Patent application number | Description | Published |
20110058767 | Reinforced Sensor With Optical Fiber Woven Into Fabric - A reinforced sensor with an optical fiber woven into a fabric, comprising a fabric formed in a manner that a weft yarn is woven thereinto in a direction substantially perpendicular to a warp yarn, wherein an optical fiber is included in at least either one of fibers of the warp yarn and the weft yarn. The optical fiber may function as a FBG sensor. | 03-10-2011 |
20120247236 | SENSOR WITH AGING FUNCTION - A sensor with aging function is provided wherein installation space for an apparatus to perform an aging process and the number of apparatuses can be reduced which enables easy and reliable aging processes and can improve measuring accuracy and enhance measuring reliability of the sensor. The sensor with aging function | 10-04-2012 |
20120247237 | SENSOR AND BONDING AGENT FOR SAME - A sensor and bonding agent for the sensor wherein thickness of the bonding agent interposed between the sensor and measuring object can be kept uniform to maintain uniform bonding force of the bonding agent and a peeling phenomenon of the bonding agent occurring due to a difference in thermal expansion between the measuring object and bonding agent and/or between the bonding agent and the sensor can be prevented. The sensor is attached, through the bonding agent, to a high-temperature measuring object, include a sensor main body having a detecting section, a block body constructed by integrally forming the sensor main body using a molding process. The block body is made of a ceramic-based bonding material that the same as a material forming the bonding agent and, on a side of the measuring object of the block body, a bonding surface of the bonding agent is formed. | 10-04-2012 |
Patent application number | Description | Published |
20090140330 | Semiconductor device and method of manufacturing semiconductor device - The semiconductor device according to the present invention includes a semiconductor layer, a trench formed by digging the semiconductor layer from the surface thereof, a gate insulating film formed on the inner surface of the trench, and a gate electrode made of silicon embedded in the trench through the gate insulating film. The gate electrode has a high-conductivity portion formed to cover the gate insulating film with a relatively high conductivity and a low-conductivity portion formed on a region inside the high-conductivity portion with a relatively low conductivity. | 06-04-2009 |
20090179277 | Semiconductor device and method for manufacturing the same - A semiconductor device according to the present invention includes: a semiconductor layer; an element separating portion, formed in a top layer portion of the semiconductor layer and separating, in the semiconductor layer, a first element forming region for forming a first conductive type MOSFET and a second element forming region for forming a second conductive type MOSFET; a first gate insulating film, selectively formed on a top surface of the semiconductor layer in the first element forming region; a first gate electrode, formed on the first gate insulating film; a first sidewall, formed at a periphery of the first gate insulating film and the first gate electrode; a second gate insulating film, selectively formed on a top surface of the semiconductor layer in the second element forming region; a second gate electrode, formed on the second gate insulating film; and a second sidewall, formed at a periphery of the second gate insulating film and the second gate electrode. The first sidewall includes: a base, contacting the top surface of the semiconductor layer; and a main body, formed on the base and protruding laterally beyond a peripheral edge of the base. | 07-16-2009 |
20100283125 | Semiconductor device and method of manufacturing the same - The semiconductor device according to the present invention includes a lower electrode made of a metallic material, a capacitance film made of an insulating material and laminated on the lower electrode, an upper electrode made of a metallic material, opposed to the lower electrode through the capacitance film, and having an outline smaller than that of the lower electrode in plan view along the opposed direction, and a protective film made of the same material as that of the capacitance film and laminated on the upper electrode. | 11-11-2010 |
20110298044 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The semiconductor device according to the present invention includes a semiconductor layer, a trench formed by digging the semiconductor layer from the surface thereof, a gate insulating film formed on the inner surface of the trench, and a gate electrode made of silicon embedded in the trench through the gate insulating film. The gate electrode has a high-conductivity portion formed to cover the gate insulating film with a relatively high conductivity and a low-conductivity portion formed on a region inside the high-conductivity portion with a relatively low conductivity. | 12-08-2011 |
20140299990 | SEMICONDUCTOR DEVICE - The semiconductor device of the present invention includes an insulating layer, a copper wiring for wire connection formed on the insulating layer, a shock absorbing layer formed on an upper surface of the copper wiring, the shock absorbing layer being made of a metallic material with a hardness higher than copper, a bonding layer formed on the shock absorbing layer, the bonding layer having a connection surface for a wire, and a side protecting layer covering a side surface of the copper wiring, wherein the side protecting layer has a thickness thinner than a distance from the upper surface of the copper wiring to the connection surface of the bonding layer. | 10-09-2014 |
