Patent application number | Description | Published |
20080239007 | PRINT HEAD - The present invention provides a print head that allows the characteristics of ejected ink to be adjusted for each ejection port in spite of a variation in the distance from an ink supply port to the heating element. In the print head according to the present invention, the area of the heating element decreases with increasing distance from the ink supply port and increases with decreasing distance from the ink supply port. The heating element is shaped like a rectangle that is longer in a direction orthogonal to a direction in which the plurality of ejection ports are arranged than in the direction in which the plurality of ejection ports are arranged. The aspect ratio of the heating element depends on the length of an ink channel through which ink is introduced into the bubbling chamber. | 10-02-2008 |
20080239011 | INK JET RECORDING HEAD AND LIQUID JETTING METHOD - A liquid recording head includes thermal energy generating means, having a flat plate configuration, for generating a bubble by thermal energy; a pressure chamber in which said thermal energy generating means is provided; a flow path for introducing liquid into said pressure chamber; a supply port in fluid communication with said flow path; and an ejection outlet provided at a position opposing said thermal energy generating means in fluid communication with said pressure chamber, wherein said thermal energy generating means includes a first major surface facing said ejection outlet and a second major surface opposite said first major surface, and wherein a distance between said first major surface and ceiling surface of said pressure chamber in which said ejection outlet is formed is shorter than a distance between said second major surface and a bottom surface of said pressure chamber. | 10-02-2008 |
20090015635 | INK JET RECORDING METHOD - A method for discharging liquid from a recording head including a first discharge port configured to discharge a liquid, a second discharge port configured to discharge a liquid, an amount of which is smaller than an amount of the liquid discharged from the first discharge port, and a substrate including a first heating element corresponding to the first discharge port, a second heating element corresponding to the second discharge port and the liquid supply port, wherein a distance between the liquid supply port and the second heating element is longer than a distance between the liquid supply port and the first heating element, and wherein discharge of the liquid from the first discharge port is performed by a discharge method in which a bubble formed by the first heating element communicates with atmosphere and an amount of the liquid discharged from the second discharge port is less than 2 pico liters. | 01-15-2009 |
20090058933 | INK JET PRINT HEAD - An object of the present invention is to provide an ink jet print head having plural types of nozzles arranged on the same substrate and through which ink droplets of different sizes are ejected, the ink jet print head exhibiting acceptable ejection performance regardless of the type of the nozzle. Thus, according to the present invention, each of the plural types of nozzles includes a bubbling chamber having an ejection energy generating element allowing an ink droplet to be ejected to a position located opposite an ejection port and an ejection port portion allowing the ejection port and the bubbling chamber to communicate with each other. Ratio of opening area of the ejection port portion at a position where the ejection port portion and the bubbling chamber communicate with each other, to the opening area of the ejection port is higher for the nozzle with a smaller ejection amount. | 03-05-2009 |
20090058948 | LIQUID EJECTION HEAD AND RECORDING APPARATUS - A liquid ejection head includes a plurality of ejection outlets for ejecting a liquid droplet; a plurality of flow paths communicating with the ejection outlets; an ink supply port for supplying liquid to the flow paths; and a plurality of heat generating elements provided correspondingly to the ejection outlets, for generating thermal energy for ejecting liquid present inside the flow paths. The plurality of heat generating elements is arranged in a staggered fashion with predetermined intervals with respect to a direction of a long side of the ink supply port. Adjacent staggered ones of the heat generating elements are connected to a common wiring line and are connected to individual wiring lines. | 03-05-2009 |
20090066752 | LIQUID JET HEAD - A liquid ejecting head includes a plurality of nozzles each including an ejection outlet for ejecting a droplet, an ejection energy generating element, disposed at a position opposing the ejection outlet, for generating energy for ejecting a droplet, a pressure chamber provided with the ejection energy generating element and fluidly communicating with the ejection outlet, and a supply passage for supplying the liquid to the pressure chamber, wherein the nozzles include a first nozzle and a second nozzle which are connected with respective ones of the supply passages having lengths different from each other, wherein the first nozzle and the second nozzle are, disposed at one end portion with respect to a widthwise direction of an elongated supply chamber for supplying the liquid to the first nozzle, wherein the supply passage for the first nozzle extends in a direction perpendicular to a direction of liquid ejection from the ejection outlet and fluidly communicates with the supply chamber, and wherein the supply passage for the first nozzle extends in a direction parallel with the direction of liquid ejection. | 03-12-2009 |
20100188465 | INK JET PRINT HEAD - An object of the present invention is to provide an ink jet print head having plural types of nozzles arranged on the same substrate and through which ink droplets of different sizes are ejected, the ink jet print head exhibiting acceptable ejection performance regardless of the type of the nozzle. Thus, according to the present invention, each of the plural types of nozzles includes a bubbling chamber having an ejection energy generating element allowing an ink droplet to be ejected to a position located opposite an ejection port and an ejection port portion allowing the ejection port and the bubbling chamber to communicate with each other. Ratio of opening area of the ejection port portion at a position where the ejection port portion and the bubbling chamber communicate with each other, to the opening area of the ejection port is higher for the nozzle with a smaller ejection amount. | 07-29-2010 |
Patent application number | Description | Published |
