Patent application number | Description | Published |
20080269084 | HEAT DISSIPATING SILICONE GREASE COMPOSITIONS - A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation. | 10-30-2008 |
20110248211 | HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION - A heat-conductive silicone grease composition is provided comprising (A) a trialkoxysilyl-endcapped organopolysiloxane having a viscosity of 0.1-1,000 Pa·s at 25° C., (B) a specific organopolysiloxane, (C) a heat-conductive filler, and (D) a condensation catalyst. The composition is amenable to coat at the initial, thereafter increases its viscosity with moisture at room temperature rather than curing so that it remains flexible, easy to re-work, and anti-sagging, eliminates a need for cold storage and for hot application, avoids any undesired viscosity buildup, is easy to manufacture, and has good heat transfer. | 10-13-2011 |
20120085964 | MOISTURE-THICKENING HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION - A heat-conductive silicone grease composition is obtained by combining (A) a hydroxyl-endcapped organopolysiloxane, (B) a specific organopolysiloxane, (C) a silane compound having at least three hydrolyzable radicals and/or a hydrolyzate thereof, (D) a thickening catalyst, and (E) a heat-conductive filler. The composition is storable at RT, has a low initial viscosity enough to coat, and after coating, thickens with moisture at RT so that it becomes anti-sagging, remains re-workable, and has durable heat resistance. | 04-12-2012 |
20120119137 | THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION - A thermally conductive silicone grease composition comprising:
| 05-17-2012 |
20130087905 | CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE - A curable organopolysiloxane composition in grease or paste form, which including: | 04-11-2013 |
20140094554 | ROOM TEMPERATURE AND HUMIDITY THICKENING THERMO-CONDUCTIVE SILICON GREASE COMPOSITION - Provided is a room temperature and humidity thickening thermo-conductive silicone grease composition with high shape retention characteristics and good workability despite a low viscosity in an initial phase. Essential components of the room temperature and humidity thickening thermo-conductive silicone grease composition of the present invention are: (A) organopolysiloxane with a viscosity of between 0.1 Pa·s and 1,000 Pa·s at 25° C. with both ends being blocked by a hydroxyl group; (B) organopolysiloxane represented by general equation (1) | 04-03-2014 |
20150148273 | THERMALLY-CURABLE HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION - Provided is a thermally-curable heat-conductive silicone grease composition which has a high shape-retaining property in an early stage even when the viscosity of the composition is low (i.e., the composition is easy to apply) in the early stage, and which becomes soft (has low hardness) after being cured. A thermally-curable heat-conductive silicone grease composition comprising, as essential components:
| 05-28-2015 |
20160096984 | THERMALLY CONDUCTIVE SILICONE COMPOSITION AND A CURED PRODUCT OF SAME - A thermally conductive silicone composition is provided, a cured material from which does not impose stress to IC packages, even left at a high temperature. | 04-07-2016 |