY ESTIMATION - Proximity sensor, particularly for usage in an electronic mobile device, comprising at least one acoustic transducer adapted for receiving acoustic signals at least in parts of the frequency range of human audible sound and emitting and/or receiving ultrasonic signals for proximity estimation. The acoustic transducer preferably is a Micro-Electro-Mechanical-Systems (MEMS) microphone. Further, a method in an electronic device comprising an acoustic transducer is provided comprising the steps of generating at least one electric signal in the frequency range of ultrasonic sound, emitting at least one ultrasonic signal by means of the acoustic transducer; receiving at least one ultrasonic signal by means of the acoustic transducer; deducing from the at least one emitted ultrasonic signal and the at least one received ultrasonic signal at least the delay between emission of the emitted ultrasonic signal and reception of the corresponding ultrasonic signal. | 01-06-2011 |
20110156863 | ULTRASONIC TRANSMISSION / RECEPTION FOR ELECTROMAGNETIC TRANSMISSION RECEPTION - First apparatuses ( | 06-30-2011 |
20110163630 | CAPACITIVE MICROMACHINE ULTRASOUND TRANSDUCER - The patent application discloses a capacitive micromachined ultrasound transducer, comprising a silicon substrate; a cavity; a first electrode, which is arranged between the silicon substrate and the cavity; wherein the first electrode is arranged under the cavity; a membrane, wherein the membrane is arranged above the cavity and opposite to the first electrode; a second electrode, wherein the second electrode is arranged above the cavity and opposite to the first electrode; wherein the second electrode is arranged in or close to the membrane, wherein the first electrode and the second electrode are adapted to be supplied by a voltage; and a first isolation layer, which is arranged between the first electrode and the second electrode, wherein the first isolation layer comprises a dielectric. It is also described a system for generating or detecting ultrasound waves, wherein the system comprises a transducer according to the patent application. Further, it is disclosed a method for manufacturing a transducer according to the patent application, wherein the transducer is manufactured with the help of a CMOS manufacturing process, wherein the transducer can be manufactured as a post-processing feature during a CMOS process. | 07-07-2011 |
20110314897 | GAS SENSING USING ULTRASOUND - A sensor chip ( | 12-29-2011 |
20120010538 | PRE-COLLAPSED CMUT WITH MECHANICAL COLLAPSE RETENTION - A CMUT transducer cell suitable for use in an ultrasonic CMUT transducer array has a membrane with a first electrode, a substrate with a second electrode, and a cavity between the membrane and the substrate. The CMUT is operated in a precollapsed state by biasing the membrane to a collapsed condition with the floor of the cavity, and a lens is cast over the collapsed membrane. When the lens material has polymerized or is of a sufficient stiffness, the bias voltage is removed and the lens material retains the membrane in the collapsed state. | 01-12-2012 |
20120039522 | MASK INSPECTION APPARATUS AND METHOD - Apparatus for optical inspection of an object, comprising: an optical imaging system ( | 02-16-2012 |
20120109536 | MULTIFUNCTION SENSOR SYSTEM AND METHOD FOR SUPERVISING ROOM CONDITIONS - The invention refers to a multifunction sensor system and a corresponding method for supervising room conditions, comprising a temperature sensor, a humidity sensor, an ultrasonic transducer for emitting ultrasonic waves and being positioned in a fixed distance to a reflecting fixed reflective surface. For calculating the CO | 05-03-2012 |
20130082182 | BOLOMETER AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a bolometer (10) comprising a substrate (12), a first membrane (16) formed by removing a first sacrificial layer (14) on the substrate (12), the first membrane (16) comprising a measuring element (18) for measuring an amount of incident electromagnetic radiation (R), a second membrane (22) formed by removing a second sacrificial layer (20) on the first membrane (16), the second membrane (22) enclosing the first membrane (16), a first cavity (24) formed between the substrate (12) and the first membrane (16), and a second cavity (26) formed between the first membrane (16) and the second membrane (22). The present invention further relates to a method of manufacturing a bolometer, as well as a thermographic image sensor and medical device. | 04-04-2013 |
20130208572 | THIN FILM ULTRASOUND TRANSDUCER - The present invention relates to a transducer ( | 08-15-2013 |
20140005521 | CATHETER COMPRISING CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS WITH AN ADJUSTABLE FOCUS | 01-02-2014 |
20140247698 | PRE-COLLAPSED CAPACITIVE MICRO-MACHINED TRANSDUCER CELL WITH PLUG - The present invention relates to a pre-collapsed capacitive micro-machined transducer cell ( | 09-04-2014 |
20140251014 | PRE-COLLAPSED CAPACITIVE MICRO-MACHINED TRANSDUCER CELL WITH STRESS LAYER - The present invention relates to a pre-collapsed capacitive micro-machined transducer cell ( | 09-11-2014 |
20140332911 | CAPACITIVE MICRO-MACHINED TRANSDUCER AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a method of manufacturing a capacitive micro- machined transducer ( | 11-13-2014 |
20140375168 | CAPACITIVE MICRO-MACHINED TRANSDUCER AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a method of manufacturing a capacitive micro-machined transducer ( | 12-25-2014 |