20090011532 | PHOTOELECTRIC-CONVERSION APPARATUS AND IMAGE-PICKUP SYSTEM - A photoelectric-conversion apparatus includes a photoelectric-conversion area where a plurality of photoelectric-conversion elements configured to convert incident light into electrical charges, a plurality of floating-diffusion areas, a plurality of transfer-MOS transistors configured to transfer electrical charges of the photoelectric-conversion element to the floating-diffusion area, and a plurality of amplification-MOS transistors configured to read and transmit a signal generated based on the transferred electrical charges to an output line are provided. An antireflection film is provided on a light-receiving surface of the photoelectric-conversion element. The gate of the amplification-MOS transistor is electrically connected to one floating-diffusion area by providing one conductor in a single contact hole, and the anti-reflection film covers the photoelectric-conversion area except a base part of the contact hole. | 01-08-2009 |
20090250778 | PHOTOELECTRIC CONVERSION DEVICE, IMAGING SYSTEM, PHOTOELECTRIC CONVERSION DEVICE DESIGNING METHOD, AND PHOTOELECTRIC CONVERSION DEVICE MANUFACTURING METHOD - A photoelectric conversion device comprises a plurality of photoelectric conversion units, a first antireflection portion including a first insulation film which has a first refractive index and a second insulation film which has a second refractive index, and a second antireflection portion including an element isolation portion which includes an insulator having a third refractive index and a third insulation film which has the second refractive index, wherein the first antireflection portion reduces reflection of light entering the photoelectric conversion unit in the photoelectric conversion unit, and the second antireflection portion reduces reflection of light entering the element isolation portion in the element isolation portion. | 10-08-2009 |
20100173444 | MANUFACTURING METHOD OF A PHOTOELECTRIC CONVERSION DEVICE - A manufacturing method of a photoelectric conversion device comprises a first step of forming a gate electrode, a second step of forming a semiconductor region of a first conductivity type, a third step of forming an insulation film, and a fourth step of forming a protection region of a second conductivity type, which is the opposite conductivity type to the first conductivity type, by implanting ions in the semiconductor region using the gate electrode of the transfer transistor and a portion covering a side face of the gate electrode of the transfer transistor of the insulation film as a mask in a state in which the semiconductor substrate and the gate electrode of the transfer transistor are covered by the insulation film, and causing a portion of the semiconductor region of the first conductivity type from which the protection region is removed to be the charge accumulation region. | 07-08-2010 |
20110171770 | MANUFACTURING METHOD OF A PHOTOELECTRIC CONVERSION DEVICE - A manufacturing method of a photoelectric conversion device included a first step of forming a gate electrode, a second step of forming a semiconductor region of a first conductivity type, a third step of forming an insulation film, and a fourth step of forming a protection region of a second conductivity type, which is the opposite conductivity type to the first conductivity type, by implanting ions in the semiconductor region using the gate electrode of the transfer transistor and a portion covering a side face of the gate electrode of the transfer transistor of the insulation film as a mask in a state in which the semiconductor substrate and the gate electrode of the transfer transistor are covered by the insulation film, and causing a portion of the semiconductor region of the first conductivity type from which the protection region is removed to be the charge accumulation region. | 07-14-2011 |
20110234868 | PHOTOELECTRIC CONVERSION APPARATUS AND IMAGING SYSTEM - A photoelectric conversion apparatus comprises multiple photoelectric conversion portions ( | 09-29-2011 |
20110242388 | IMAGE SENSING DEVICE AND CAMERA - An image sensing device comprises a pixel array, and a peripheral circuit, a column selecting circuit, and a readout, wherein each pixel includes a photodiode, a floating diffusion, a transfer PMOS transistor to the floating diffusion, an amplifier PMOS transistor, and a reset PMOS transistor, the amplifier PMOS transistor has a gate which is formed by an n-type conductive pattern, and is isolated by a first element isolation region and an n-type impurity region which covers at least a lower portion of the first element isolation region, and each PMOS transistor included in the column selecting circuit has a gate which is formed by a p-type conductive pattern and is isolated by a second element isolation region, and an n-type impurity concentration in a region adjacent to a lower portion of the second element isolation region is lower than that in the n-type impurity region. | 10-06-2011 |
20110249163 | PHOTOELECTRIC CONVERSION DEVICE AND CAMERA - A photoelectric conversion device comprises a p-type region, an n-type buried layer formed under the p-type region, an element isolation region, and a channel stop region which covers at least a lower portion of the element isolation region, wherein the p-type region and the buried layer form a photodiode, and a diffusion coefficient of a dominant impurity of the channel stop region is smaller than a diffusion coefficient of a dominant impurity of the buried layer. | 10-13-2011 |
20120181582 | MANUFACTURING METHOD OF A PHOTOELECTRIC CONVERSION DEVICE - A manufacturing method of a photoelectric conversion device comprises a first step of forming a gate electrode, a second step of forming a semiconductor region of a first conductivity type, a third step of forming an insulation film, and a fourth step of forming a protection region of a second conductivity type, which is the opposite conductivity type to the first conductivity type, by implanting ions in the semiconductor region using the gate electrode of the transfer transistor and a portion covering a side face of the gate electrode of the transfer transistor of the insulation film as a mask in a state in which the semiconductor substrate and the gate electrode of the transfer transistor are covered by the insulation film, and causing a portion of the semiconductor region of the first conductivity type from which the protection region is removed to be the charge accumulation region. | 07-19-2012 |
