Patent application number | Description | Published |
20080261005 | MULTILAYER CERAMIC ELECTRONIC COMPONENT, MULTILAYER CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a resin so that the pedestal portion is fixed to the first main surface with at least the resin, the multilayer ceramic body being formed by stacking a ceramic base material layer and a shrinkage-inhibiting layer having a predetermined conductor pattern. Also, a via hole conductor is disposed in the pedestal portion so that one of the end surfaces is exposed in a surface of the pedestal portion, and a surface mounting-type electronic component such as a semiconductor element is connected, through a conductive binder, to the one of the end surfaces of the via hole conductor exposed in the surface of the pedestal portion. A resin is provided between the surface mounting-type electronic component and the pedestal portion, the resin having the same composition as in the resin of the pedestal portion. A semiconductor element is mounted as the surface mounting-type electronic component on the pedestal portion. | 10-23-2008 |
20090056987 | MULTILAYER CERAMIC ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a multilayer ceramic electronic device, a resin introduction portion located outside a vertically projected region of a surface mount electronic device is disposed on a seat portion which includes a non-metallic inorganic powder as a primary component and on which the surface mount electronic device, e.g., a semiconductor element, is mounted, and a resin is supplied to the resin introduction portion so as to fill the resin into the seat portion and a gap between the seat portion and a multilayer ceramic element assembly. Unsintered ceramic base material layers and shrinkage restriction layers arranged to restrict shrinkage of the unsintered ceramic base material layers in a direction substantially perpendicular to a thickness direction of the unsintered ceramic base material layers are laminated and, thereby, an unfired multilayer ceramic element assembly is formed, which does not shrink in a direction substantially perpendicular to a lamination direction in a firing step. | 03-05-2009 |
20090294167 | MULTILAYER WIRING BOARD - A multilayer wiring board is capable of preventing the occurrence of cracking in the vicinity of a connection portion of a conductor pattern disposed inside a basic material layer and a via-hole conductor even when the conductor pattern is connected to the via-hole conductor. A multilayer wiring board includes basic material layers and the constraining layers that are alternately stacked. In the material layer, a via-hole conductor is connected to an intermediate conductor pattern. An extended portion is defined by extending an end of the via-hole conductor beyond the intermediate conductor pattern inside the basic material layer. | 12-03-2009 |
20100006335 | MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - In a multilayer ceramic substrate manufactured by a non-shrinking process, a bonding strength of an external conductive film formed on a primary surface of the multilayer ceramic substrate is increased. After a laminate of a multilayer ceramic substrate is formed from first ceramic layers and second shrinkage suppressing ceramic layers, and an underlayer is formed along one primary surface of the multilayer ceramic substrate, an external conductive film is formed on the underlayer. A non-sintering ceramic material powder in a non-sintered state is included in both the external conductive film and the underlayer, and this non-sintering ceramic material powder is fixed due to diffusion of a glass component from the first ceramic layers. | 01-14-2010 |
20100147568 | CERAMIC MULTILAYER SUBSTRATE - A ceramic multilayer substrate in which cracks resulting from the difference in shrinkage caused by heat or thermal shrinkage caused by firing can be prevented effectively between an end surface electrode and a substrate main body. The substrate main body includes alternately stacked first and second ceramic layers, and including first recesses provided in end surfaces of at least two adjacent ceramic layers so as to communicate with each other, and an electroconductive end surface electrode is disposed in the first recesses in the substrate main body. The first and the second ceramic layer each have a sintering start temperature and a sintering end temperature, and at least one of the sintering start temperature and the sintering end temperature is different between the first and the second ceramic layer. The substrate main body has a second recess in at least one of the ceramic layers having the first recesses so as to communicate with the first recess and lie between other ceramic layers. In the second recess, an electroconductive protrusion connected to the end surface electrode is disposed. | 06-17-2010 |
20100224396 | CERAMIC COMPOSITE MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC COMPOSITE MULTILAYER SUBSTRATE AND ELECTRONIC COMPONENT - A high-reliability ceramic composite multilayer substrate that has excellent flatness and few remaining pores, can be produced at a low cost while simplifying the manufacturing process, and can eliminate layer separation or separation from a mother board. The ceramic composite multilayer substrate includes a laminate containing a first ceramic layer and a second ceramic layer that is disposed so as to contact the first ceramic layer and suppresses firing shrinkage in the plane direction of the first ceramic layer. The laminate includes a resin/ceramic composite layer in which porous ceramic is impregnated with a resin formed on at least one principal surface of the laminate. | 09-09-2010 |
