Patent application number | Description | Published |
20080245847 | Compliant Mold Fill Head with Integrated Cavity Venting and Solder Cooling - A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate. | 10-09-2008 |
20080251281 | ELECTRICAL INTERCONNECT STRUCTURE AND METHOD - An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad. | 10-16-2008 |
20080272177 | CONDUCTIVE BONDING MATERIAL FILL TECHNIQUES - A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity. | 11-06-2008 |
20080285136 | INJECTION MOLDED MICROOPTICS - A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught. | 11-20-2008 |
20080302502 | FILL HEAD FOR INJECTION MOLDING OF SOLDER - A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head. | 12-11-2008 |
20080315409 | DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS - The present invention allows for direct chip-to-chip connections using the shortest possible signal path. | 12-25-2008 |
20090001248 | Methods of Creating Molds of Variable Solder Volumes for Flip Attach - A solder mold includes a substrate and a plurality of cavities for holding solder to be transferred to an integrated circuit. The plurality of cavities comprises cavities of at least two different volumes. | 01-01-2009 |
20090004840 | Method of Creating Molds of Variable Solder Volumes for Flip Attach - A method for fabricating a solder transfer mold includes masking a substrate with a masking agent. A pattern is transferred to the substrate mask. The masked substrate is etched until cavities of a first volume are formed. The cavities of the first volume are selectively coated. The masked substrate is etched until cavities of a second volume are formed. | 01-01-2009 |
20090008057 | ROTATIONAL FILL TECHNIQUES FOR INJECTION MOLDING OF SOLDER - A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head. | 01-08-2009 |
20090037016 | C4NP Servo Controlled Solder Fill Head - An apparatus for placing solder bumps on a mold plate includes: a solder fill head configured for dispensing molten solder onto the mold plate, the solder fill head also configured for relative movement over the mold plate; and a control mechanism configured for controlling positions of the solder fill head relative to the mold plate. The control mechanism includes: a control input signal containing data about an ideal positioning of the solder fill head; a plurality of sensors positioned on the solder fill head, the sensors configured for providing data about a gap between the solder fill head and the mold plate; a position controller configured for receiving the gap data and comparing the gap data with the control input signal, wherein said position controller provides an inequality signal if the gap data and the control input signal are not equal; an amplifier configured for receiving the inequality signal and amplifying it; and an actuator configured for receiving the amplified inequality signal and controlling movement of the solder fill head in response to the inequality signal received. The control mechanism may be a servo control mechanism. The sensors may be gap sensors. | 02-05-2009 |
20090065555 | ELECTRICAL INTERCONNECT FORMING METHOD - An electrical structure method of forming. The method includes forming a plurality of individual metallic structures from metallic layer formed over a first substrate. A plurality of vias are formed within a second substrate. The plurality of vias are positioned over and surrounding the plurality of metallic structures. A portion of each via is filled with solder to form solder structure surrounding an exterior surface of each metallic structure. The first substrate is removed from the metallic structures. The metallic structures comprising the solder structures are positioned over a third substrate comprising a plurality of electrically conductive pads. The metallic structures comprising the solder structures are heated to a temperature sufficient to cause the solder to melt and form an electrical and mechanical connection between each metallic structure and an associated electrically conductive pad. The second substrate is removed from the individual metallic structures. | 03-12-2009 |
20090072392 | Techniques For Forming Solder Bump Interconnects - Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequently attached to the attachment points of the wafer. | 03-19-2009 |
20090093111 | SPROCKET OPENING ALIGNMENT PROCESS AND APPARATUS FOR MULTILAYER SOLDER DECAL - A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus-for performing this process. | 04-09-2009 |
20090242614 | METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD - A tool and method is provided for repositioning a solder injection head. The tool includes a first moveable platform positioned on a first side of a workpiece chuck and a second moveable platform positioned on a second side of the workpiece chuck. A solder injection head has a seal configured to seal molten solder within the solder injection head when contacting a surface of the first moveable platform or the second moveable platform. The method includes moving a workpiece chuck and a starting platform to a position such that the starting platform is at a finishing position and a finishing platform is in a starting position. | 10-01-2009 |
20090266480 | Process for Preparing a Solder Stand-Off - The present invention relates to an injection molding of solder (IMS) process for preparing heterogenous solder bumps that contain a stand-off feature. | 10-29-2009 |
20090291263 | Method and Apparatus Providing Fine Alignment of a Structure Relative to a Support - A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved. | 11-26-2009 |