20120199725 | PHOTOELECTRIC CONVERSION ELEMENT, AND PHOTOELECTRIC CONVERSION APPARATUS AND IMAGING SYSTEM USING THE SAME - A light condensing member focuses light, which is incident upon a first area of the light condensing member corresponding to an opening portion of an insulation film, in an upper portion region of a light path member arranged within the opening portion, the insulation film having an upper face extending from the opening portion, and the light path member having a lower face in a region corresponding to a light receiving face of an photoelectric conversion portion. | 08-09-2012 |
20120199893 | SOLID-STATE IMAGE PICKUP APPARATUS, IMAGE PICKUP SYSTEM INCLUDING SOLID-STATE IMAGE PICKUP APPARATUS, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP APPARATUS - A method for manufacturing a solid-state image pickup device is provided. The image pickup apparatus includes a photoelectric conversion portion disposed on the semiconductor substrate, a first insulating film over the photoelectric conversion portion, functioning as an antireflection film, a second insulating film on the first insulating film, disposed corresponding to the photoelectric conversion portion, and a waveguide having a clad and a core whose bottom is disposed on the second insulating film. The method includes forming an opening by anisotropically etching part of a member disposed over the photoelectric conversion portion, thereby forming the clad, and forming the core in the opening. In the method, the etching is performed under conditions where the etching rate of the second insulating film is lower than the etching rate of the member. | 08-09-2012 |
20120199927 | SOLID-STATE IMAGE PICKUP DEVICE AND METHOD OF MAKING THE SAME - A solid-state image pickup device includes a semiconductor substrate in which photoelectric conversion units are arranged. An insulator is disposed on the semiconductor substrate. The insulator has holes associated with the respective photoelectric conversion units. Members are arranged in the respective holes. A light-shielding member is disposed on the opposite side of one of the members from the semiconductor substrate, such that only the associated photoelectric conversion unit is shielded from light. In the solid-state image pickup device, the holes are simultaneously formed and the members are simultaneously formed. | 08-09-2012 |
20120200751 | PHOTOELECTRIC CONVERSION APPARATUS - A photoelectric conversion apparatus includes a semiconductor substrate having a photoelectric conversion portion. An insulator is provided on the semiconductor substrate. The insulator has a hole corresponding to the photoelectric conversion portion. A waveguide member is provided in the hole. An in-layer lens is provided on a side of the waveguide member farther from the semiconductor substrate. A first intermediate member is provided between the waveguide member and the in-layer lens. The first intermediate member has a lower refractive index than the in-layer lens. | 08-09-2012 |
20130099291 | SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREFOR - A solid-state imaging device includes a first and second pixel regions. In the first pixel region, a photoelectric conversion unit, a floating diffusion region (FD), and a transferring transistor are provided. In the second pixel region, an amplifying transistor, and a resetting transistor are provided. A first element isolation portion is provided in the first pixel region, while a second element isolation portion is provided in the second pixel region. An amount of protrusion of an insulating film into a semiconductor substrate in the first element isolation portion is smaller, than that in the second element isolation portion. | 04-25-2013 |
20130105924 | SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD OF SOLID-STATE IMAGING APPARATUS | 05-02-2013 |
20130107075 | SOLID-STATE IMAGING DEVICE AND IMAGING SYSTEM | 05-02-2013 |
20130112854 | SOLID-STATE IMAGING DEVICE - The present invention provides a solid-state imaging device including a first substrate provided with a plurality of photoelectric conversion units thereon, and a second substrate provided with a reading circuit and parallel processing circuits thereon. The solid-state imaging device includes a DC voltage supply wiring configured to supply a DC voltage to the plurality of parallel processing circuits. The DC voltage supply wiring is formed by electrically connecting first conductive patterns provided on the first substrate with second conductive patterns provided on the second substrate. | 05-09-2013 |
20130221197 | PHOTOELECTRIC CONVERSION APPARATUS AND IMAGE PICKUP SYSTEM HAVING PHOTOELECTRIC CONVERSION APPARATUS - A photoelectric conversion apparatus according to one aspect of the present invention includes a first substrate including a photoelectric conversion region and a surrounding region, and a second substrate including a circuit for processing a signal from the photoelectric conversion region, and overlapping the first substrate. In this case, the circuit for processing a signal from the photoelectric conversion region includes a first circuit and a second circuit with a higher drive frequency than that of the first circuit. In an orthogonal projection, the second circuit is only provided in the photoelectric conversion region. | 08-29-2013 |
20130221473 | PHOTOELECTRIC CONVERSION DEVICE, IMAGE PICKUP SYSTEM AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE - A photoelectric conversion device includes a first semiconductor substrate including a photoelectric conversion unit for generating a signal charge in accordance with an incident light, and a second semiconductor substrate including a signal processing unit for processing an electrical signal on the basis of the signal charge generated in the photoelectric conversion unit. The signal processing unit is situated in an orthogonal projection area from the photoelectric conversion unit to the second semiconductor substrate. A multilayer film including a plurality of insulator layers is provided between the first semiconductor substrate and the second semiconductor substrate. The thickness of the second semiconductor substrate is smaller than 500 micrometers. The thickness of the second semiconductor substrate is greater than the distance from the second semiconductor substrate and a light-receiving surface of the first semiconductor substrate. | 08-29-2013 |
20130222657 | SOLID-STATE IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME - A solid-state image sensor includes a semiconductor layer, a multilayer wiring layer, an opening which extends through the semiconductor layer, and reaches an electrically conductive layer in the multilayer wiring layer, an electrically conductive member arranged in the opening so as to be connected to the electrically conductive layer, and a trench which surrounds the opening, and extends through the semiconductor layer, the trench having a space with no solid substance, and the semiconductor layer including a wall portion arranged between a side face defining the opening, and an inner-side face defining the trench to surround the electrically conductive member. | 08-29-2013 |
