Patent application number | Description | Published |
20080261005 | MULTILAYER CERAMIC ELECTRONIC COMPONENT, MULTILAYER CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a resin so that the pedestal portion is fixed to the first main surface with at least the resin, the multilayer ceramic body being formed by stacking a ceramic base material layer and a shrinkage-inhibiting layer having a predetermined conductor pattern. Also, a via hole conductor is disposed in the pedestal portion so that one of the end surfaces is exposed in a surface of the pedestal portion, and a surface mounting-type electronic component such as a semiconductor element is connected, through a conductive binder, to the one of the end surfaces of the via hole conductor exposed in the surface of the pedestal portion. A resin is provided between the surface mounting-type electronic component and the pedestal portion, the resin having the same composition as in the resin of the pedestal portion. A semiconductor element is mounted as the surface mounting-type electronic component on the pedestal portion. | 10-23-2008 |
20080289853 | COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE - In a composite body, a frame body to be connected to a first major surface of a substrate body includes a frame member made of an insulating material and a plurality of connection members formed by bending thin metal plates. The frame member includes a through-hole at the approximate center thereof and extends along a peripheral portion of the first major surface of the substrate body so as to define a frame shape. Each of the plurality of connection members has a first strip and a second strip continuously connected to opposed ends of a middle strip. The connection members are disposed in the frame member so as to face each other with the through-hole therebetween. Each of the first strip and the second strip of the connection member is exposed on a corresponding one of the two major surfaces extending around the through-hole of the frame member. The first strip and the second strip extend in a direction in which the connection members face each other with the through-hole therebetween, and the opposed ends of the middle strip are continuously connected to an end of the first strip and an end of the second strip on the side adjacent to the through-hole. The middle strip extends through the inside of the frame member. | 11-27-2008 |
20080305425 | METHOD FOR FORMING CIRCUIT PATTERN - A method for forming circuit patterns having different resistances. The method includes (1) a first step of forming a first toner image using a first toner and a second toner image using a second toner, each by electrophotography, the first toner containing a resistive material, the second toner having a resistance different from that of the first toner; and (2) a second step of transferring and fixing the first toner image and the second toner image to an object to be printed such as a ceramic green sheet, to form a circuit pattern. | 12-11-2008 |
20090056987 | MULTILAYER CERAMIC ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a multilayer ceramic electronic device, a resin introduction portion located outside a vertically projected region of a surface mount electronic device is disposed on a seat portion which includes a non-metallic inorganic powder as a primary component and on which the surface mount electronic device, e.g., a semiconductor element, is mounted, and a resin is supplied to the resin introduction portion so as to fill the resin into the seat portion and a gap between the seat portion and a multilayer ceramic element assembly. Unsintered ceramic base material layers and shrinkage restriction layers arranged to restrict shrinkage of the unsintered ceramic base material layers in a direction substantially perpendicular to a thickness direction of the unsintered ceramic base material layers are laminated and, thereby, an unfired multilayer ceramic element assembly is formed, which does not shrink in a direction substantially perpendicular to a lamination direction in a firing step. | 03-05-2009 |
20090201117 | CONTAINER WITH ELECTROMAGNETIC COUPLING MODULE - A container includes an electromagnetic coupling module on an inner surface of a container main body and a radiator made of a metal material on an outer surface of the container main body. The electromagnetic coupling module includes a feeder circuit board, on which a radio IC chip is mounted and in which a feeder circuit including a resonant circuit that has a predetermined resonant frequency and includes an inductance element is provided. The electromagnetic coupling module and the radiator preferably transmit and receive high-frequency signals through electromagnetic coupling. The container thus has an electromagnetic coupling module that includes a radio IC chip that is resistant to a shock applied from the outside and an environmental change, realizes an easy arrangement of a radiator and the electromagnetic coupling module, provides a preferable radiation characteristic, and is suitably used in an RFID system. | 08-13-2009 |
20090302972 | PACKAGING MATERIAL WITH ELECTROMAGNETIC COUPLING MODULE - A packaging material includes an electromagnetic coupling module for an RFID system, in which a radio IC chip is protected from external shock and environmental change without affecting the planarity of the packaging material, the assembly including an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module is arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The packaging material is made of a dielectric, wherein the dielectric and the electromagnetic coupling module are electromagnetically coupled to transmit/receive high frequency signals. | 12-10-2009 |
20090305635 | PACKAGING MATERIAL WITH ELECTROMAGNETIC COUPLING MODULE - A packaging material with an electromagnetic coupling module for a RFID system, is constructed such that a radio IC chip is protected from external shock and environmental change without adversely affecting the planarity of the packaging material, the assembly of a radiator and an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module and a radiator that are electromagnetically coupled to each other are arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The radiator electromagnetically couples with the electromagnetic coupling module to transmit/receive high frequency signals. | 12-10-2009 |
20090320986 | VIA HOLE FORMING METHOD USING ELECTROPHOTOGRAPHIC PRINTING METHOD - A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method. | 12-31-2009 |
20100212152 | MULTILAYER SUBSTRATE WITH BUILT-IN CHIP-TYPE ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A multilayer substrate having a built-in chip-type electronic component includes a ceramic laminate having a plurality of ceramic layers, a chip-type electronic component disposed in the ceramic laminate and having an external terminal electrode, and a via conductor disposed in the ceramic layers in the lamination direction. The external terminal electrode of the chip-type electronic component is connected to the via conductor, and a connection step is provided in at least one of the upper and lower end surfaces of the via conductor. | 08-26-2010 |
20110265948 | VIA HOLE FORMING METHOD USING ELECTROPHOTOGRAPHIC PRINTING METHOD - A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method. | 11-03-2011 |
20140016288 | MULTILAYER CERAMIC ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly including laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion is prepared. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device and is cured. | 01-16-2014 |