Patent application number | Description | Published |
20080286487 | PROCESS FOR MAKING CONTAINED LAYERS - There is provided a process for forming a contained second layer over a first layer, including the steps:
| 11-20-2008 |
20080309221 | Containment Structure For an Electronic Device - In one embodiment, a containment structure ( | 12-18-2008 |
20090072713 | COATED SUBSTRATE AND METHOD OF MAKING SAME - Provided are containment structures having a substrate structure having a plurality of walls extending from a surface to define a space, wherein at least one of the walls has an overall negative slope; a first layer deposited in the space having a first surface energy no greater and a second layer deposited on top of the first layer. | 03-19-2009 |
20100213454 | PROCESS AND MATERIALS FOR MAKING CONTAINED LAYERS AND DEVICES MADE WITH SAME - There is provided a process for forming a contained second layer over a first layer. The process comprises forming the first layer having a first surface energy and then treating the first layer with a photocurable surface-active composition which is a fluorinated ester or fluorinated imide of an α,β-unsaturated polyacid; exposing the photocurable surface-active composition patternwise with radiation resulting in exposed areas and unexposed areas; developing the photocurable surface-active composition to remove the unexposed areas resulting in a first layer having untreated portions in the unexposed areas and treated portions in the exposed areas, where the treated portions have a second surface energy that is lower than the first surface energy; and forming the second layer on the untreated portions of the first layer. There is also provided an organic electronic device made by the process. | 08-26-2010 |
20110092076 | APPARATUS AND METHOD OF VAPOR COATING IN AN ELECTRONIC DEVICE - An apparatus and method for vapor phase deposition of a reactive surface area (RSA) material onto a substrate of an electronic device. The vapor phase deposition is conducted at ambient pressures in air, and provides capture of residual vapor to minimize environmental release of RSA and other constituents used in the processing. | 04-21-2011 |
20110183268 | PROCESS FOR MAKING CONTAINED LAYERS AND DEVICES MADE WITH SAME - There is provided a process for forming a contained second layer over a first layer, including the steps:
| 07-28-2011 |
20110300657 | PROCESS FOR FORMING AN ELECTROACTIVE LAYER - There is provided a process for forming a layer of electroactive material. The process includes: depositing a liquid composition containing an electroactive material and at least one solvent onto a workpiece to form a wet layer; placing the wet layer on the workpiece into a vacuum chamber containing solid absorptive material; and treating the wet layer at a controlled temperature in the range of −25° C. to 80° C. and under an applied vacuum in the range of 10 | 12-08-2011 |
20110305824 | PROCESS FOR FORMING AN ELECTROACTIVE LAYER - There is provided a process for vacuum drying. The process includes the steps of: depositing a liquid composition containing a film-forming material and at least one solvent onto a workpiece to form a wet layer; placing the wet layer on the workpiece into a vacuum chamber including a condenser; and treating the wet layer at a controlled temperature in the range of −25 to 80° C. and under an applied vacuum in the range of 10 | 12-15-2011 |
20110309360 | PROCESS FOR FORMING AN ELECTROACTIVE LAYER - There is provided a process for forming a layer of electroactive material having a substantially flat profile. The process includes: providing a workpiece having at least one active area; depositing a liquid composition including the electroactive material onto the workpiece in the active area, to form a wet layer; treating the wet layer on the workpiece at a controlled temperature in the range of −25 to 80° C. and under a vacuum in the range of 10 | 12-22-2011 |
20140264307 | PROCESS FOR FORMING AN ELECTROACTIVE LAYER - There is provided a process for forming a layer of electroactive material having a substantially flat profile. The process includes: providing a workpiece having at least one active area; depositing a liquid composition including the electroactive material onto the workpiece in the active area, to form a wet layer; treating the wet layer on the workpiece at a controlled temperature in the range of −25 to 80° C. and under a vacuum in the range of 10 | 09-18-2014 |