20140091414 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus includes a conductive member penetrating through a first semiconductor layer, a first insulator layer, and a third insulator layer, and connecting a first conductor layer with a second conductor layer. The conductive member has a first region containing copper, and a second region containing a material different from the copper is located at least between a first region and the first semiconductor layer, between the first region and the first insulator layer, and between the first region and the third insulator layer. A diffusion coefficient of the copper to a material is lower than a diffusion coefficient of the copper to the first semiconductor layer and a diffusion coefficient of the copper to the first insulator layer. | 04-03-2014 |
20140094030 | MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS - A first wiring part has an intermediate layer made of a material different from materials of a first insulator layer and a first conductor layer and located between the first insulator layer and the first conductor layer. In a step of forming a first hole, which penetrates through a first element part and the first insulator layer, from a side of a first semiconductor layer toward the first conductor layer, and forming a second hole, which penetrates through the first element part, the first wiring part, and a second insulator layer, from the side toward the second conductor layer, an etching condition of the first insulator layer when the first hole is formed is that an etching rate for the material of the first insulator layer under the etching condition is higher than an etching rate for the material of the intermediate layer under the etching condition. | 04-03-2014 |
20140160335 | SOLID-STATE IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a solid-state image sensor, includes forming a first isolation region of a first conductivity type in a semiconductor layer having first and second surfaces, the forming the first isolation region including first implantation for implanting ions into the semiconductor layer through the first surface, forming charge accumulation regions of a second conductivity type in the semiconductor layer, performing first annealing, forming an interconnection on a side of the first surface of the semiconductor layer after the first annealing, and forming a second isolation region of the first conductivity type in the semiconductor layer, the forming the second isolation region including second implantation for implanting ions into the semiconductor layer through the second surface. The first and second isolation regions are arranged between the adjacent charge accumulation regions. | 06-12-2014 |
20140168492 | PHOTOELECTRIC CONVERSION DEVICE AND CAMERA - A photoelectric conversion device comprises a p-type region, an n-type buried layer formed under the p-type region, an element isolation region, and a channel stop region which covers at least a lower portion of the element isolation region, wherein the p-type region and the buried layer form a photodiode, and a diffusion coefficient of a dominant impurity of the channel stop region is smaller than a diffusion coefficient of a dominant impurity of the buried layer. | 06-19-2014 |
20140217538 | SOLID-STATE IMAGE SENSOR AND CAMERA - A solid-state image sensor includes a structure having a semiconductor layer in which a plurality of photoelectric converters are arranged, a light blocking member arranged above a face of the structure and including a plurality of circular openings each corresponding to at least one of the photoelectric converters, a first layer configured to cover the light blocking member, and exposed portions of the face of the structure, that are formed by the plurality of circular openings, and a second layer arranged to cover the first layer and having a refractive index higher than that of the first layer, wherein an interface between the first layer and the second layer includes lens faces protruding toward the exposed portions. | 08-07-2014 |
20140306309 | PHOTOELECTRIC CONVERSION APPARATUS - A photoelectric conversion apparatus includes a semiconductor substrate having a photoelectric conversion portion. An insulator is provided on the semiconductor substrate. The insulator has a hole corresponding to the photoelectric conversion portion. A waveguide member is provided in the hole. An in-layer lens is provided on a side of the waveguide member farther from the semiconductor substrate. A first intermediate member is provided between the waveguide member and the in-layer lens. The first intermediate member has a lower refractive index than the in-layer lens. | 10-16-2014 |
20140340541 | SOLID-STATE IMAGING APPARATUS AND CAMERA - A solid-state imaging apparatus which includes a semiconductor portion having a first face on the light incident side and a second face opposite to the first face, and an optical system arranged on the first face, comprising a first semiconductor region of a first conductivity type provided on the second face side in the semiconductor region, a photoelectric conversion portion provided in the semiconductor portion so as to surround the first semiconductor region, including a second semiconductor region of the first conductivity type, and a gate electrode arranged between the first and the second semiconductor regions on the second face, for transferring a charge generated in the photoelectric conversion portion to the first semiconductor region, wherein the optical system is configured so that a light intensity in the second semiconductor region is higher than that in the first semiconductor region. | 11-20-2014 |
20150031162 | PHOTOELECTRIC CONVERSION DEVICE, IMAGE PICKUP SYSTEM AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE - A photoelectric conversion device includes a first semiconductor substrate including a photoelectric conversion unit for generating a signal charge in accordance with an incident light, and a second semiconductor substrate including a signal processing unit for processing an electrical signal on the basis of the signal charge generated in the photoelectric conversion unit. The signal processing unit is situated in an orthogonal projection area from the photoelectric conversion unit to the second semiconductor substrate. A multilayer film including a plurality of insulator layers is provided between the first semiconductor substrate and the second semiconductor substrate. The thickness of the second semiconductor substrate is smaller than 500 micrometers. The thickness of the second semiconductor substrate is greater than the distance from the second semiconductor substrate and a light-receiving surface of the first semiconductor substrate. | 01-29-2015 |
