Patent application number | Description | Published |
20080206590 | CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL, AND SEMICONDUCTOR DEVICE - In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an Al content of the Al series alloy layer is 99 to 100 wt. % or a Zn content of the Zn series alloy layer is 90 to 100 wt. %. By using this connecting material, the formation of an Al oxide film on the surface of the connecting material at the time of the connection can be suppressed, and preferable wetness that cannot be obtained with the Zn—Al alloy can be obtained. Further, when an Al series alloy layer is left after the connection, since the soft Al functions as a stress buffer material, the high connection reliability can be achieved. | 08-28-2008 |
20090159650 | Semiconductor device and automotive AC generator - A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a Cu | 06-25-2009 |
20090321783 | Semiconductor Device - A semiconductor device which includes a semiconductor chip; an electrically conductive base electrode bonded to the lower surface of the semiconductor chip by a first bonding member; an electrically conductive lead electrode bonded to the upper surface of the semiconductor chip by a second bonding member; and a first stress relief member for reducing stress developed in the first bonding member due to the difference in thermal expansion between the semiconductor chip and the base electrode, wherein both the base electrode and the first stress relief member are in direct contact with the lower surface of the first bonding member. | 12-31-2009 |
20100175908 | Metal Strip, Connector, and Method of Manufacturing Metal Strip - A Ni plating is applied on a base metal in a metal strip form, and a brightener-free Sn-(1 to 4% by mass)Cu plating is applied on the Ni plating. The metal strip is heat-treated at a temperature at or above the melting point (solidus line) of a Sn-(1 to 4% by mass)Cu alloy to form a Cu—Sn compound layer or a Cu—Ni—Sn-compound layer on the Ni plating layer and a Sn layer or a Sn—Cu-ally layer on the Cu—Sn compound layer or the Cu—Ni—Sn-compound layer. The metal strip is further fabricated into a connector. Thus, a metal strip, which has good soldability on a substrate, is free from the occurrence of whiskers at a terminal part during storage or upon fitting into FPC or FFC, and is necessary for a lead-free connector, can be realized. | 07-15-2010 |
20110042815 | SEMICONDUCTOR DEVICE AND ON-VEHICLE AC GENERATOR - An object of the present invention is to provide, at low costs, an environmental friendly bonding material for a semiconductor, having sustained bonding reliability even when used at a temperature as high as 200° C. or higher for a long period of time, the semiconductor device having a semiconductor element, a supporting electrode body bonded to a first face of the semiconductor element via a first bonding member, and a lead electrode body bonded to a second face of the semiconductor element supported by the supporting electrode body via a second bonding member, the semiconductor device having a Ni-based plating layer and an intermetallic compound layer containing at least one of Cu | 02-24-2011 |
20110223718 | SEMICONDUCTOR DEVICE AND AUTOMOTIVE AC GENERATOR - A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a Cu | 09-15-2011 |
20120000965 | CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE - In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an | 01-05-2012 |
20120098134 | CONNECTING MATERIAL, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - When connecting with a conventional Zn/Al/Zn cladding material, thickness of a connecting part needs to be less than double an existing high-lead solder (about 100 μm) in order to make heat resistance in the connecting part at least equivalent to a level of the existing solder. Moreover, thickness of an Al layer needs to make as thick as possible in order to fully exhibit stress relaxation performance of the Al layer. | 04-26-2012 |
20130127026 | CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE - In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an Al content of the Al series alloy layer is 99 to 100 wt.% or a Zn content of the Zn series alloy layer is 90 to 100 wt.%. By using this connecting material, the formation of an Al oxide film on the surface of the connecting material at the time of the connection can be suppressed, and preferable wetness that cannot be obtained with the Zn—Al alloy can be obtained. Further, a high connection reliability can be achieved when an Al series alloy layer is left after the connection, since the soft Al thereof functions as a stress buffer material. | 05-23-2013 |
20130256390 | JUNCTION MATERIAL, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF JUNCTION STRUCTURE - The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer ( | 10-03-2013 |
Patent application number | Description | Published |
20080198142 | IMAGE PROCESSING APPARATUS AND METHOD - An image processing apparatus provided with a display unit for displaying an operation picture, showing control indicia (e.g., icons) corresponding to multiple image processing functions, is operated to display the operation picture on an external display device. The operator selects one of the indicia shown on the external display device by operating an input device, such as touch screen of the apparatus or a remote control, to indicate the position of the desired one of the indicia. The operator can thereby quickly and reliably select an image processing function to be executed, without any need to view an operation picture on the display unit when making the selection. | 08-21-2008 |