20150137314 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE - The semiconductor device of the present invention includes an insulating layer, a high voltage coil and a low voltage coil which are disposed in the insulating layer at an interval in the vertical direction, a low potential portion which is provided in a low voltage region disposed around a high voltage region for the high voltage coil in planar view and is connected with potential lower than the high voltage coil, and an electric field shield portion which is disposed between the high voltage coil and the low voltage region and includes an electrically floated metal member. | 05-21-2015 |
Patent application number | Description | Published |
20090135866 | OPTICAL TRANSMISSION CIRCUIT - An optical transmission circuit includes a light emitting device ( | 05-28-2009 |
20090166513 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device in the present invention includes pixels, arranged in a matrix, each of which converts light into a signal voltage; column signal lines each of which is provided for corresponding one of columns, so that the signal voltage is provided to corresponding one of the column signal lines; and AD converting units each of which is provided for the corresponding one of the column signal lines, and configured to convert the signal voltage into a digital signal, wherein each of the AD converting units includes: a comparing unit generating an output signal indicating a greater voltage of the signal voltage and a reference voltage; and a counting unit counting a count value until logic of the output signal is inverted, and the solid-state imaging device further includes a suspending unit suspending power supply to the comparing units after the logic of the output signals is inverted. | 07-02-2009 |
20110114827 | VOLTAGE GENERATOR CIRCUIT, DIGITAL-TO-ANALOG CONVERTER, RAMP GENERATOR CIRCUIT, ANALOG-TO-DIGITAL CONVERTER, IMAGE SENSOR SYSTEM, AND METHOD FOR GENERATING VOLTAGE - A resistor-ladder voltage generator circuit is provided, which controls so that k switches among consecutive (k+1) switches out of a plurality of switches connected to the resistor ladder circuit are simultaneously set to an ON state, and which temporally switches the value of k. This allows voltage waveforms having different slopes to be arbitrarily obtained, ranging from a voltage waveform having a small slope to a voltage waveform having a large slope, thereby improving the resolution of a generated voltage waveform without increasing the numbers of resistors and switches, while A/D conversion time is not increased even if the number of bits is increased. In addition, by using this voltage generator circuit as a ramp generator circuit, and by dynamically switching the slope of the ramp wave, acceleration of an image sensor is achieved. | 05-19-2011 |
20110254986 | ANALOG-DIGITAL CONVERTER, IMAGE SENSOR SYSTEM AND CAMERA DEVICE - An analog-digital converter includes n comparators arranged in a first direction with a predetermined cell pitch and corresponding respectively to n input voltages, each comparator comparing a voltage value of a reference signal whose voltage value increases or decreases over time with an input voltage corresponding to the comparator. Each of the n comparators includes differential transistors to which the reference signal and the input voltage are given respectively. A differential transistor is formed by p unit transistors connected in series whose gates are given the reference signal, and another differential transistor is formed by p unit transistors connected in series whose gates are given the input voltage. | 10-20-2011 |
20110317051 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device includes a plurality of pixels, which convert light into signal voltages, and a plurality of analog-digital (AD) converters, which convert the signal voltages into a plurality of digital signals. Each of the plurality of AD converters includes an analog circuit, which receives a same power as a power of the plurality of pixels, and a digital circuit, which receives power having a voltage lower than a voltage of the analog circuit. The solid-state imaging device further includes a controller configured to suspend supplying the same power to the analog circuit, which is included in one of the plurality of AD converters that has finished a conversion. | 12-29-2011 |
20140036124 | RAMP-SIGNAL GENERATOR CIRCUIT, AND IMAGE SENSOR AND IMAGING SYSTEM INCLUDING THE SAME - The ramp-signal generator circuit includes a reference voltage generator that changes the voltage of a reference signal Vr to a comparator setting voltage VR for compensating for a voltage difference between a reference signal Vr and an analog input signal (Vs | 02-06-2014 |