20150076574 | SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREFOR - A solid-state imaging device includes a first and second pixel regions. In the first pixel region, a photoelectric conversion unit, a floating diffusion region (FD), and a transferring transistor are provided. In the second pixel region, an amplifying transistor, and a resetting transistor are provided. A first element isolation portion is provided in the first pixel region, while a second element isolation portion is provided in the second pixel region. An amount of protrusion of an insulating film into a semiconductor substrate in the first element isolation portion is smaller, than that in the second element isolation portion. | 03-19-2015 |
20150118782 | SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD OF SOLID-STATE IMAGING APPARATUS - The first face of the pad is situated between the front-side face of the second semiconductor substrate and a hypothetical plane including and being parallel to the front-side face, and a second face of the pad that is a face on the opposite side of the first face is situated between the first face and the front-side face of the second semiconductor substrate, and wherein the second face is connected to the wiring structure so that the pad is electrically connected to the circuit arranged in the front-side face of the second semiconductor substrate via the wiring structure. | 04-30-2015 |
20150179694 | SOLID-STATE IMAGING APPARATUS - The present invention relates to a solid-state imaging apparatus including a first substrate having a plurality of photoelectric conversion units and a second substrate having a plurality of readout circuits. The first substrate is provided with a plurality of first conductive patterns that are electrically separated from one another and the second substrate is provided with a plurality of second conductive patterns that are electrically separated from one another. The first conductive patterns each include a first partial pattern extending in a first direction. The second conductive patterns each include a partial pattern extending in a second direction different from the first direction. The first partial pattern has a length extending in the first direction longer than a length thereof in the second direction. | 06-25-2015 |
20150179700 | SOLID-STATE IMAGE PICKUP APPARATUS, IMAGE PICKUP SYSTEM INCLUDING SOLID-STATE IMAGE PICKUP APPARATUS, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP APPARATUS - A method for manufacturing a solid-state image pickup device is provided. The image pickup apparatus includes a photoelectric conversion portion disposed on the semiconductor substrate, a first insulating film over the photoelectric conversion portion, functioning as an antireflection film, a second insulating film on the first insulating film, disposed corresponding to the photoelectric conversion portion, and a waveguide having a clad and a core whose bottom is disposed on the second insulating film. The method includes forming an opening by anisotropically etching part of a member disposed over the photoelectric conversion portion, thereby forming the clad, and forming the core in the opening. In the method, the etching is performed under conditions where the etching rate of the second insulating film is lower than the etching rate of the member. | 06-25-2015 |
20150214271 | SOLID-STATE IMAGE PICKUP DEVICE AND METHOD OF MAKING THE SAME - A solid-state image pickup device includes a semiconductor substrate in which photoelectric conversion units are arranged. An insulator is disposed on the semiconductor substrate. The insulator has holes associated with the respective photoelectric conversion units. Members are arranged in the respective holes. A light-shielding member is disposed on the opposite side of one of the members from the semiconductor substrate, such that only the associated photoelectric conversion unit is shielded from light. In the solid-state image pickup device, the holes are simultaneously formed and the members are simultaneously formed. | 07-30-2015 |
20150221687 | PHOTOELECTRIC CONVERSION DEVICE, IMAGE PICKUP SYSTEM AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE - A photoelectric conversion device includes a first semiconductor substrate including a photoelectric conversion unit for generating a signal charge in accordance with an incident light, and a second semiconductor substrate including a signal processing unit for processing an electrical signal on the basis of the signal charge generated in the photoelectric conversion unit. The signal processing unit is situated in an orthogonal projection area from the photoelectric conversion unit to the second semiconductor substrate. A multilayer film including a plurality of insulator layers is provided between the first semiconductor substrate and the second semiconductor substrate. The thickness of the second semiconductor substrate is smaller than 500 micrometers. The thickness of the second semiconductor substrate is greater than the distance from the second semiconductor substrate and a light-receiving surface of the first semiconductor substrate. | 08-06-2015 |
20150264287 | SOLID-STATE IMAGING APPARATUS AND IMAGING SYSTEM - Provided is a solid-state imaging apparatus, including pixels each including: a photoelectric conversion unit; a charge accumulation unit; a transistor including a control electrode; a waveguide; and a light-shielding portion. The waveguide includes an incident portion and an output portion, the light-shielding portion includes a first portion that covers the control electrode of the transistor and a second portion that covers a part of the photoelectric conversion unit, the output portion and the photoelectric conversion unit are arranged with an interval therebetween, the interval between the output portion and the photoelectric conversion unit is larger than an interval between a lower end of the second portion of the light-shielding portion and the photoelectric conversion unit, and the interval between the output portion and the photoelectric conversion unit is smaller than an interval between an upper end of the second portion of the light-shielding portion and the photoelectric conversion unit. | 09-17-2015 |
Patent application number | Description | Published |
