Patent application number | Description | Published |
20120268230 | MULTILAYER TYPE POWER INDUCTOR - Disclosed herein is a multilayer type power inductor including: a plurality of body layers including internal electrodes and having magnetic material layers stacked therein; and a plurality of gap layers, wherein the gap layer has an asymmetrical structure. In the multilayer type power inductor, portions that are in contact with the body layers have, a non-porous structure, which is a dense structure, and portions that are not in contact with the body layers have a porous structure, such that the gap layer has the asymmetrical structure. Therefore, a magnetic flux propagation path in a coil is dispersed to suppress magnetization at a high current, thereby making it possible to improve a change in inductance (L) value according to the application of current. | 10-25-2012 |
20130002389 | GAP COMPOSITION OF MULTI LAYERED POWER INDUCTOR AND MULTI LAYERED POWER INDUCTOR INCLUDING GAP LAYER USING THE SAME - Disclosed are a multilayered power inductor, including: a body in which a plurality of magnetic layers formed with inner electrodes are stacked; and a plurality of gap layers, wherein the plurality of gap layers are formed so as not to contact external electrodes formed at both sides of the body, and a gap composition of the multilayered power inductor.
| 01-03-2013 |
20130027168 | MULTILAYER INDUCTOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a multilayer power inductor and a method of manufacturing the same. The multilayer power inductor includes a multilayer body formed by multi-layering a plurality of body sheets; a coil portion including internal electrode patterns that are respectively formed on the plurality of body sheets; and external electrodes that are disposed on lateral surfaces of the multilayer body and are electrically connected to both ends of the coil portion, wherein a space portion is formed in the internal electrode pattern to correspond to contraction of the plurality of body sheet. The multilayer power inductor relieves internal stress generated in a product through the space portion so as to prevent the body sheet from being magnetized due to the internal stress, thereby preventing a reduction in inductance. The multilayer inductor may also be manufactured by using conventional manufacturing processes themselves without any influence on the productivity of a product. | 01-31-2013 |
20130033354 | FERRITE POWDER OF METAL, FERRITE MATERIAL COMPRISING THE SAME, AND MULTILAYERED CHIP COMPONENTS COMPRISING FERRITE LAYER USING THE FERRITE MATERIAL - Disclosed herein are a ferrite powder having a core-shell structure, the core being made of iron (Fe) or iron-based compounds comprising iron (Fe) and the shell being made of metal oxides, a ferrite material comprising the ferrite powder and the glass, and multilayered chip components including the ferrite layer using the ferrite material, inner electrodes, and outer electrodes. According to the exemplary embodiments of the present invention, it is possible to provide the ferrite material capable of improving the change in the inductance L value in response to applied current by suppressing magnetization at high current. The multilayered chip components including the ferrite material according to the exemplary embodiment of the present invention can also be used in a band of MHz. | 02-07-2013 |
20130062553 | NICKEL-ZINC-COPPER BASED FERRITE COMPOSITION, AND MULTILAYERED CHIP DEVICE USING THE SAME - Disclosed herein are a nickel-zinc-copper (NiZnCu) based ferrite composition containing 0.001 to 0.3 parts by weight of bivalent metal, 0.001 to 0.3 parts by weight of trivalent metal, and 0.001 to 0.5 parts by weight of tetravalent metal based on 100 parts by weight of main component containing 47.0 to 50.0 mol % of Fe | 03-14-2013 |
Patent application number | Description | Published |
20130069752 | LAMINATED INDUCTOR - There is provided a laminated inductor including: a body in which a plurality of magnetic layers are stacked; at least one non-magnetic layers interposed between the magnetic layers and including a Al | 03-21-2013 |
20130249645 | NON-MAGNETIC COMPOSITION FOR CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECTRONIC COMPONENT USING THE SAME, AND METHOD OF MANUFACTURING THE SAME - There are provided a non-magnetic composition for a ceramic electronic component, a ceramic electronic component using the same, and a method of manufacturing the same. The non-magnetic composition includes a compound represented by Chemical Formula Zn | 09-26-2013 |
20130321118 | NON-MAGNETIC COMPOSITION FOR MULTILAYER ELECTRONIC COMPONENT, MULTILAYER ELECTRONIC COMPONENT MANUFACTURED BY USING THE SAME AND MANUFACTURING METHOD THEREOF - There are provided a non-magnetic composition for a ceramic electronic component, a ceramic electronic component manufactured by using the same, and a manufacturing method thereof. The non-magnetic composition for a ceramic electronic component includes a compound represented by ZnCuTiO | 12-05-2013 |
20150022308 | MAGNETIC MATERIAL, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT INCLUDING THE SAME - There is provided a magnetic material including a plurality of composite magnetic particles including oxide layers formed on surfaces thereof, and a ferrite present between the plurality of composite magnetic particles. | 01-22-2015 |
Patent application number | Description | Published |
20130214889 | MULTILAYER TYPE INDUCTOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a multilayer type inductor and a method of manufacturing the same. The multilayer type inductor includes a multilayer body in which a plurality of sheets having internal electrodes formed thereon are bonded to each other, and each of the internal electrodes is connected to each other through a via to form a coil; and a pair of external electrode terminals each formed at the both ends of the multilayer body and connected to one ends of the internal electrodes at the uppermost layer and the lowermost layer, wherein in the plurality of the sheets configuring the multilayer body, a first sheet and a second sheet made of different materials are alternately multi-layered, thereby increasing reliability and productivity of the product. | 08-22-2013 |
20140239219 | FERRITE POWDER OF METAL, FERRITE MATERIAL COMPRISING THE SAME, AND MULTILAYERED CHIP COMPONENTS COMPRISING FERRITE LAYER USING THE FERRITE MATERIAL - Disclosed herein are a ferrite powder having a core-shell structure, the core being made of iron (Fe) or iron-based compounds comprising iron (Fe) and the shell being made of metal oxides, a ferrite material comprising the ferrite powder and the glass, and multilayered chip components including the ferrite layer using the ferrite material, inner electrodes, and outer electrodes. According to the exemplary embodiments of the present invention, it is possible to provide the ferrite material capable of improving the change in the inductance L value in response to applied current by suppressing magnetization at high current. The multilayered chip components including the ferrite material according to the exemplary embodiment of the present invention can also be used in a band of MHz. | 08-28-2014 |
20140240078 | FERRITE POWDER OF METAL, FERRITE MATERIAL COMPRISING THE SAME, AND MULTILAYERED CHIP COMPONENTS COMPRISING FERRITE LAYER USING THE FERRITE MATERIAL - Disclosed herein are a ferrite powder having a core-shell structure, the core being made of iron (Fe) or iron-based compounds comprising iron (Fe) and the shell being made of metal oxides, a ferrite material comprising the ferrite powder and the glass, and multilayered chip components including the ferrite layer using the ferrite material, inner electrodes, and outer electrodes. According to the exemplary embodiments of the present invention, it is possible to provide the ferrite material capable of improving the change in the inductance L value in response to applied current by suppressing magnetization at high current. The multilayered chip components including the ferrite material according to the exemplary embodiment of the present invention can also be used in a band of MHz. | 08-28-2014 |