20150163436 | SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS - A solid-state imaging device includes: a pixel unit which includes a plurality of pixels arranged in rows and columns and which generates pixel signals according to an amount of incident light; a column analog-to-digital converter (ADC) which is disposed for each of the columns of the pixel unit and which performs digital conversion on each of the pixel signals output from the pixels in the column; a timing control unit which generates a control signal for controlling the digital conversion performed by the column ADC; and a logic swing and delay adjusting circuit which is disposed in a signal path for supplying the control signal from the timing control unit to the column ADC and which at least either reduces an amplitude of the control signal or delays the control signal. | 06-11-2015 |
20160006966 | IMAGING DEVICE - An imaging device comprising: a pixel array that includes pixels arranged in rows and columns, each of the pixels outputting a pixel signal; vertical signal lines each of which is provided for each of the columns; a reference-signal generator that generates a reset signal corresponding to a reset voltage of the pixels; a signal processor that outputs a differential signal corresponding to a difference between the pixel signal and the reset signal; a first switch that is connected between one of the vertical signal lines and the signal processor, the first switch switching between input and interruption of the pixel signal from each of the pixels to the signal processor; and a second switch that is connected between the reference-signal generator and the signal processor, the second switch switching between input and interruption of the reset signal from the reference-signal generator to the signal processor. | 01-07-2016 |
Patent application number | Description | Published |
20090096319 | SURFACE ACOUSTIC WAVE DEVICE - A surface acoustic wave device includes a base substrate, first and surface acoustic wave filters mounted on a surface of the base substrate, and a sealer provided on the surface of the base substrate and covering the first and second surface acoustic wave filters. The first and second surface acoustic wave filters include first and second piezoelectric substrates. The second piezoelectric substrate is located away from the first piezoelectric substrate via a gap. This surface acoustic wave device reduces inter-modulation. | 04-16-2009 |
20090108960 | Surface Acoustic Wave Resonator, and Surface Acoustic Wave Filter - A surface acoustic wave resonator has piezoelectric substrate ( | 04-30-2009 |
20100219718 | BOUNDARY ACOUSTIC WAVE DEVICE - A boundary acoustic wave device includes a first medium layer made of piezoelectric material, a second medium layer provided on the first medium layer, a third medium layer provided on the second medium layer, and an electrode provided at an interface between the second and third medium layers. The electrode drives the third medium layer to generate a transverse wave. A propagation speed of the transverse wave in the third medium layer is lower than a propagation speed of the transverse wave in the first medium layer. A propagation speed of the transverse wave in the second medium layer is lower than the propagation speed of the transverse wave in the first medium layer. This boundary acoustic wave device has a large electro-mechanical coupling coefficient. | 09-02-2010 |
20120032753 | ANTENNA SHARER - An antenna sharer with both low loss and sharp attenuation characteristic in a wide band is achieved. Antennal sharer | 02-09-2012 |
20120188026 | ANTENNA DUPLEXER - An antenna duplexer includes first and second filters connected to an antenna terminal. The first filter has a passband of a low frequency band. The second filter has a passband of a high frequency band. The second filter is a ladder-type filter including series-arm resonators and parallel-arm resonators. At least one parallel-arm resonator out of the parallel-arm resonators has a main resonance and an auxiliary resonance. Attenuation poles caused by the main resonance and the auxiliary resonance are within the low frequency band. This antenna duplexer has a high attenuation characteristic and a high isolation characteristic while maintaining a low insertion loss. | 07-26-2012 |
20130141189 | ELASTIC WAVE APPARATUS - An elastic wave device includes a first unbalanced terminal, a second unbalanced terminal, a first balanced terminal, a second balanced terminal, a first filter part, and a second filter part. A phase of an electric signal transmitted from first unbalanced terminal to the first balanced terminal in the first filter part is different from a phase of an electric signal transmitted from the second unbalanced terminal to the first balanced terminal in the second filter part. A phase of an electric signal transmitted from the first unbalanced terminal to the second balanced terminal in the first filter part is different from a phase of an electric signal transmitted from the second unbalanced terminal to the second balanced terminal in the second filter part. | 06-06-2013 |
20140049341 | MULTIMODE ELASTIC WAVE DEVICE - A multimode elastic wave device includes a pair of reflectors, and a first interdigital transducer (IDT) electrode through a fifth IDT electrode arranged between the pair of reflectors. In this configuration, each of the average of electrode-finger pitches in the first IDT electrode and the average of electrode-finger pitches in the fifth IDT electrode is smaller than both of the average of electrode-finger pitches in the second IDT electrode and the average of electrode-finger pitches in the fourth IDT electrode. | 02-20-2014 |