20130093909 | IMAGE CAPTURING APPARATUS AND METHOD FOR CONTROLLING IMAGE CAPTURING APPARATUS - Image capturing is performed with an image pickup element being exposed to light, whereby a plurality of pieces of exposure image data are obtained. Image processing is performed on the plurality of pieces of exposure image data. The plurality of pieces of exposure image data output are combined into combined exposure image data. A plurality of pieces of dark image data are obtained and one piece of dark reference image data is generated. Image processing that uses a parameter based on the image processing performed on each exposure image data is performed on the one piece of dark reference image data, whereby a plurality of pieces of processed dark image data are output. The plurality of pieces of processed dark image data are combined into combined dark image data. The combined exposure image data is corrected in accordance with the combined dark image data. | 04-18-2013 |
20130093912 | IMAGE PICKUP APPARATUS AND METHOD FOR CONTROLLING THE SAME - An image pickup apparatus and method which reduces fixed pattern noise appearing in multiple exposure shooting and which can obtain a high-quality multiple exposure image. Multiple pieces of exposure image data are obtained by exposing an image pickup device. The multiple pieces of exposure image data are subjected to image processing. The multiple pieces of image processed exposure image data are synthesized to generate synthesized exposure image data. Multiple pieces of dark image data are obtained by shielding the image pickup device from light. Each of the multiple pieces of dark image data is subjected to image processing equivalent to image processing performed on a corresponding one of the multiple pieces of exposure image data. The multiple pieces of image processed dark image data that are synthesized to generate synthesized dark image data. The synthesized exposure image data is corrected on the basis of the synthesized dark image data. | 04-18-2013 |
20130250154 | IMAGE CAPTURE APPARATUS - This invention includes an image sensor in which image forming pixels and focus detecting pixels which receive light beams from the exit pupil of the imaging lens which is partly light-shielded are arranged, the first vertical output line which outputs a signal from the image forming pixel in the vertical direction of the image sensor, a second vertical output line which outputs a signal from the focus detecting pixel in the vertical direction of the image sensor, a vertical addition unit which adds signals from a plurality of image forming pixels in the vertical direction, and a control unit which controls the vertical addition unit to add only signals from image forming pixels excluding focus detecting pixels, when the focus detecting pixels are included in targets for addition in the addition readout mode of making the vertical addition unit add signals from a plurality of image forming pixels. | 09-26-2013 |
20140016010 | IMAGE SENSOR AND IMAGE CAPTURING APPARATUS - An image sensor comprises a pixel region in which a plurality of pixels are arranged in a row direction and a column direction. An A/D conversion circuit, arranged for each column, which compares an input signal with a ramp signal that changes with temporal unidirectionality, and converts the input signal into digital data. The sensor comprises an amplitude control unit configured to compare the pixel signal with a predefined reference voltage, and input, to the A/D conversion circuit, the pixel signal if the pixel signal has a voltage less than the reference voltage, or a signal obtained by reducing an amplitude of the pixel signal if the pixel signal has a voltage of not less than the reference voltage, and a data expansion unit configured to add a predetermined number of bits to an A/D-converted data | 01-16-2014 |
20140055642 | IMAGE SENSING APPARATUS - An image sensing apparatus comprises an image sensor including a pixel array in which a plurality of pixels are arrayed in matrix, a first storage unit configured to hold an output signal from the pixel, and a second storage unit configured to hold a signal transferred from the first storage unit, wherein signal transfer from the first storage unit to the second storage unit is started during a signal write operation in the first storage unit. | 02-27-2014 |
20140284449 | IMAGING APPARATUS AND METHOD FOR CONTROLLING SAME - An imaging element includes pixel portions each having a first sub-pixel and a second sub-pixel and outputs a phase difference detection-type focus detecting signal. An image signal A includes information for the first sub-pixel and an image signal AB includes information for the second sub-pixel. A level determining unit compares the image signal A with a threshold value SHA and compares the image signal AB with a threshold value SHAB. A correlation calculation processing unit performs correlation calculation for a signal excluding the image signal A having a level exceeding the threshold value SHA and the image signal AB having a level exceeding the threshold value SHAB so as to output the result of calculation to a CPU. The CPU calculates a focal shift amount in accordance with the result of calculation and performs a focus adjusting operation by drive-controlling a focus lens. | 09-25-2014 |
20140285705 | IMAGING APPARATUS AND METHOD FOR CONTROLLING SAME - An imaging apparatus includes an imaging element for outputting focus detecting signals. A DFE performs phase difference detection-type focus detecting calculation using an output signal of the imaging element. A CPU controls a focus drive circuit depending on the result of calculation and a focus lens is driven so as to perform a focus adjusting operation. The CPU controls the DFE to intermittently execute focus detecting calculation at a predetermined frequency set for a plurality of image frames. In the first mode, AF processing is executed at a rate of once in a few frames and the operation of a circuit unit for performing correlation calculation or the like is stopped in a frame period during which no focus detecting calculation is performed, whereas in the second mode, AF processing is executed for each frame so as to perform a focus adjusting operation following the movement of an object. | 09-25-2014 |
20140333816 | IMAGE PICKUP APPARATUS - An image pickup apparatus comprising a pixel configured to convert optical signal into an electrical signal, a comparison unit configured to compare a pixel signal from the pixel with a reference voltage, an A/D conversion unit configured to analog/digital (A/D)-convert the pixel signal in a conversion mode selected based on a comparison result of the comparison unit, and a correction unit configured to correct at least one of an offset and a gain generated by the A/D conversion for an output data of the A/D conversion unit, wherein a value for offset correction or gain correction performed by the correction unit is changed according to the selected conversion mode. | 11-13-2014 |