20100026847 | Electronic camera with self-explanation/diagnosis mode - An electronic camera having a plurality of functions including capturing and recording images is provided. The electronic camera includes an on input unit for inputting external operations that designate corresponding functions of the camera to be performed, an image pickup unit for capturing the image of an object, and a recorder for recording the image captured by the image pickup unit. The electronic camera further includes a playback unit for at least playing back image information that is recorded on the recording medium and a mode selector for selecting one operation mode of the camera from a plurality of available operation modes that include an operation explanation mode. If the operation explanation mode is selected at the mode selector, the playback unit plays back an operation guide that is pre-stored in a memory, the operation guide explaining at least one of the camera operations and functions thereof. | 02-04-2010 |
20100224926 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A plurality of NAND cells are arranged in a cell array. In each of the NAND cells, a pair of selection gate transistors is connected in series to a plurality of memory cell transistors. An inter-gate connection trench is formed in an insulating film between layers of stacked gates of the selection gate transistors. The stacked gates are electrically connected to each other. At an end part of the cell array in the row direction, an STI area is formed, and dummy NAND cells are formed at an end part in the row direction. A dummy selection gate transistor is connected in series to a plurality of dummy memory cell transistors. No inter-gate connection trench is present in an insulating film between layers of stacked gates of the dummy selection gate transistor, and the stacked gates of the dummy selection gate transistor are not electrically connected to each other. | 09-09-2010 |
20110037694 | IMAGE PROCESSING APPARATUS AND METHOD - An image processing apparatus provided with a display unit for displaying an operation picture, showing control indicia (e.g., icons) corresponding to multiple image processing functions, is operated to display the operation picture on an external display device. The operator selects one of the indicia shown on the external display device by operating an input device, such as touch screen of the apparatus or a remote control, to indicate the position of the desired one of the indicia. The operator can thereby quickly and reliably select an image processing function to be executed, without any need to view an operation picture on the display unit when making the selection. | 02-17-2011 |
20110242329 | ELECTRONIC CAMERA WITH SELF-EXPLANATION/DIAGNOSIS MODE - An electronic camera having a plurality of functions including capturing and recording images is provided. The electronic camera includes an operation input unit for inputting external operations that designate corresponding functions of the camera to be performed, an image pickup unit for capturing the image of an object, and a recorder for recording the image captured by the image pickup unit. The electronic camera further includes a playback unit for at least playing back image information that is recorded on the recording medium and a mode selector for selecting one operation mode of the camera from a plurality of available operation modes that include an operation explanation mode. If the operation explanation mode is selected at the mode selector, the playback unit plays back an operation guide that is pre-stored in a memory, the operation guide explaining at least one of the camera operations and functions thereof. | 10-06-2011 |
20120105700 | IMAGE PROCESSING APPARATUS AND METHOD - An image processing apparatus provided with a display unit for displaying an operation picture, showing control indicia (e.g., icons) corresponding to multiple image processing functions, is operated to display the operation picture on an external display device. The operator selects one of the indicia shown on the external display device by operating an input device, such as touch screen of the apparatus or a remote control, to indicate the position of the desired one of the indicia. The operator can thereby quickly and reliably select an image processing function to be executed, without any need to view an operation picture on the display unit when making the selection. | 05-03-2012 |
20120274797 | IMAGE SIGNAL RECORDING/REPRODUCTION APPARATUS, METHOD EMPLOYED THEREIN, AND IMAGE SIGNAL RECORDING APPARATUS - An image signal recording/reproduction apparatus having a generating apparatus that generates a dynamic image signal or a still image signal of a subject captured by an imaging apparatus; an operation apparatus that starts recording of the dynamic image signal or the still image signal generated by the generating apparatus; a recording apparatus that records the dynamic image signal or the still image signal into a recording medium through mechanical drive; a reproduction apparatus that reproduces the dynamic image signal or the still image signal recorded at the recording medium through mechanical drive; and a control apparatus that implements control so that the mechanical drive is sustained if the operation apparatus is operated while the dynamic image signal or the still image signal is being reproduced by the reproduction apparatus and so that the recording apparatus records the dynamic image signal or the still image signal in the recording medium. | 11-01-2012 |
