Myeong-Woo
Myeong Woo Han, Suwon Gyeonggi-Do KR
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20130207869 | SIDE-FACE RADIATION ANTENNA AND WIRELESS COMMUNICATION MODULE - Disclosed herein are a side-face radiation antenna and a wireless communication module. According to an embodiment of the present invention, there is provided the side-face radiation antenna including a via patch part formed at a side portion of a module substrate including laminated substrates to perform a side-face radiation, and formed by metal filled in a plurality of vias arranged at a predetermined interval in the side portion and connected, and a feed line part inserted between intermediate layers of the module substrate, and connected to the via at a center portion of the via patch part. In addition, there is provided the wireless communication module including the side-face radiation antenna. | 08-15-2013 |
Myeong Woo Han, Suwon-Si KR
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20150042405 | POWER DETECTION CIRCUIT AND RF SIGNAL AMPLIFICATION CIRCUIT HAVING THE SAME - The present invention relates to a power detection circuit and an RF signal amplification circuit having the same. According to an embodiment of the present invention, a power detection circuit including a coupling unit adjacent to an RF matching inductor to extract induced power; a rectification unit for rectifying the signal output from the coupling unit to output the rectified signal; a slope adjustment unit connected between an output terminal of the rectification unit and a ground and adjusting a voltage slope for power detection by changing the output signal of the output terminal of the rectification unit according to changes in internal impedance; and a smoothing unit for receiving the output signal of the output terminal of the rectification unit to smooth the received signal into a DC voltage for power detection using the voltage slope is provided. Further, an RF signal amplification circuit having the same is provided. | 02-12-2015 |
20150187676 | ELECTRONIC COMPONENT MODULE - An electronic component module may include a substrate configured to have a cavity formed therein, and an electronic component embedded in the cavity while being attached to one surface of the heat radiating plate. The electronic component module may significantly decrease effects of element interference and electromagnetic wave interference between electronic components by forming a wiring pattern above a cavity. | 07-02-2015 |
Myeong Woo Han, Hwaseong-Si KR
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20160126200 | SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED ANTENNA FOR WIRELESS APPLICATIONS - A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon: a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip. | 05-05-2016 |
Myeong-Woo Kim, Gyoungsangbuk-Do KR
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20110308070 | IMAGE APPARATUS PRODUCTION SYSTEM, IMAGE APPARATUS INSPECTION SYSTEM, AND IMAGE APPARATUS INSPECTION METHOD - Provided are an imaging device production system, an imaging device inspection system, and an imaging device inspection method. The imaging device production system includes a assembling process for assembling each components constituting an imaging device, an inspection process in which the imaging device assembled in he assembling process is continuously transferred without being stopped except for emergency when two inspection tasks adjacent to and different from each other are performed, and a packaging for packaging the imaging device which passes through the inspection tasks to confirm quality of the imaging device. | 12-22-2011 |
Myeong-Woo Kim, Seoul KR
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20120012176 | SOLAR CELL AND METHOD OF MANUFACTURING THE SAME - A solar cell includes a substrate, a doped pattern, a contact layer, and an electrode. The substrate includes a first surface onto which sunlight is incident and a second surface facing the first surface. The doped pattern is formed on the second surface of the substrate and the contact layer is formed on the doped pattern. The electrode is formed on the contact layer and is electrically connected to the doped pattern. Accordingly, a contact resistance between the substrate and the electrode may be decreased, so that the doped pattern and the electrode may be uniformly formed and a power efficiency of the solar cell may be improved. | 01-19-2012 |
Myeong-Woo Kim, Yongin-Si KR
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20120107997 | METHOD OF MANUFACTURING SOLAR CELL - In a method of manufacturing a solar cell, a first dopant layer is formed on a lower surface of a substrate and a diffusion-preventing layer is formed on an upper surface of the substrate. Then, the first dopant layer is patterned to expose portions of the lower surface of the substrate, and a second dopant layer is formed on the exposed portion of the lower surface of the substrate. A third dopant layer is formed on the diffusion-preventing layer, and the substrate is heated to diffuse dopants from the first, second, and third dopant layers into the substrate, thereby forming semiconductor areas in the substrate. | 05-03-2012 |
20120295391 | METHOD OF MANUFACTURING A SOLAR CELL - A method of manufacturing a solar cell includes preparing a base substrate having a first conductive type; diffusing an impurity having a second conductive type (opposite the first conductive type) into the base substrate to form an emitter layer having a first impurity concentration on the base substrate and a by-product layer on the emitter layer; irradiating a laser beam onto the emitter layer corresponding to a first region of the base substrate to form a front contact portion having a second impurity concentration higher than the first impurity concentration; irradiating the laser beam onto the by-product layer to remove the by-product layer corresponding to the first region; removing the by-product layer from an area outside of the first region; forming an anti-reflection layer on the base substrate; forming a front electrode on the anti-reflection layer corresponding to the first region; and forming a back electrode on the base substrate. | 11-22-2012 |