20140368696 | IMAGE PICKUP APPARATUS, IMAGE PICKUP SYSTEM, SIGNAL PROCESSING METHOD, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM - An image pickup apparatus includes an image pickup element including a plurality of pixels corresponding to a plurality of respective micro lenses and the first photoelectric conversion portion and the second photoelectric conversion portion that are included in each of the pixels and share a corresponding one of the micro lenses, and a signal processing unit configured to correct an addition signal of outputs from the first photoelectric conversion portion and the second photoelectric conversion portion included in each of the pixels and a first signal generated from a plurality of signals of the first photoelectric conversion portions corresponding to the micro lenses, and the signal processing unit corrects the addition signal for each of the pixels and corrects the first signal for the first photoelectric conversion portions. | 12-18-2014 |
20150156428 | IMAGE CAPTURING APPARATUS AND MOBILE TELEPHONE - There is provided an image capturing apparatus capable of controlling focus detecting pixels independently of the remaining image capturing pixels while maintaining the sensitivity of an image sensor and obtaining high image quality. The image capturing apparatus includes a first semiconductor chip, and a second semiconductor chip stacked on the first semiconductor chip. On the first semiconductor chip, the light receiving sections of a first pixel group and second pixel group, and a first pixel driving circuit configured to drive the pixels of the first pixel group are arranged. On the second semiconductor chip, a second pixel driving circuit configured to drive the pixels of the second pixel group is arranged. | 06-04-2015 |
20150163433 | IMAGE SENSOR, IMAGE CAPTURING APPARATUS AND CELLULAR PHONE - An image sensor comprises: a plurality of pixels; a first reference signal generator configured to output a first reference signal whose signal level changes with time; a second reference signal generator configured to output a second reference signal whose signal level changes with time, a rate of change of the signal level of the second reference signal being larger than that of the first reference signal; an analog-to-digital converter configured to perform an analog-digital conversion of a pixel signal output from each of the plurality of pixels using the first reference signal or the second reference signal selected in accordance with a magnitude of the pixel signal, wherein the plurality of pixels and the first reference signal generator are arranged in a first chip, and the second reference signal generator is arranged in a second chip. | 06-11-2015 |
Patent application number | Description | Published |
20100148596 | MOTOR, PUMP, AND METHOD OF MANUFACTURING THE MOTOR - An electric motor in which the cost of parts and the cost of processing are reduced by installing a fan cover, a capacitor installation box, and a foot plate on a molded stator without addition of installation parts. In the electric motor ( | 06-17-2010 |
20100264757 | MOTOR STATOR, MOTOR, PUMP, AND METHOD OF MANUFACTURING THE MOTOR - An objective is to provide a motor stator that may achieve: a reduction in parts costs by shaping coil ends so that length thereof is reduced, thereby reducing the amount of use of copper, and minimizing the amount of use of binding strings for securing the coil ends in place; a reduction in manufacturing process costs by a structure which allows a protector and a wire lead outlet part to be easily assembled; and then an improvement in quality of a stator by firmly holding the coil ends and the protector. The motor stator may include a stator core | 10-21-2010 |
20100320848 | MOTOR, PUMP, AND METHOD OF MANUFACTURING THE MOTOR - An object is to provide a motor that is designed to reduce the parts costs and the processing costs, without additional parts for fixing, by incorporating a fan cover, a condenser assembly box, and a foot plate into a molded stator. A motor | 12-23-2010 |
20110083828 | WATER CIRCULATING PUMP, MANUFACTURING METHOD THEREOF, AND HEAT PUMP APPARATUS - A highly efficient, long-life water circulating pump with reduced whirling of a rotor part of the pump is provided. At least one of a gap between an end portion of a shaft | 04-14-2011 |
20120025746 | MOTOR, ELECTRIC EQUIPMENT, AND METHOD OF MANUFACTURING MOTOR - In a motor driven by a drive circuit such as an inverter, there is a problem that electric current flowing through a bearing causes electric corrosion, which impairs the durability of the bearing. A motor of the invention includes: a stator in which a winding is applied through an insulating part to a stator core formed by laminating a predetermined number of electromagnetic steel plates which have been punched into a predetermined shape; a rotor assembly in which a rotor and bearings and formed by rolling bearings are fitted to a shaft; a printed wiring board which is arranged at an end part of the stator in an axial direction and to which a drive circuit is mounted; a bracket imposed to at least the end part of the stator in the axial direction to which the printed wiring board is arranged; and a conductive sheet provided between the printed wiring board and the bracket. | 02-02-2012 |
20130175012 | POWER CONVERSION DEVICE, MOTOR INCLUDING THE SAME, AIR CONDITIONER HAVING THE MOTOR INCORPORATED THEREIN, AND VENTILATION FAN HAVING THE MOTOR INCORPORATED THEREIN - A power conversion device includes a printed circuit board, whose mounting surface is opposite to an annular surface formed by an annular stator that constitutes a motor, arranged to be separated from the annular surface with a predetermined distance, and mounted with a Hall element that detects a rotation position of a rotor of the motor on a mounting surface on a side of the stator; an inverter IC that is mounted on the mounting surface on the side of the stator of the printed circuit board to supply a high-frequency current to the stator; and an overheat detection unit that is mounted on the mounting surface on the side of the stator of the printed circuit board and detects an overheated state of the inverter IC. When the overheat detection unit detects an overheated state, the inverter IC restricts or stops a current to be supplied to the stator. | 07-11-2013 |
