Patent application number | Description | Published |
20090257644 | METHOD AND SYSTEM FOR EVALUATING AN OBJECT - A method, system aid a computer program product for evaluating a object; the method includes: (i) obtaining an image of an area of the object; wherein the area comprises multiple arrays of repetitive structural elements that are at least partially surrounded by at least one group of non-repetitive regions; wherein non-repetitive regions that belong to a single group of non-repetitive regions are ideally identical to each other; wherein the non-repetitive regions are arranged in a repetitive manner; and (ii) providing an evaluation result in response to a comparison between image information of a first sub-area to image information of a second sub-area that is proximate to the first sub-area; wherein the first sub-area comprises a first array of repetitive structural elements and a first non-repetitive region; wherein the second sub-area comprises a second array of repetitive structural elements and a second non-repetitive region. | 10-15-2009 |
20120308113 | METHOD AND SYSTEM FOR EVALUATING AN OBJECT - A method, system and a computer program product for evaluating a object; the method includes: (i) obtaining an image of an area of the object; wherein the area comprises multiple arrays of repetitive structural elements that are at least partially surrounded by at least one group of non-repetitive regions; wherein non-repetitive regions that belong to a single group of non-repetitive regions are ideally identical to each other; wherein the non-repetitive regions are arranged in a repetitive manner; and | 12-06-2012 |
20130202187 | SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR CAD-BASED REGISTRATION - A system for location based wafer analysis, the system comprising: (i) a first input interface; (ii) a second input interface; (iii) a correlator; and (iv) a processor, configured to generate inspection results for the inspected wafer, with the help of at least one frame run-time displacement. | 08-08-2013 |
20130204569 | SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR CAD-BASED REGISTRATION - A system for generating calibration information usable for wafer inspection, the system including: (I) a displacement analysis module, configured to: (a) calculate a displacement for each target out of multiple targets selected in multiple scanned frames which are included in a scanned area of the wafer, the calculating based on a correlation of: (i) an image associated with the respective target which was obtained during a scanning of the wafer, and (ii) design data corresponding to the image; and (b) determining a displacement for each of the multiple scanned frames, the determining based on the displacements calculated for multiple targets in the respective scanned frame; and (II) a subsequent processing module, configured to generate calibration information including the displacements determined for the multiple scanned frames, and a target database that includes target image and location information of each target of a group of database targets. | 08-08-2013 |
20150028203 | INSPECTION OF A LITHOGRAPHIC MASK THAT IS PROTECTED BY A PELLICLE - A system and a method for evaluating a lithography mask, the system may include: (a) electron optics for directing primary electrons towards a pellicle that is positioned between the electron optics and the lithography mask; wherein the primary electrons exhibit an energy level that allows the primary electrons to pass through the pellicle and to impinge on the lithographic mask; (b) at least one detector for detecting detected emitted electrons and for generating detection signals; wherein detected emitted electrons are generated as a result of an impingement of the primary electrons on the lithographic mask; and (c) a processor for processing the detection signals to provide information about the lithography mask | 01-29-2015 |
20150093014 | SYSTEM, A METHOD AND A COMPUTER PROGRAM PRODUCT FOR CAD-BASED REGISTRATION - A system for location based wafer analysis, the system comprising: (i) a first input interface; (ii) a second input interface; (iii) a correlator; and (iv) a processor, configured to generate inspection results for the inspected wafer, with the help of at least one frame run-time displacement. | 04-02-2015 |
20150278597 | SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR DEFECT DETECTION BASED ON MULTIPLE REFERENCES - A system including an interface for receiving inspection image data of an inspection image of an inspection object. The inspection image data includes information of an analyzed pixel of the inspected image and of reference pixels of the inspected image. The system further includes a memory and a processor device operatively coupled to the interface and the memory to obtain an inspected value representative of the analyzed pixel of the inspected image, and a reference value for each of the reference pixels of the inspected image. For each reference pixel, the processor devices calculates a difference between the reference value of a respective reference pixel and the inspected value of the analyzed pixel, computes a representative difference value based on the differences and determines a presence of a defect in the analyzed pixel based on the representative difference value. | 10-01-2015 |
20150287178 | METHOD, SYSTEM, AND COMPUTER PROGRAM PRODUCT FOR DETECTION OF DEFECTS BASED ON MULTIPLE REFERENCES - A system includes a memory and a processor device operatively coupled to the memory to obtain an inspected noise-indicative value representative of an analyzed pixel of an inspected image of an inspected object, and a reference noise-indicative value representative for each of multiple reference pixels of the inspected image. The processor device computes a representative noise-indicative value based on the inspected noise-indicative value and multiple reference noise-indicative values, calculates a defect-indicative value based on an inspected value representative of the analyzed pixel and determines a presence of a defect in the analyzed pixel based on the representative noise-indicative value and the defect-indicative value. | 10-08-2015 |