20140070906 | ELASTIC WAVE DEVICE - An elastic wave device includes a piezoelectric substrate, a pair of reflectors disposed on the piezoelectric substrate along the propagation direction of an elastic wave, and first to fifth comb electrode pairs disposed in this order between the pair of reflectors. Ground comb electrodes of adjacent comb electrode pairs are connected by an even number of connection electrode fingers or by an odd number of connection electrode fingers. | 03-13-2014 |
20140113571 | ELECTRONIC DEVICE INCLUDING FILTER - An electronic device includes a main circuit connected between an input terminal and an output terminal, and an auxiliary circuit connected in parallel to the main circuit between the input terminal and the output terminal. The main circuit includes a filter having a first passband and a stopband. The auxiliary circuit has a passing characteristic that allows a signal having a frequency in a certain frequency band inside the stopband to pass through the auxiliary circuit. The main circuit is configured to output a main signal in response to an input signal. The auxiliary circuit is configured to output an auxiliary signal in response to the input signal. The main signal and the auxiliary signal contain phase components opposite to each other in the certain frequency band inside the stopband. This electronic device has an attenuation amount in the stopband. | 04-24-2014 |
20140144237 | ELASTIC WAVE SENSOR - An acoustic wave sensor includes a piezoelectric substrate, a transmitting electrode configured to excite a main acoustic wave propagating through a propagation region of an upper surface of the piezoelectric substrate, a receiving electrode configured to receive the propagated main acoustic wave, a first insulating film provided on the propagation region of the upper surface of the piezoelectric substrate, a second insulating film provided on the upper surface of the piezoelectric substrate to cover the first insulating film, and a reaction section provided on the upper surface of the second insulating film above the propagation region. The reaction section is configured to react with an object. A velocity of a transverse wave propagating through the first insulating film is higher than a velocity of a transverse wave propagating through the second insulating film. The acoustic wave sensor described above has high detection sensitivity. | 05-29-2014 |
20140285287 | ACOUSTIC WAVE DEVICE - An acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the piezoelectric substrate, a first dielectric film covering the upper surface of the piezoelectric substrate to cover the IDT electrode, and a second dielectric film covering an upper surface of the first dielectric film. The second dielectric film includes a thin portion positioned in a tip region of electrode fingers of the IDT electrode and a thick portion which is positioned in a middle region of the IDT electrode and is thicker than the thin portion. The acoustic wave device suppresses spurious emission and has superior passband characteristics. | 09-25-2014 |
20150270473 | ELECTRONIC COMPONENT - An electronic component includes a substrate a functional section provided on the substrate, and a sealing body which is provided on the substrate and seals the functional section. In a temperature region having a lowest temperature that is at least as high as the glass transition temperature of the sealing body, the coefficient of linear expansion of the sealing body is greater than the coefficient of linear expansion of the substrate. In a temperature region having a highest temperature that is lower than the glass transition temperature of the sealing body, the coefficient of linear expansion of the sealing body is less than the coefficient of linear expansion of the substrate. The electronic component exhibits superior reliability even upon prolonged use. | 09-24-2015 |
Patent application number | Description | Published |
20140239445 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device has a resistor area and wiring area selectively disposed on a semiconductor substrate. In this semiconductor device, a second interlayer insulating film is formed above the semiconductor substrate, and a thin-film resistor is disposed on the second interlayer insulating film in the resistor area. Vias that contact the thin-film resistor from below are formed in the second interlayer insulating film. A wiring line is disposed on the second interlayer insulating film in the wiring area. A dummy wiring line that covers the thin-film resistor from above is disposed in a third wiring layer that is in the same layer as the wiring line, and an insulating film is interposed between the thin-film resistor and the dummy wiring line. | 08-28-2014 |
20150348900 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device has a resistor area and wiring area selectively disposed on a semiconductor substrate. In this semiconductor device, a second interlayer insulating film is formed above the semiconductor substrate, and a thin-film resistor is disposed on the second interlayer insulating film in the resistor area. Vias that contact the thin-film resistor from below are formed in the second interlayer insulating film. A wiring line is disposed on the second interlayer insulating film in the wiring area. A dummy wiring line that covers the thin-film resistor from above is disposed in a third wiring layer that is in the same layer as the wiring line, and an insulating film is interposed between the thin-film resistor and the dummy wiring line. | 12-03-2015 |
