Patent application number | Description | Published |
20090116190 | Controlling Airflow In A Computer Chassis - Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain. | 05-07-2009 |
20110044008 | TOP ACTUATED, FORCE LIMITING HEATSINK RETENTION SYSTEM - Apparatus for securing or retaining a heatsink. The heatsink retention apparatus includes a heatsink module that cooperates with first and second spring loaded latches secure to a circuit board on opposing sides of a heat-generating component. The heatsink module includes a handle pivotally secured to opposing sides of the heatsink body, and bails pivotally secured to the handle. In addition, the bails extend downward to dispose a lower bail member adjacent the spring loaded latches. As the handle pivots between a first position to raise the bails and a second position to lower the bails, the bails automatically move from a locked position to an unlocked position. Each of the spring loaded latches include a hook and at least one pre-loaded spring to transfer a minimum downforce to the lower bail members when the bails are raised. Accordingly, embodiments may be operated from the top of the heatsink without the use of tools, while providing a desired downforce over a range of heatsink heights. | 02-24-2011 |
20110250047 | Airflow From A Blower With One Or More Adjustable Guide Vanes That Are Affixed To The Blower At One Or More Pivot Points Located In An Outlet Of The Blower - Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller. | 10-13-2011 |
20110250048 | Airflow From A Blower With One Or More Adjustable Guide Vanes That Are Affixed To The Blower At One Or More Pivot Points Located In An Outlet Of The Blower - Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller. | 10-13-2011 |
20110250049 | Airflow From A Blower With One Or More Adjustable Guide Vanes That Are Affixed To The Blower At One Or More Pivot Points Located In An Outlet Of The Blower - Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller. | 10-13-2011 |
20110292593 | INDEPENDENTLY OPERABLE IONIC AIR MOVING DEVICES FOR ZONAL CONTROL OF AIR FLOW THROUGH A CHASSIS - Airflow in a computer chassis may be enhanced or reduced to affect cooling of heat generating devices using an ionic air moving device. A plurality of ionic air moving devices enhance or reduce airflow through a plurality of fluidically parallel airflow zones of the computer chassis in an airflow direction established by a nonionic air moving device. Each ionic air moving device comprises an ion emitter electrode disposed a spaced distance from a collector electrode, wherein a controller independently controls an electrical potential between the emitter and collector electrodes of each ionic air moving device for affecting the rate of airflow through one or more of the plurality of airflow zones. | 12-01-2011 |
20120036998 | ELECTROSTATIC CONTROL OF AIR FLOW TO THE INLET OPENING OF AN AXIAL FAN - An air moving apparatus comprises an axial fan and an electrostatic device. The axial fan has a rotatable shaft defining a central axis of the axial fan, a plurality of blades secured to the shaft, and an air inlet opening. The electrostatic device is disposed immediately upstream of the air inlet opening of the axial fan, and includes a collector and an emitter. In one embodiment, the electrostatic device comprises a cylindrical collector coupled to ground and has a central axis aligned with the central axis of the axial fan, wherein the cylindrical collector has an inner diameter that is substantially the same as the diameter of an air inlet opening to the axial fan. The electrostatic device further comprises a plurality of emitter wires coupled to a terminal of a direct current source and extending lengthwise within the cylindrical collector. The axial fan moves air longitudinally through an air inlet opening of the axial fan, and, during operation of the axial fan, the application of an electrical potential between an emitter and a collector causes ionic air movement radially outwardly away from a central axis of the axial fan. | 02-16-2012 |
20130133859 | HEAT SINK WITH HEAT BUS AND FIN STRUCTURE - A heat sink to remove heat from a processor within a chassis to air moving through a fin structure on the heat sink. An embodiment of the heat sink comprises a heat bus engaging the processor to conduct heat from the processor to a fin structure having interconnected, repeating cellular air channels. A U-shaped heat bus comprises a base and first and second legs extending therefrom connected to opposite sides of the fin structure. An embodiment of the heat bus has a solid conductive core to conductively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. Alternately, an embodiment of the heat bus has a hollow core containing a fluid to evaporatively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. | 05-30-2013 |
20130138262 | HEAT SINK WITH ORIENTABLE FINS - A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member. | 05-30-2013 |
20130145612 | HEAT SINK FIN STRUCTURE BLOCKING ELECTROMAGNETIC RADIATION - A system to remove heat from a heat-generating electronic component within a computer chassis and to contain electromagnetic radiation from traversing high-throughput vents in a bezel that forms a portion of the chassis containment structure comprises a heat sink having a fin structure with an inlet face, an outlet face and interconnected air channels therethrough, a base to engage the component and to transfer heat from the component to the fin structure, wherein the inlet face of the fin structure is disposed proximate the vents to block electromagnetic radiation from traversing the vents. In one embodiment, a heat pipe or a spreader bar moves heat from a base engaging a component distal from the bezel to the fin structure having an air inlet face proximal to the vents. | 06-13-2013 |
20130153199 | PERFORMANCE AND NOISE CONTROL FOR A HEAT SINK AIR MOVER - A system and method for cooling a heat-generating device. The system comprises a heat sink base for contacting the heat-generating device, and a plurality of heat sink fins extending from the heat sink base, wherein the fins provide airflow passages that are open along a top, a first side and a second side. An ionic air moving device is disposed along at least one side of the heat sink for moving air through the airflow passages, and a fan is mounted adjacent to the top of the fins for moving air through the airflow passages. A controller selectively controls the airflow through the heat sink using only the ionic device, only the fan, or both the ionic device and the fan. A user or a system component may instruct the controller to enter a performance mode, an energy efficiency mode, or an acoustic mode. | 06-20-2013 |
20130177391 | ELECTROSTATIC CONTROL OF AIR FLOW TO THE INLET OPENING OF AN AXIAL FAN - A method of modifying the airflow to the inlet of an axial fan comprises operating an axial fan to move air longitudinally through an air inlet opening of the axial fan, and, during operation of the axial fan, applying an electrical potential between an emitter and a collector to cause ionic air movement radially outwardly away from a central axis of the axial fan, wherein the radially outward air movement is caused upstream of the axial fan before the air reaches the air inlet opening. | 07-11-2013 |
20140230234 | ELECTROHYDRODYNAMIC AIRFLOW ACROSS A HEAT SINK USING A NON-PLANAR ION EMITTER ARRAY - A method of cooling a heat generating device includes positioning a base of an electronically conductive heat sink in thermal communication with a heat generating device, wherein the heat sink includes a plurality of fins extending in a longitudinal direction from a first end to a second end, and coupling the heat sink to ground. The method further includes emitting ions from a plurality of ion emitter elements disposed in a non-planar pattern along the first ends of the plurality of fins, wherein at least three ion emitter elements are equidistant from the first end of the nearest fin and are positioned in an arc having an axis that extends along the first end of the nearest fin. | 08-21-2014 |