20130120255 | IMAGE PROCESSING APPARATUS AND METHOD - An image processing apparatus provided with a display unit for displaying an operation picture, showing control indicia (e.g., icons) corresponding to multiple image processing functions, is operated to display the operation picture on an external display device. The operator selects one of the indicia shown on the external display device by operating an input device, such as touch screen of the apparatus or a remote control, to indicate the position of the desired one of the indicia. The operator can thereby quickly and reliably select an image processing function to be executed, without any need to view an operation picture on the display unit when making the selection. | 05-16-2013 |
Patent application number | Description | Published |
20080265386 | SEMICONDUCTOR DEVICE - To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire. | 10-30-2008 |
20100009853 | PARASITIC PLANT CONTROL AGENT AND USE THEREOF - Parasitic plants parasitizing on crops can be controlled effectively, by providing an agent for controlling parasitic plants, which comprises tiadinil or the like as the active ingredient and a method for using an agent for controlling parasitic plants, which comprises treating a parasitized plant or soil with an effective amount of agent for controlling parasitic plants. As a result, the yield of crops can be recovered to the level of parasitism-free crops. Additionally, by inhibiting parasitism of parasitic plants strongly, development of the next generation can be inhibited so that the level of pollution with parasitic plants on agricultural land can be lowered with cultivating sensitive crops. | 01-14-2010 |
20100105174 | SEMICONDUCTOR DEVICE - To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire. | 04-29-2010 |
20110137746 | CONTENT DISTRIBUTION SYSTEM AND CONTENT DISTRIBUTION METHOD - A content distribution system which assures reliability of content is provided. Permitted-user information corresponding to a user who is permitted to use content to be distributed is associated with the content. In the case where user specific information which specifies a user and the permitted-user information do not have a predetermined relation, a user terminal transmits the user specific information and the permitted-user information to a server. The server generates user-related information in which the received user specific information is set as a distribution destination and the permitted-user information is set as a distributor, generates new permitted-user information so as to have the predetermined relation with the user specific information, and provides the new permitted-user information to the user terminal. The user terminal which obtains the new permitted-user information changes the permitted-user information to the new permitted-user information. | 06-09-2011 |
20120034742 | SEMICONDUCTOR DEVICE - To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire. | 02-09-2012 |
20130207252 | Semiconductor Device - To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire. | 08-15-2013 |
20130274002 | GAME SYSTEM - One object is to provide a game system that can technically restrain real money trade. In accordance with one aspect, a game system according to an embodiment of the present invention includes: a bid data generating unit configured to generate bid data including game medium information related to a bid game medium and not including player specifying information that specifies a bidder player; and a second display control unit configured to allow a bid screen generated based on bid data to be displayed in the game being played by an exhibitor player. | 10-17-2013 |
20130337906 | GAME SYSTEM - One object is to provide a video game system that can technically restrain real money trade. In accordance with one aspect, a server device | 12-19-2013 |
20140327121 | Semiconductor Device and Method for Manufacturing Same - The purpose of the present invention is to increase the reliability of a semiconductor device in which a semiconductor element and a substrate are connected by solder and which is molded by resin. | 11-06-2014 |
20150141138 | GAME SYSTEM - One object is to provide a video game system that can technically restrain real money trade. In accordance with one aspect, a server device | 05-21-2015 |
20150157942 | SYSTEM, METHOD, AND STORAGE MEDIUM STORING A PROGRAM FOR PROVIDING ONLINE GAME ALLOWING EXCHANGE OF GAME ITEMS BETWEEN USERS - One object is to provide a game system restraining real money trade in a technical aspect. The game system includes one or more computer processors for executing a computer program to provide a game played by a plurality of users. The computer program includes: an exhibition request receiving module for receiving, from a first user among the plurality of users, an exhibition request for exhibiting a first game item owned by the first user; an exchange request receiving module for receiving, from a second user among the plurality of users, an exchange request for exchanging a second game item owned by the second user for the first game item exhibited by the first user; and a re-exhibition information presenting module for presenting, to part or all of the plurality of users, re-exhibition item information indicating that the second game item is exhibited for exchange for the first game item. | 06-11-2015 |