20090294090 | MOLD SHAVE APPARATUS AND INJECTION MOLDED SOLDERING PROCESS - An apparatus for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided an apparatus for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process. | 12-03-2009 |
20090301685 | FLEXIBLE NOZZLE FOR INJECTION MOLDED SOLDER - A flexible nozzle for injection molded solder of utilizing a flexible nozzle for injection molded solder applications. In order to be able to efficiently carry out the injection molded soldering process, there is utilized a compliant or flexible solder-dispensing nozzle structure, which is particularly advantageously adapted to be utilized with circular or round molds. In this connection, the tip of the nozzle, which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir. In one embodiment, there may be employed a single solder reservoir with which there communicates a plurality of discharge apertures or holes for extruding the solder so as to fill suitable cavities or recesses formed in a facing surface of a mold for injection molded solder. Alternatively, rather than dispensing or extruding the solder from a single reservoir through a plurality of holes or discharge apertures, each respective aperture or a group of apertures may be connected to, respectively, a separate solder reservoir of a plurality of reservoirs subjected to pressure to facilitate the solder extrusion onto the mold surface. | 12-10-2009 |
20090308308 | METHOD AND APPARATUS FOR DEPOSITING COPLANAR MICROELECTRONIC INTERCONNECTORS USING A COMPLIANT MOLD - A method and apparatus for the formation of coplanar electrical interconnectors. Solder material is deposited onto a wafer, substrate, or other component of an electrical package using a complaint mold such that the terminal ends of the solder material being deposited, i.e., the ends opposite to those forming an attachment to the wafer, substrate, or other component of an electrical package are coplanar with one another. A complaint mold is used having one or more conduits for receiving solder material and having a compliant side and a planar side. The compliant side of the mold is positioned adjacent to the wafer, substrate, or other component of an electrical package allowing solder material to be deposited onto the surface thereof such that the planar side of the compliant mold provides coplanar interconnectors. An Injection Molded Solder (IMS) head can be used as the means for filling the conduits of the compliant mold of the present invention. | 12-17-2009 |
20090309219 | INJECTION MOLDED SOLDER BALL METHOD - Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process. | 12-17-2009 |
20100001045 | SOLDER STANDOFFS FOR INJECTION MOLDING OF SOLDER - A method of producing standoffs in an injection molded solder (IMS) mold, which possesses cavities, each of which is filled with a solder paste using standard techniques, such as screening or IMS. This solder paste is heated to a reflow temperature at which the solder melts and forms a ball or sphere. Since solder pastes are known to reduce in volume due to the therein contained organic material burning off, the remaining solder ball will be significantly lower in volume than that of the cavity. A solder material having a lower melting point is then filled into the cavities about the solder balls. The mold and solder metal are then allowed to cool, resulting in the formation of a solid sphere of metal in the cavity surrounded by solder material of a lower melting point, which, upon transfer to a wafer, form the standoffs. | 01-07-2010 |
20100116871 | INJECTION MOLDED SOLDER METHOD FOR FORMING SOLDER BUMPS ON SUBSTRATES - A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified. | 05-13-2010 |
20100224670 | MICRO-FLUIDIC INJECTION MOLDED SOLDER (IMS) - A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed. | 09-09-2010 |
20100230143 | ELECTRICAL INTERCONNECT STRUCTURE - An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad. | 09-16-2010 |
20100230474 | ELECTRICAL INTERCONNECT FORMING METHOD - An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad. | 09-16-2010 |
20100230475 | ELECTRICAL INTERCONNECT FORMING METHOD - An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad. | 09-16-2010 |
20110091737 | Method And Apparatus Providing a Structure Relative To a Support - A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved. | 04-21-2011 |
20110127312 | Injection Molded Solder Method for Forming Solder Bumps on Substrates - A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified. | 06-02-2011 |
20110192887 | Micro-Fluidic Injection Molded Solder (IMS) - A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed. | 08-11-2011 |
20110201194 | Direct IMS (Injection Molded Solder) Without a Mask for Forming Solder Bumps on Substrates - An assembly is obtained; it includes a substrate; a plurality of wet-able pads formed on a surface of the substrate; and a solder resist layer deposited on the surface of the substrate and having an outer surface. At least the solder resist layer is formed with recessed regions defining volumes adjacent the wet-able pads. Molten solder is directly injected into the volumes adjacent the wet-able pads, such that the volumes adjacent the wet-able pads are filled with solder. The solder is allowed to solidify. It forms a plurality of solder structures adhered to the wet-able pads. The substrate and the solder are re-heated after the solidification, to re-flow the solder into generally spherical balls extending above the outer surface of the solder resist layer. The volumes adjacent the wet-able pads are configured and dimensioned to receive sufficient solder in the injecting step such that the generally spherical balls extend above the outer surface of the solder resist layer as a result of the re-heating step. In an alternative approach, solder injection and solidification are carried out in a nitrogen environment or a forming gas environment, and the reflow step may be omitted. | 08-18-2011 |