20160111365 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device has a resistor area and wiring area selectively disposed on a semiconductor substrate. In this semiconductor device, a second interlayer insulating film is formed above the semiconductor substrate, and a thin-film resistor is disposed on the second interlayer insulating film in the resistor area. Vias that contact the thin-film resistor from below are formed in the second interlayer insulating film. A wiring line is disposed on the second interlayer insulating film in the wiring area. A dummy wiring line that covers the thin-film resistor from above is disposed in a third wiring layer that is in the same layer as the wiring line, and an insulating film is interposed between the thin-film resistor and the dummy wiring line. | 04-21-2016 |
Patent application number | Description | Published |
20090209346 | METHOD AND APPARATUS FOR SIMULATING GAMES INVOLVING A BALL - A sports video game having a new and improved user interface that substantially increases the potential realism of the game uses a handheld controller that is able to sense its own position, orientation and/or motion and is affixed to a ball. The ball can be a model of a football that is provided with a depression that snugly accepts and retains the handheld controller. The handheld controller may sense motion, position and/or orientation of the ball and provide wireless inputs to a video game system. The video game system may process such inputs to provide a simulated sports action game play on a video display. | 08-20-2009 |
20110010884 | LENS CLEANER - A lens cleaner ( | 01-20-2011 |
20140140032 | HAND-HELD ELECTRONIC DEVICE AND BATTERY UNIT - A non-limiting example hand-held electronic device includes a battery accommodating portion provided with an attaching portion which is formed in a rectangular shape in plain by longer first sides and shorter second sides, and formed with concave portions at corresponding positions on the first sides. A first battery unit is attached to the attaching portion by fitting first ends which form shorter sides of the first battery unit into the concave portions. When a second battery unit is to be attached to the same attaching portion, a second battery unit is attached within the first sides and the second sides without using the concave portions. | 05-22-2014 |
20140141652 | HAND-HELD ELECTRONIC DEVICE, BATTERY WITH CONNECTOR, BATTERY LID, CONNECTOR AND CONNECTOR DISCONNECTION PREVENTING METHOD - A non-limiting example electronic device includes a battery accommodating portion in which a battery unit is accommodated. A male connector is provided on wires drawn-out from a main unit of the battery unit, and the male connector is inserted (connected) to a female connector which is fixed on a circuit board provided within a housing, and a battery lid is attached to the housing. The battery lid is provided with a projection on a surface which is rendered as an inner surface side when the battery lid is attached, and the projection prevents a connection state of the male connector and the female connector from being disconnected. That is, the projection restrains a movement of the male connector in a direction that the male connector comes out. | 05-22-2014 |
Patent application number | Description | Published |
20100003657 | MEDICAL TRAINING APPARATUS - A medical training apparatus comprising an instrument holder with a medical instrument, a model patient body simulating a patient subject to medical treatment or examination, and an examination table on which the model patient body is placed. The medical training apparatus comprises a posture detection means for detecting the posture of the examination table, a medical instrument status detection means for detecting the working status of the medical instrument, an examination receiving status detection means for detecting the situation of the model patient body in medical treatment or examination, and a model patient body driving means housed in the model patient body. The model patient body driving means changes the facial or body expression of the model patient body, depending on combination of at least one of the posture detection signal output from the posture detection means and the medical instrument status detection signal output from the medical instrument status detection means, and the examination receiving status detection signal output from the examination receiving status detection means. | 01-07-2010 |
20130289548 | LASER IRRADIATION TIP, LASER IRRADIATION HANDPIECE, LASER TREATMENT APPARATUS, AND LASER IRRADIATION TIP END MEMBER - A laser irradiation tip has a main body and a tip end portion. The main body is connected with a handpiece and irradiating therapeutic laser with high absorbability in water. The tip end portion being connected with the main body. The main body of the laser irradiation tip has an optical fiber for guiding the therapeutic laser, a water flow path, and an air flow path in a parallel manner. The tip end portion of the laser irradiation tip has a connection portion with the main body, a water guide path communicated with the water flow path of the main body, an air guide path communicated with the air flow path of the main body, a fiber guide portion capable of inserting a tip side portion of the optical fiber, and a mixing chamber of water and air. | 10-31-2013 |
