Mineshita
Kentaro Mineshita, Kyoto JP
Patent application number | Description | Published |
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20110127569 | LED MODULE - An LED module A | 06-02-2011 |
20130161668 | SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR PRODUCING SAME, AND DISPLAY DEVICE - A semiconductor light-emitting device ( | 06-27-2013 |
20140145223 | SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING GaAs SUBSTRATE - A semiconductor light emitting device including: a substrate made of GaAs; and a semiconductor layer formed on the substrate, in which part of the substrate on a side opposite to the semiconductor layer is removed by etching so that the semiconductor light emitting device has a thickness of not more than 60 μm. | 05-29-2014 |
Kentaro Mineshita, Kyoto-Shi JP
Patent application number | Description | Published |
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20130299860 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes a substrate, an LED chip mounted on the substrate, and a resin package covering the LED chip. The substrate includes a base and a wiring pattern formed on the base. The resin package includes a lens. The base includes an upper surface, a lower surface and a side surface extending between the upper surface and the lower surface. The LED chip is mounted on the upper surface of the base. The side surface of the base is oriented in a lateral direction. The wiring pattern includes a pair of first mount portions and a pair of second mount portions. The paired first mount portions are formed on the lower surface of the base. The paired second mount portions are oriented in the lateral direction and offset from the side surface of the base in the lateral direction. | 11-14-2013 |
20150034993 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes a substrate, an LED chip mounted on the substrate, and a resin package covering the LED chip. The substrate includes a base and a wiring pattern formed on the base. The resin package includes a lens. The base includes an upper surface, a lower surface and a side surface extending between the upper surface and the lower surface. The LED chip is mounted on the upper surface of the base. The side surface of the base is oriented in a lateral direction. The wiring pattern includes a pair of first mount portions and a pair of second mount portions. The paired first mount portions are formed on the lower surface of the base. The paired second mount portions are oriented in the lateral direction and offset from the side surface of the base in the lateral direction. | 02-05-2015 |
Satoshi Mineshita, Tokyo JP
Patent application number | Description | Published |
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20130050522 | VIDEO IMAGE PROVIDING APPARATUS, VIDEO IMAGE UTILIZING APPARATUS, VIDEO IMAGE PROVIDING SYSTEM, VIDEO IMAGE PROVIDING METHOD AND RECORDING MEDIUM - The present invention has been made for purpose of providing a video image providing apparatus which can provide a variety of users with a video image captured by a surveillance camera or the like, while paying careful attention to privacy information included in the video image. | 02-28-2013 |
Takashi Mineshita, Tokyo JP
Patent application number | Description | Published |
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20140112344 | COMMUNICATION SYSTEM, CONTROLLER, SWITCH, STORAGE MANAGING APPARATUS AND COMMUNICATION METHOD - A communication system includes a server apparatus having an iSCSI initiator, a storage having an iSCSI target, a storage managing apparatus, an open flow controller and open flow switches. The storage managing apparatus stores route data of an iSCSI communication packet for every management ID determined based on an iSCSI initiator name and an iSCSI target name. The server apparatus transmits the iSCSI communication packet in which a management ID is stored in a destination port number. The open flow switch transfers the packet according to the entry. The open flow controller generates and distributes the entry to transfer the iSCSI communication packet to the open flow switch. A communication method is provided in which the flow control is carried out based on the iSCSI data without imposing a high load of the packet processing in the open flow switch by the communication system having the above-mentioned configuration. | 04-24-2014 |