20110233262 | Micro-Fluidic Injection Molded Solder (IMS) - A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed. | 09-29-2011 |
20110272450 | DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND APPARATUS - A die level integrated interconnect decal manufacturing method and apparatus for implementing the method. In accordance with the technology concerning the soldering of integrated circuits and substrates, and particularly providing for solder decal methods forming and utilization, in the present instance there are employed underfills which consist of a solid film material and which are applied between a semiconductor chip and the substrate in order to enhance the reliability of a flip chip package. In particular, the underfill material increases the resistance to fatigue of controlled collapse chip connect (C4) bumps. | 11-10-2011 |
20120132694 | Micro-Fluidic Injection Molded Solder (IMS) - A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed. | 05-31-2012 |
20120138769 | Techniques for Forming Solder Bump Interconnects - Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequently attached to the attachment points of the wafer. | 06-07-2012 |
20120187577 | Direct Edge Connection for Multi-Chip Integrated Circuits - The present invention allows for direct chip-to-chip connections using the shortest possible signal path. | 07-26-2012 |
20120201596 | MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL VOID FORMATION IN SOLDER JOINTS - A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 percent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0% by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders. | 08-09-2012 |
20120205425 | MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL VOID FORMATION IN SOLDER JOINTS - A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 percent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0% by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders. | 08-16-2012 |
20120234902 | MULTISTACK SOLDER WAFER FILLING - A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes. | 09-20-2012 |
20120273155 | SPHERICAL SOLDER REFLOW METHOD - The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce bridging/merging of two or more solder balls during reflow. The processes of the instant disclosure are desirable because they do not require a sifting step to obtain uniformly-sized solder balls. | 11-01-2012 |
20130206351 | FORMING METAL PREFORMS AND METAL BALLS - A process and tools for forming and/or releasing metal preforms, metal shapes and solder balls is described incorporating flexible molds or sheets, injection molded metal such as solder and in the case of solder balls, a liquid or gaseous environment to reduce or remove metal oxides prior to or during metal (solder) reflow to increase surface tension to form spherical or substantially spherical solder-balls. | 08-15-2013 |
20130273339 | Method And Apparatus Providing Fine Alignment Of A Structure Relative To A Support - A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved. | 10-17-2013 |
20130330568 | Method And Apparatus Providing Fine Alignment Of A Structure Relative To A Support - A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved. | 12-12-2013 |
20140035150 | METAL CORED SOLDER DECAL STRUCTURE AND PROCESS - A method and system of producing metal cored solder structures on a substrate which includes: providing a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface; positioning a carrier beneath the bottom of the decal, the carrier having cavities located in alignment with the apertures of the decal; positioning the decal on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities; positioning a plurality of metal elements in the feature cavities; filling the feature cavities with molten solder and cooling the solder; separating the decal from the carrier to partially expose metal core solder contacts; positioning the metal core solder contacts on receiving elements of a substrate; and exposing the metal core solder contacts on the substrate. | 02-06-2014 |
20140041824 | FORMING METAL PREFORMS AND METAL BALLS - An apparatus for transferring metal solidified in blind cavities is described incorporating a first flexible tape having blind cavities, a second flexible tape having adhesive regions, rollers for guiding respective tapes and means for moving respective tapes. Also a conveyor belt having blind or through cavities, rollers and a vibration transducer or pressurized gas is described to release solidified metal in the cavities. | 02-13-2014 |
20140065771 | DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BONDING - Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly. | 03-06-2014 |
20140084314 | INJECTION MOLDED MICROOPTICS - A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught. | 03-27-2014 |
20140110462 | FORMING AN ARRAY OF METAL BALLS OR SHAPES ON A SUBSTRATE - A process and apparatus for forming and transferring metal arrays of balls and shapes is described incorporating molds, tape, injection molded metal such as solder, metal reflow and a mask on a substrate for shearing solidified metal of metal arrays into respective openings in the mask. | 04-24-2014 |
20140363965 | DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BONDING - Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly. | 12-11-2014 |