20130330686 | DENTAL OPTICAL MEASURING DEVICE AND DENTAL OPTICAL MEASURING/DIAGNOSING TOOL - An OCT measuring mechanism for acquiring the optical coherence tomography information and a surface shape measuring mechanism for acquiring the three-dimensional shape information share a display device, a control device, a light source, a scanning mirror, a light transmission/receiving path and an entering/exiting opening. The scanning mirror, the light transmission/receiving path, the entering/exiting opening are included in a handpiece operable to make a diagnosis on a diagnostic target site. | 12-12-2013 |
Patent application number | Description | Published |
20130224069 | NICKEL-BASED HYDROCHLORIC ACID CORROSION RESISTANT ALLOY FOR BRAZING - Provided is a hydrochloric acid corrosion resistant alloy For brazing that is provided with corrosion resistance against hydrochloric acid, and when brazing various types of stainless steel, can be used for brazing at practical temperatures (1150° C. or less), and has good joint strength and brazeability to the substrate. The hydrochloric acid corrosion resistant alloy of the present invention contains, in mass percent, 6.0-18.0% Mo, 10.0-25.0% Cr, 0.5-5.0% Si, and 4.5-8.0% P, with the remainder being 40.0-73.0% Ni and unavoidable impurities, and the total of Si and P being 6.5-10.5%. In this case, the alloy may contain 12.0% or less of Cu, 20.0% or less of Co, 15.0% or less of Fe, 8.0% or less of W, 5.0% or less of Mn, and 0.5% or less of the total of C, B, Al, Ti, and Nb. | 08-29-2013 |
20130306019 | HIGH-TOUGHNESS COBALT-BASED ALLOY AND ENGINE VALVE COATED WITH SAME - A surface hardening material being excellent in impact resistance and having abrasion resistance is provided. Provided are: a high-toughness cobalt-based alloy containing 25.0 to 40.0 mass % of Cr, 0.5 to 12.0 mass % of a sum of W and/or Mo, 0.8 to 5.5 mass % of Si, and 0.5 to 2.5 mass % of B, 8.0 mass % or less of each of Fe, Ni, Mn, and Cu, and 0.3 mass % or less of C, the sum amount of Fe, Ni, Mn, and C being 10.0 mass % or less, and the remainder comprising 48.0 to 68.0 mass % of Co and unavoidable impurities; and an engine valve coated with the same. | 11-21-2013 |
Patent application number | Description | Published |
20100014232 | Housing Case, Method for Manufacturing Housing Case, and Glass Insert Molding Die Used in Same - A housing case for a small electric device and communication device includes a flat plate having a dimension substantially the same as that of the front portion of the housing case and comprising at least a glass plate, and a resin frame integrated with the flat plate to support the backside periphery of the flat plate. | 01-21-2010 |
20100159183 | Insert Molding Laminate and Manufacturing Method Thereof, and Insert Molding and Manufacturing Method Thereof - The invention provides an insert molding laminate providing excellent transparency to a transparent window portion and excellent adhesiveness to both a capacitance-type touch sensor and an injection-molded resin portion, and a manufacturing method thereof, and an insert molding and a manufacturing method thereof. The insert molding laminate comprises a glass substrate, a heat-resisting adhesive layer having a frame shape and formed on peripheral portions of one surface of the glass substrate, a transparent pressure-sensitive adhesive layer formed on an inner side portion of the one surface of the glass substrate and shaped to partially overlap the heat-resisting adhesive layer in a thickness direction of the glass substrate, and a capacitance-type touch sensor laminated on the transparent pressure-sensitive adhesive layer and having a configuration smaller than an outer configuration of the glass substrate. | 06-24-2010 |
20100201649 | Protection Panel with Touch Input Function and Method for Manufacturing the Same - A protection panel with a touch input function and a method for manufacturing the same are disclosed in which a thickness of a protection panel is reduced by using a glass plate as a rear substrate, and at the same time, a risk of generating crack or fracture in the rear substrate is suppressed, when a conductive pin is press-fitted into a through hole of the rear substrate. | 08-12-2010 |
20120026419 | APPARATUS CONCEALING MEMBER, APPARATUS USING THE SAME, AND METHOD FOR CONCEALING PORTION TO BE CONCEALED OF APPARATUS - An apparatus concealing member capable of augmenting the concealing ability of a functional liquid crystal film and also realizing a necessary concealing ability for designs of various types of products without inducing radio-wave disturbances and the like. In an apparatus concealing member according to the present invention, a film-type information input device is placed under a film-type transparent base member, a functional liquid crystal film is placed under the information input device at a position where the functional liquid crystal film covers a portion to be concealed of an apparatus and can be electrically changed over between being transparent and being non-transparent, and a non-metal and film-type glossy layer is placed under the functional liquid crystal film and exhibits transparency and a gloss due to reflection. | 02-02-2012 |
20150217541 | MULTI-LAYER FILM, DECORATIVE MOLDING FILM AND MOLDED BODY - A multi-layer film having excellent surface hardness and transparency, a small heat shrinkage factor and such high brittleness that it is easily trimmed after decorative molding. | 08-06-2015 |