20130285482 | ROTOR OF ELECTRIC MOTOR, MOLD MOTOR, AIR CONDITIONER, AND METHOD OF MANUFACTURING THE MOLD MOTOR - A rotor resin assembly of a rotor of an electric motor includes a rotor magnet including a substantially cylindrical yoke molded from thermoplastic resin containing a soft magnetic material or ferrite and a resin magnet integrally formed in the outer circumference of the yoke, a position detection magnet arranged at one end in the axial direction of the rotor magnet, and a substantially doughnut-like rotor core arranged in the inner circumference of the rotor magnet and formed by laminating a predetermined number of electromagnetic steel plates. The rotor magnet, the position detection magnet, and the rotor core are integrally formed by resin. A shaft is inserted into an inner diameter section of the rotor core, and the rotor resin assembly is caulked by a jig to form a recess in the vicinity of the inner diameter sections of both end faces of the rotor core and assembled to the shaft. | 10-31-2013 |
20130293036 | MOLD MOTOR AND AIR CONDITIONER - A mold motor includes a mold stator, a rotor, and a bracket. The mold stator includes a first bearing housing section formed of thermosetting resin, one bearing of the rotor fitting in one end in an axial direction of the first bearing housing section, an opening section formed at an end on the opposite side of the bearing housing section, and a bracket press-fitting section formed near the opening section and having a diameter larger than a stator inner diameter. The bracket includes a bracket resin section configuring a second bearing housing section in which the other bearing of the rotor fits and a bracket sheet metal section press-fit into the bracket press-fitting section of the mold stator. In the bracket, the bracket resin section and the bracket sheet metal section are integrally molded. | 11-07-2013 |
20140294626 | PUMP, REFRIGERATION CYCLE DEVICE, AND METHOD OF PRODUCING PUMP - In a pump, at least one of leg portions of a pilot hole component are extended by a specified distance compared to the other leg portions toward a side opposite to a surface where pilot holes are exposed, and the pilot holes formed in the some leg portions extend through the some leg portions between end planes of the some leg portions and are exposed in the other end plane of the molded stator, the other end plane located at the other end in the axial direction. | 10-02-2014 |
20150033787 | PUMP, REFRIGERATION CYCLE APPARATUS, AND METHOD FOR MANUFACTURING PUMP - In a pump, a resin magnet included in a rotor portion has a plurality of groove portions in an outer peripheral portion thereof, the groove portions extending in an axial direction. | 02-05-2015 |
20150052934 | PUMP, REFRIGERATION CYCLE APPARATUS, AND METHOD FOR MANUFACTURING PUMP - A resin magnet, a magnetic pole position detection resin magnet, and a sleeve bearing, which is disposed inside the resin magnet, are integrally molded together with a thermoplastic resin in a rotor portion. At the same time, an impeller attachment portion is formed by the thermoplastic resin. | 02-26-2015 |
20150052935 | PUMP, REFRIGERATION CYCLE APPARATUS, AND METHOD FOR MANUFACTURING PUMP - In a rotor portion, a magnet formed in a cylindrical shape, a first magnet holder that holds an impeller-attachment-portion-side end portion of the magnet, a second magnet holder that holds a magnetic-pole-position-detection-element-side end portion of the magnet, a back yoke disposed inside the magnet, a sleeve bearing disposed inside the back yoke, and a position detection magnet that is provided on a surface of the second magnet holder at a side opposite to the side at which the magnet is attached and allows a magnetic flux of the position detection magnet to be detected by the magnetic-pole-position detection element are assembled integrally together with a thermoplastic resin, and the impeller attachment portion is formed of the thermoplastic resin. | 02-26-2015 |
20150121948 | PUMP, METHOD FOR MANUFACTURING PUMP, AND REFRIGERATION CYCLE DEVICE - Provided is a pump that includes an annular molded stator having a substrate mounted with a Hall element and that includes a rotor having an annular rotor unit rotatably housed in a cup-shaped partition component, with one end thereof in an axial direction facing the Hall element and the other end thereof in the axial direction provided with an impeller attachment unit. The rotor unit includes a resin magnet, a sleeve bearing, and a resin portion. The resin magnet includes a rotor-position detecting magnetic-pole portion protruding axially with a predetermined height in an annular shape having a predetermined width in a radial direction on an outer periphery of an end face opposite to the Hall element. The rotor-position detecting magnetic-pole portion includes a plurality of arc-shaped notches on the same circumference on an inner diameter side thereof. | 05-07-2015 |
20150159656 | PUMP, METHOD FOR MANUFACTURING PUMP, AND REFRIGERATION CYCLE DEVICE - A pump is provided that includes a molded stator having a substrate on which is mounted a magnetic-pole position detection element and that also includes a rotor having a rotor unit with one end thereof in an axial direction being opposed to the magnetic-pole position detection element and the other end thereof in the axial direction being provided with an impeller attachment unit. The rotor unit includes a magnet, a sleeve bearing, and a resin portion formed from a thermoplastic resin that is used for integrally molding the magnet and the sleeve bearing and that constitutes the impeller attachment unit. The magnet includes a plurality of through holes that each extend in the axial direction; and each of the through holes is embedded in the thermoplastic resin that constitutes a part of the resin portion. | 06-11-2015 |
20150236561 | MOTOR, PUMP, AND METHOD FOR MANUFACTURING THE MOTOR - A motor includes a molded stator; a cooling fan assembled to an end of a shaft protruding from one end face of the molded stator; a fan cover that covers the cooling fan; a capacitor assembly box installed to the molded stator and having a capacitor incorporated therein; a foot plate installed to the molded stator; and a bracket provided on the other end side of the molded stator. The fan cover is formed with a latched to the capacitor assembly box and a claw latched to the foot plate; and holes and to which the claws are latched are formed on the capacitor assembly box and the foot plate, respectively. | 08-20-2015 |
20150263581 | MOLDED MOTOR AND AIR CONDITIONER - A molded motor made by molding, with a thermosetting resin, a stator, which includes: a stator core formed by stacking magnetic steel plates; an insulation portion applied to the stator core; a winding applied to the insulation portion; and a power supply terminal. On an insulation inner wall provided on an inner diameter side of the insulation portion, a plurality of inner wall protrusions formed at axial ends of the insulation inner wall on a counter wire-connection side of the stator core and abutting on a die, used when the stator is molded, are provided in a circumferential direction of the stator core. | 09-17-2015 |