20140016288 | MULTILAYER CERAMIC ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly including laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion is prepared. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device and is cured. | 01-16-2014 |
Patent application number | Description | Published |
20160116284 | Electronic Device, Electronic Apparatus, and Moving Object - An electronic device includes an vibration element including an vibration body provided with an adjustment section, an electrode disposed on the vibration body, and a connection electrode electrically connected to the electrode, an IC so disposed that the IC faces the vibration element, terminals disposed on the side facing the upper surface of the IC and electrically connected to the connection electrode via a fixing member, wiring sections electrically connected to the terminals and located below the terminals, and a protective layer located above the wiring sections and disposed in a portion where the adjustment section overlaps with the wiring sections in a plan view. | 04-28-2016 |
20160116286 | Electronic Device, Electronic Apparatus, and Moving Object - An electronic device includes a vibration element having a detection signal electrode and a drive signal electrode, an IC disposed so as to be opposed to the vibration element, a first wiring pattern located between the IC and the vibration element, and electrically connected to the drive signal electrode, and a shield wiring pattern located on the vibration element side of the first wiring pattern, and electrically connected to a constant potential (ground). | 04-28-2016 |
Patent application number | Description | Published |
20140305206 | DETECTION DEVICE, SENSOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A detection device includes a driving circuit that drives a vibrator, and a detection circuit that receives a detection signal from the vibrator and performs a detection process of detecting a physical quantity signal corresponding to a physical quantity from the detection signal. The driving circuit performs intermittent driving in which the vibrator is driven in a driving period, and is not driven in a non-driving period, and the detection circuit performs the detection process of the physical quantity signal in the non-driving period of the intermittent driving. | 10-16-2014 |
20150122022 | DETECTION DEVICE, SENSOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A detection device includes: a drive circuit which receives a feedback signal from a physical quantity transducer and drives the physical quantity transducer; a detection circuit which receives a detection signal from the physical quantity transducer and detects a desired signal; and a control unit which controls switching on/off of an AGC loop in the drive circuit. The drive circuit outputs a drive signal based on a control voltage that is set by the AGC loop in an on-period of the AGC loop to the physical quantity transducer and thus drives the physical quantity transducer in an off-period of the AGC loop. | 05-07-2015 |
20150122034 | DETECTION DEVICE, SENSOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A detection device includes a driving circuit which drives a physical quantity transducer, a detection circuit which detects a desired signal, a power-supply terminal into which a power-supply voltage is input, a regulator circuit which performs a voltage adjustment of stepping down the power-supply voltage from the power-supply terminal, and supplies a regulated power-supply voltage obtained by the voltage adjustment to the driving circuit and the detection circuit as an operating power-supply voltage, and a buffer circuit which is supplied with the power-supply voltage, receives a drive signal from the driving circuit, and outputs an amplified drive signal in which an amplitude of the drive signal increases to the physical quantity transducer. | 05-07-2015 |
Patent application number | Description | Published |
20130057375 | FERRITE CERAMIC COMPOSITION, CERAMIC ELECTRONIC COMPONENT, AND PROCESS FOR PRODUCING CERAMIC ELECTRONIC COMPONENT - This disclosure provides a ferrite ceramic composition, a ceramic electronic component including the ceramic composition, and a process of producing a ceramic electronic component including the ferrite ceramic composition, of which the insulation performance can be secured even when fired simultaneously with a metal wire material containing Cu as the main component, and which can have good electric properties. The ferrite ceramic composition includes an Ni—Mn—Zn-based ferrite having a molar content of CuO of 5 mol % or less and in which, when the molar content (x) of Fe | 03-07-2013 |
20150077210 | FERRITE CERAMIC COMPOSITION, CERAMIC ELECTRONIC COMPONENT, AND PROCESS FOR PRODUCING CERAMIC ELECTRONIC COMPONENT - This disclosure provides a ferrite ceramic composition, a ceramic electronic component including the ceramic composition, and a process of producing a ceramic electronic component including the ferrite ceramic composition, of which the insulation performance can be secured even when fired simultaneously with a metal wire material containing Cu as the main component, and which can have good electric properties. The ferrite ceramic composition includes an Ni—Mn—Zn-based ferrite having a molar content of CuO of 5 mol % or less and in which, when the molar content (x) of Fe | 03-19-2015 |